Improved impact strength of poly(lactic acid) by incorporating poly(butylene succinate) and silicon dioxide nanoparticles

Ionic Liquid-Modified Copper for the Enhanced Thermal Conductivity and Mechanical Properties of Epoxy Resin/Expanded Graphite Composites

In this study, diglycidylether of bisphenol A (DGEBA)/expanded graphite (EG)/copper (Cu) powder composites with high thermal conductivity were prepared for use as thermal interface materials. To construct an excellent thermally conductive network, the Cu surface was modified using the ionic liquid 1-ethyl-3-methyl imidazolium dicyanamide. In addition, the effect of the Cu content on the thermal conductivity, thermal stability, flexural properties, impact strength, and morphologies of the DGEBA/EG/Cu composites was investigated. The results indicated that the addition of 10 wt % Cu increased the thermal conductivity of the composites from 7.35 to 9.86 W/(m·K). Conversely, the thermal stability of the composites decreased with the addition of Cu. The flexural strength and impact strength of the composites increased from 27.9 MPa and 0.81 kJ/m2 to 39.6 MPa and 0.96 kJ/m2, respectively, as the Cu content increased from 0 to 10 wt %. Moreover, the flexural modulus of the composites increased from 9632 to 11,309 MPa with the addition of 10 wt % Cu. Scanning electron microscopy analysis of the DGEBA/EG/Cu composites revealed sheet-shaped blocks with numerous microcracks on the fracture surfaces.

Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

Epoxy resin is extensively applied in the electronics and electrical fields because of its outstanding comprehensive performance. However, the low thermal conductivity (TC) limits its application in thermal interface materials. In the present work, epoxy-based hybrid composites with high TC were prepared by using expanded graphite (EG) and copper (Cu) nanoparticles as thermally conductive hybrid fillers via hot blending and compression-curing processes. Additionally, the influence of the Cu content on the thermal properties, mechanical properties, and morphology of each epoxy/EG/Cu composite was investigated. According to the results, the epoxy/EG/Cu composite showed a maximum TC of 9.74 W/(m·K) at a fixed EG content of 60 wt % owing to the addition of 10 wt % Cu. After the addition of 10 wt % Cu, the flexural strength, flexural modulus, and impact strengths of epoxy/EG/Cu composites were improved from 27.9 MPa, 9.72 GPa, and 0.81 kJ/m2 to 37.5 MPa, 10.88 GPa, and 0.91 kJ/m2, respectively. Hence, this study offers a feasible strategy for the design of epoxy hybrid composites with excellent TC that can be applied to thermal interface materials.

Enhanced Electrical Properties and Impact Strength of Phenolic Formaldehyde Resin Using Silanized Graphene and Ionic Liquid

In this study, to improve the electrical properties and impact strength of phenolic formaldehyde (PF) resin, PF-based composites were prepared by mixing graphene and the ionic liquid 3-decyl-bis(1-vinyl-1H-imidazole-3-ium-bromide) (C10[VImBr]2) via hot blending and compression-curing processes. The graphene surface was modified using a silane coupling agent. The synergistic effect of graphene and C10[VImBr]2 on the electrical properties, electromagnetic shielding efficiency, thermal stability, impact strength, and morphology of PF/graphene and PF/graphene/C10[VImBr]2 composites was then investigated. It was found that the electrical conductivity of the composites significantly increased from 2.3 × 10-10 to 4.14 × 10-3 S/m with an increase in the graphene content from 0 to 15 wt %, increasing further to 0.145 S/m with the addition of 5 wt % C10[VImBr]2. The electromagnetic shielding efficiency of the composite increased from 4.70 to 28.64 dB with the addition of 15 wt % graphene, while the impact strength of the composites rose significantly from 0.59 to 1.13 kJ/m2 with an increase in the graphene content from 0 to 15 wt %, reaching 1.53 kJ/m2 with the addition of 5 wt % C10[VImBr]2. Scanning electron microscopy images of the PF/GNP/C10[VImBr]2 composites revealed a rough morphology with numerous microcracks.