Transparent fluorinated poly(imide siloxane) copolymers with good adhesivity

Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation

Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more severe temperature applications have become the trend according to the development of electronic device industry, insulating materials with improved heat resistance and insulation performances should be developed. In this study, we intended to synthesize a new insulating material with enhanced thermal stability and reduced thermal conductivity. Poly(imide-siloxane) (PIS) was prepared and crosslinked through a hydrosilylation reaction to obtain a semi-solid Crosslinked PIS. Thermal decomposition temperature, thermal conductivity, optical transparency, dielectric constant, and rheological property of the Crosslinked PIS were investigated and compared to those of a commercial silicone gel. The Crosslinked PIS showed high thermal stability and low thermal conductivity, along with other desirable properties, and so could be useful as an IGBT-insulating material.

Thermal degradation kinetics of transparent fluorinated poly(imide siloxane) copolymers

Fluorinated polyimide films are widely used in the field of flexible display because of their excellent optical transmittance. Based on previous studies, the adhesion to other substrates of fluorinated polyimide films have been improved by incorporating GAPD into the macromolecular chains, but their heat resistance is not yet very clear. In this study, thermal behaviors of fluorinated polyimide films (PIs) with and without GAPD were studied in N2 ambient and atmosphere by TG-DTG analysis under non-isothermal conditions. Activation energies (Eas) of PIs were calculated by Flynn-Wall-Ozawa method, Kissinger-Akahira-Sunose method and Kissinger method. In addition, mechanisms of thermal decomposition reaction were determined by Coats-Redfern method. By comparison, the Eas of PIs in the same atmosphere were similar and the thermal reaction mechanisms were essentially the same, indicating that adhesion of fluorinated polyimide can be improved by adding appropriate amount of GAPD, while the excellent optical permeability and heat resistance of fluorinated polyimide can be maintained, further expanding its application in flexible display and other fields.

Preparation and properties of propargyl ether-terminated poly(imide siloxane)s and their composites

The novel propargyl ether-terminated oligo(imide siloxane)s (PTISs) based on 2,2’-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), aminopropyl-terminated polydimethylsiloxane (APPS), 4,4’-diaminodiphenylmethane (MDA) and p-aminophenyl propargyl ether (APPE) were synthesized. The chemical structures of PTISs were characterized by proton nuclear magnetic resonance (1H NMR) and Fourier transform infrared spectroscopy (FTIR). The PTISs exhibited excellent solubility in organic solvent and had broad processing window. The T300 carbon fabric was used to reinforce the PTIS matrices and prepare the composites (T300CF/PTISs). The thermal stability of the cured PTISs was analyzed by thermogravimetric analysis (TGA). The dynamic thermal mechanical properties of the composites were measured by dynamic thermomechanical analysis (DMA). The results show that the temperature at 5% weight loss (Td5) and residual yield at 800°C (Yr800°C) of the cured PTISs in N2 increase with incorporation of the aromatic diamine, whereas the Yr800°C of the cured PTISs in air decreases with introduction of the aromatic diamine. The elasticity of the composite increases with incorporation of the aromatic diamine, and the peak temperature of loss factor for the composites are higher than 300°C. The flexural strength, tensile strength and interlaminar layer shear strength (ILSS) of the T300CF/PTIS composite display the values of 439 MPa, 427 MPa and 32 MPa at room temperature, respectively. The retention of the flexural strength and ILSS for the T300CF/PTIS composite are above 80% at 250°C.

Polyimide/mica hybrid films with low coefficient of thermal expansion and low dielectric constant

Polyimide (PI)/mica hybrid films were successfully prepared by in situ condensation polymerization method, in which the mica particles were modified by coupling agent γ-aminopropyltriethoxy silane (APTS) to strengthen the interaction between the mica particles and PI matrix. The morphology, structure, thermal and mechanical properties as well as dielectric properties of PI films were systematically studied via Scanning electron microscope (SEM), Fourier transform infrared spectrometer (FT-IR spectrometer), Thermal gravimetric analysis (TGA), tensile experiments, Thermal mechanical analyzer (TMA), impedance analyzer, etc. The results indicated that the mica particles were dispersed homogeneously in PI matrix, leading to an improvement of the mechanical property, thermal stability and hydrophobicity. It was novel to notice that hybrid films exhibited low coefficient of thermal expansion (CTE) and low dielectric constant simultaneously. The CTE and dielectric constant of hybrid film dropped to 25.36 ppm/k and 2.42 respectively, in the presence of 10 wt% mica into polyimide matrix.