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For: Kim J, Jung H, Kim M, Bae H, Lee Y. Conductive Polymer Composites for Soft Tactile Sensors. Macromol Res 2021. [DOI: 10.1007/s13233-021-9092-6] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
Number Cited by Other Article(s)
1
Guo X, Sun Y, Sun X, Li J, Wu J, Shi Y, Pan L. Doping Engineering of Conductive Polymers and Their Application in Physical Sensors for Healthcare Monitoring. Macromol Rapid Commun 2024;45:e2300246. [PMID: 37534567 DOI: 10.1002/marc.202300246] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/29/2023] [Revised: 06/17/2023] [Indexed: 08/04/2023]
2
Lee GH, Kim K, Kim Y, Yang J, Choi MK. Recent Advances in Patterning Strategies for Full-Color Perovskite Light-Emitting Diodes. NANO-MICRO LETTERS 2023;16:45. [PMID: 38060071 DOI: 10.1007/s40820-023-01254-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/30/2023] [Accepted: 10/19/2023] [Indexed: 12/08/2023]
3
Choi K, Noh A, Kim J, Hong PH, Ko MJ, Hong SW. Properties and Applications of Self-Healing Polymeric Materials: A Review. Polymers (Basel) 2023;15:4408. [PMID: 38006132 PMCID: PMC10674826 DOI: 10.3390/polym15224408] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/23/2023] [Revised: 10/29/2023] [Accepted: 11/08/2023] [Indexed: 11/26/2023]  Open
4
Liu YF, Wang W, Chen XF. Progress and prospects in flexible tactile sensors. Front Bioeng Biotechnol 2023;11:1264563. [PMID: 37829569 PMCID: PMC10565956 DOI: 10.3389/fbioe.2023.1264563] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/21/2023] [Accepted: 09/11/2023] [Indexed: 10/14/2023]  Open
5
Yoon J, Kim S, Park KH, Lee S, Kim SJ, Lee H, Oh T, Koo CM. Biocompatible and Oxidation-Resistant Ti3 C2 Tx MXene with Halogen-Free Surface Terminations. SMALL METHODS 2023;7:e2201579. [PMID: 36929585 DOI: 10.1002/smtd.202201579] [Citation(s) in RCA: 3] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/28/2022] [Revised: 02/14/2023] [Indexed: 06/18/2023]
6
Lian JJ, Guo WT, Sun QJ. Emerging Functional Polymer Composites for Tactile Sensing. MATERIALS (BASEL, SWITZERLAND) 2023;16:4310. [PMID: 37374494 DOI: 10.3390/ma16124310] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/11/2023] [Revised: 06/01/2023] [Accepted: 06/07/2023] [Indexed: 06/29/2023]
7
Kim J, Kim M, Jung H, Park J, Jun BO, Kang B, Jang JE, Lee Y. High-Quality Microprintable and Stretchable Conductors for High-Performance 5G Wireless Communication. ACS APPLIED MATERIALS & INTERFACES 2022;14:53250-53260. [PMID: 36382782 DOI: 10.1021/acsami.2c18424] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
8
Srivastava R, Alsamhi SH, Murray N, Devine D. Shape Memory Alloy-Based Wearables: A Review, and Conceptual Frameworks on HCI and HRI in Industry 4.0. SENSORS (BASEL, SWITZERLAND) 2022;22:s22186802. [PMID: 36146151 PMCID: PMC9504003 DOI: 10.3390/s22186802] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/18/2022] [Revised: 08/22/2022] [Accepted: 08/25/2022] [Indexed: 05/10/2023]
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