Highly Thermally Conductive Polymer/Graphene Composites with Rapid Room-Temperature Self-Healing Capacity

Consistent Thermal Conductivities of Spring-Like Structured Polydimethylsiloxane Composites under Large Deformation

Flexible and highly thermally conductive materials with consistent thermal conductivity (λ) during large deformation are urgently required to address the heat accumulation in flexible electronics. In this study, spring-like thermal conduction pathways of silver nanowire (S-AgNW) fabricated by 3D printing are compounded with polydimethylsiloxane (PDMS) to prepare S-AgNW/PDMS composites with excellent and consistent λ during deformation. The S-AgNW/PDMS composites exhibit a λ of 7.63 W m-1 K-1 at an AgNW amount of 20 vol%, which is ≈42 times that of PDMS (0.18 W m-1 K-1) and higher than that of AgNW/PDMS composites with the same amount and random dispersion of AgNW (R-AgNW/PDMS) (5.37 W m-1 K-1). Variations in the λ of 20 vol% S-AgNW/PDMS composites are less than 2% under a deformation of 200% elongation, 50% compression, or 180° bending, which benefits from the large deformation characteristics of S-AgNW. The heat-transfer coefficient (0.29 W cm-2 K-1) of 20 vol% S-AgNW/PDMS composites is ≈1.3 times that of the 20 vol% R-AgNW/PDMS composites, which reduces the temperature of a full-stressed central processing unit by 6.8 °C compared to that using the 20 vol% R-AgNW/PDMS composites as a thermally conductive material in the central processing unit.

Thermally Conductive and UV-EMI Shielding Electronic Textiles for Unrestricted and Multifaceted Health Monitoring

Skin-attachable electronics have garnered considerable research attention in health monitoring and artificial intelligence domains, whereas susceptibility to electromagnetic interference (EMI), heat accumulation issues, and ultraviolet (UV)-induced aging problems pose significant constraints on their potential applications. Here, an ultra-elastic, highly breathable, and thermal-comfortable epidermal sensor with exceptional UV-EMI shielding performance and remarkable thermal conductivity is developed for high-fidelity monitoring of multiple human electrophysiological signals. Via filling the elastomeric microfibers with thermally conductive boron nitride nanoparticles and bridging the insulating fiber interfaces by plating Ag nanoparticles (NPs), an interwoven thermal conducting fiber network (0.72 W m-1 K-1) is constructed benefiting from the seamless thermal interfaces, facilitating unimpeded heat dissipation for comfort skin wearing. More excitingly, the elastomeric fiber substrates simultaneously achieve outstanding UV protection (UPF = 143.1) and EMI shielding (SET > 65, X-band) capabilities owing to the high electrical conductivity and surface plasmon resonance of Ag NPs. Furthermore, an electronic textile prepared by printing liquid metal on the UV-EMI shielding and thermally conductive nonwoven textile is finally utilized as an advanced epidermal sensor, which succeeds in monitoring different electrophysiological signals under vigorous electromagnetic interference. This research paves the way for developing protective and environmentally adaptive epidermal electronics for next-generation health regulation.

Soft and Damping Thermal Interface Materials with Honeycomb-Board-Mimetic Filler Network for Electronic Heat Dissipation

High-power-density electronic devices under vibrations call for soft and damping thermal interface materials (TIMs) for efficient heat dissipation. However, integrating low hardness, high damping, and superior heat transfer capability into one TIM is highly challenging. Herein, soft, damping, and thermally conductive TIMs are designed and prepared by constructing a honeycomb-board-mimetic boron nitride nanosheet (BNNS) network in a dynamic polyimine via one-step horizontal centrifugal casting. The unique filler network makes the TIMs perform a high through-plane thermal conductivity (> 7.69 W m-1 K-1) and a uniform heat transfer process. Meanwhile, the hierarchical dynamic bonding of the polyimine endows the TIMs with low compressive strength (2.16 MPa at 20% strain) and excellent damping performance (tan δ > ≈0.3 at 10-2-102 Hz). The resulting TIMs also exhibit electrical insulation and remarkable recycling ability. Compared with the commercial ones, the TIMs provide better heat dissipation (4.1 °C) for a high-power 5G base station and less temperature fluctuation (1.8 °C) for an automotive insulated gate bipolar transistor (IGBT) under vibrations. This rational design offers a viable approach to prepare soft and damping TIMs for effective heat dissipation of high-power-density electronic devices under vibrations.

New Carbon Materials for Multifunctional Soft Electronics

Soft electronics are garnering significant attention due to their wide-ranging applications in artificial skin, health monitoring, human-machine interaction, artificial intelligence, and the Internet of Things. Various soft physical sensors such as mechanical sensors, temperature sensors, and humidity sensors are the fundamental building blocks for soft electronics. While the fast growth and widespread utilization of electronic devices have elevated life quality, the consequential electromagnetic interference (EMI) and radiation pose potential threats to device precision and human health. Another substantial concern pertains to overheating issues that occur during prolonged operation. Therefore, the design of multifunctional soft electronics exhibiting excellent capabilities in sensing, EMI shielding, and thermal management is of paramount importance. Because of the prominent advantages in chemical stability, electrical and thermal conductivity, and easy functionalization, new carbon materials including carbon nanotubes, graphene and its derivatives, graphdiyne, and sustainable natural-biomass-derived carbon are particularly promising candidates for multifunctional soft electronics. This review summarizes the latest advancements in multifunctional soft electronics based on new carbon materials across a range of performance aspects, mainly focusing on the structure or composite design, and fabrication method on the physical signals monitoring, EMI shielding, and thermal management. Furthermore, the device integration strategies and corresponding intriguing applications are highlighted. Finally, this review presents prospects aimed at overcoming current barriers and advancing the development of state-of-the-art multifunctional soft electronics.

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

Effective heat dissipation and real-time temperature monitoring are crucial for ensuring the long-term stable operation of modern, high-performance electronic products. This study proposes a silicon rubber polydimethylsiloxane (PDMS)-based nanocomposite with a rapid thermal response and high thermal conductivity. This nanocomposite enables both rapid heat dissipation and real-time temperature monitoring for high-performance electronic products. The reported material primarily consists of a thermally conductive layer (Al2O3/PDMS composites) and a reversible thermochromic layer (organic thermochromic material, graphene oxide, and PDMS nanocoating; OTM-GO/PDMS). The thermal conductivity of OTM-GO/Al2O3/PDMS nanocomposites reached 4.14 W m-1 K-1, reflecting an increase of 2200% relative to that of pure PDMS. When the operating temperature reached 35, 45, and 65 °C, the surface of OTM-GO/Al2O3/PDMS nanocomposites turned green, yellow, and red, respectively, and the thermal response time was only 30 s. The OTM-GO/Al2O3/PDMS nanocomposites also exhibited outstanding repeatability and maintained excellent color stability over 20 repeated applications.

Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity

The rapid advancement of communication technology has substantially increased the demand for advanced electronic packaging materials with high thermal conductivity and outstanding electrical insulation properties. In this study, we design polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites with hierarchical structures by combining electrospinning, vacuum filtration deposition, and hot pressing. The modified BNNS@PDA improves the interaction between the filler and the polymer matrix while reducing the interfacial thermal resistance, resulting in superior thermal conductivity, excellent insulation, and perfect flexibility. The PVA/BNNS@PDA nanocomposites possess an ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA content. Even after 2000 folds, the nanocomposites do not undergo any crack, showing their ultrahigh thermal conductivity behavior. Furthermore, the nanocomposites exhibit a volume resistivity above 1014 Ω·cm, which is well above the standard for insulating materials. Based on these results, this work provides a novel method to produce nanocomposites with high thermal conductivity, offering a new perspective to design advanced thermal management materials.

Fabrication of Highly Thermally Resistant and Self-Healing Polysiloxane Elastomers by Constructing Covalent and Reversible Networks

The fabrication of self-healing elastomers with high thermal stability for use in extreme thermal conditions such as aerospace remains a major challenge. A strategy for preparing self-healing elastomers with stable covalent bonds and dynamic metal-ligand coordination interactions as crosslinking sites in polydimethylsiloxane (PDMS) is proposed. The added Fe (III) not only serves as the dynamic crosslinking point at room temperature which is crucial for self-healing performance, but also plays a role as free radical scavenging agent at high temperatures. The results show that the PDMS elastomers possessed an initial thermal degradation temperature over 380 °C and a room temperature self-healing efficiency as high as 65.7%. Moreover, the char residue at 800 °C of PDMS elastomer reaches 7.19% in nitrogen atmosphere, and up to 14.02% in air atmosphere by doping a small amount (i.e., 0.3 wt%) of Fe (III), which is remarkable for the self-healing elastomers that contain weak and dynamic bonds with relatively poor thermal stability. This study provides an insight into designing self-healing PDMS-based materials that can be targeted for use as high-temperature thermal protection coatings.

Ice-Inspired Polymeric Slippery Surface with Excellent Smoothness, Stability, and Antifouling Properties

Ice is omnipresent in our daily life and possesses intrinsic slipperiness as a result of the formation of a quasi-liquid layer. Thus, the functional surfaces inspired by ice show great prospects in widespread fields from surface lubrication to antifouling coatings. Herein, we report an ice-inspired polymeric slippery surface (II-PSS) constructed by a self-lubricating liquid layer and a densely surface-grafted polymer brush. The polymer brush layer could act as a homogeneous matrix to capture lubricant molecules via strong and dynamic dipole-dipole interactions to form a stable quasi-liquid layer that resembles the ice surface. The II-PSS can be easily fabricated on various solid substrates (e.g., silicon, glass, aluminum oxide, plastics, etc.) with excellent smoothness (roughness of ∼0.4 nm), optical transmittance (∼94.5%), as well as repellence toward diverse liquids with different surface tensions (22.3-72.8 mN m-1), pH values (1-14), salinity, and organic pollutants. Further investigation shows that the II-PSS exhibits extremely low attachment for proteins and marine organisms (e.g., algae and mussels) for over one month. These results demonstrate a robust and promising strategy for high-performance antifouling coatings.

Functional Materials and Innovative Strategies for Wearable Thermal Management Applications

Highlights

This article systematically reviews the thermal management wearables with a specific emphasis on materials and strategies to regulate the human body temperature. Thermal management wearables are subdivided into the active and passive thermal managing methods. The strength and weakness of each thermal regulatory wearables are discussed in details from the view point of practical usage in real-life.

Abstract

Thermal management is essential in our body as it affects various bodily functions, ranging from thermal discomfort to serious organ failures, as an example of the worst-case scenario. There have been extensive studies about wearable materials and devices that augment thermoregulatory functionalities in our body, employing diverse materials and systematic approaches to attaining thermal homeostasis. This paper reviews the recent progress of functional materials and devices that contribute to thermoregulatory wearables, particularly emphasizing the strategic methodology to regulate body temperature. There exist several methods to promote personal thermal management in a wearable form. For instance, we can impede heat transfer using a thermally insulating material with extremely low thermal conductivity or directly cool and heat the skin surface. Thus, we classify many studies into two branches, passive and active thermal management modes, which are further subdivided into specific strategies. Apart from discussing the strategies and their mechanisms, we also identify the weaknesses of each strategy and scrutinize its potential direction that studies should follow to make substantial contributions to future thermal regulatory wearable industries.

Tetris-Style Stacking Process to Tailor the Orientation of Carbon Fiber Scaffolds for Efficient Heat Dissipation

As the miniaturization of electronic devices and complication of electronic packaging, there are growing demands for thermal interfacial materials with enhanced thermal conductivity and the capability to direct the heat toward heat sink for highly efficient heat dissipation. Pitch-based carbon fiber (CF) with ultrahigh axial thermal conductivity and aspect ratios exhibits great potential for developing thermally conductive composites as TIMs. However, it is still hard to fabricate composites with aligned carbon fiber in a general approach to fully utilize its excellent axial thermal conductivity in specific direction. Here, three types of CF scaffolds with different oriented structure were developed via magnetic field-assisted Tetris-style stacking and carbonization process. By regulating the magnetic field direction and initial stacking density, the self-supporting CF scaffolds with horizontally aligned (HCS), diagonally aligned and vertically aligned (VCS) fibers were constructed. After embedding the polydimethylsiloxane (PDMS), the three composites exhibited unique heat transfer properties, and the HCS/PDMS and VCS/PDMS composites presented a high thermal conductivity of 42.18 and 45.01 W m-1 K-1 in fiber alignment direction, respectively, which were about 209 and 224 times higher than that of PDMS. The excellent thermal conductivity is mainly ascribed that the oriented CF scaffolds construct effective phonon transport pathway in the matrix. In addition, fishbone-shaped CF scaffold was also produced by multiple stacking and carbonization process, and the prepared composites exhibited a controlled heat transfer path, which can allow more versatility in the design of thermal management system.

Self-Healing MXene- and Graphene-Based Composites: Properties and Applications

Today, self-healing graphene- and MXene-based composites have attracted researchers due to the increase in durability as well as the cost reduction in long-time applications. Different studies have focused on designing novel self-healing graphene- and MXene-based composites with enhanced sensitivity, stretchability, and flexibility as well as improved electrical conductivity, healing efficacy, mechanical properties, and energy conversion efficacy. These composites with self-healing properties can be employed in the field of wearable sensors, supercapacitors, anticorrosive coatings, electromagnetic interference shielding, electronic-skin, soft robotics, etc. However, it appears that more explorations are still needed to achieve composites with excellent arbitrary shape adaptability, suitable adhesiveness, ideal durability, high stretchability, immediate self-healing responsibility, and outstanding electromagnetic features. Besides, optimizing reaction/synthesis conditions and finding suitable strategies for functionalization/modification are crucial aspects that should be comprehensively investigated. MXenes and graphene exhibited superior electrochemical properties with abundant surface terminations and great surface area, which are important to evolve biomedical and sensing applications. However, flexibility and stretchability are important criteria that need to be improved for their future applications. Herein, the most recent advancements pertaining to the applications and properties of self-healing graphene- and MXene-based composites are deliberated, focusing on crucial challenges and future perspectives.

Intrinsic Self-Healing Chemistry for Next-Generation Flexible Energy Storage Devices

The booming wearable/portable electronic devices industry has stimulated the progress of supporting flexible energy storage devices. Excellent performance of flexible devices not only requires the component units of each device to maintain the original performance under external forces, but also demands the overall device to be flexible in response to external fields. However, flexible energy storage devices inevitably occur mechanical damages (extrusion, impact, vibration)/electrical damages (overcharge, over-discharge, external short circuit) during long-term complex deformation conditions, causing serious performance degradation and safety risks. Inspired by the healing phenomenon of nature, endowing energy storage devices with self-healing capability has become a promising strategy to effectively improve the durability and functionality of devices. Herein, this review systematically summarizes the latest progress in intrinsic self-healing chemistry for energy storage devices. Firstly, the main intrinsic self-healing mechanism is introduced. Then, the research situation of electrodes, electrolytes, artificial interface layers and integrated devices based on intrinsic self-healing and advanced characterization technology is reviewed. Finally, the current challenges and perspective are provided. We believe this critical review will contribute to the development of intrinsic self-healing chemistry in the flexible energy storage field.

Intrinsically Nonswellable Multifunctional Hydrogel with Dynamic Nanoconfinement Networks for Robust Tissue-Adaptable Bioelectronics

Developing bioelectronics that retains their long-term functionalities in the human body during daily activities is a current critical issue. To accomplish this, robust tissue adaptability and biointerfacing of bioelectronics should be achieved. Hydrogels have emerged as promising materials for bioelectronics that can softly adapt to and interface with tissues. However, hydrogels lack toughness, requisite electrical properties, and fabrication methodologies. Additionally, the water-swellable property of hydrogels weakens their mechanical properties. In this work, an intrinsically nonswellable multifunctional hydrogel exhibiting tissue-like moduli ranging from 10 to 100 kPa, toughness (400-873 J m^-3 ), stretchability (≈1000% strain), and rapid self-healing ability (within 5 min), is developed. The incorporation of carboxyl- and hydroxyl-functionalized carbon nanotubes (fCNTs) ensures high conductivity of the hydrogel (≈40 S m^-1 ), which can be maintained and recovered even after stretching or rupture. After a simple chemical modification, the hydrogel shows tissue-adhesive properties (≈50 kPa) against the target tissues. Moreover, the hydrogel can be 3D printed with a high resolution (≈100 µm) through heat treatment owing to its shear-thinning capacity, endowing it with fabrication versatility. The hydrogel is successfully applied to underwater electromyography (EMG) detection and ex vivo bladder expansion monitoring, demonstrating its potential for practical bioelectronics.

Incorporating paraffin@SiO2 nanocapsules with abundant surface hydroxyl groups into polydimethylsiloxane to develop composites with enhanced interfacial heat conductance for chip heat dissipation

Incorporating phase change capsules into polymeric matrices is an effective approach for developing flexible composites with both heat storage capacity and good thermal reliability, while the interfacial heat conductance between the capsules and the matrix has seldom been considered. Herein, paraffin@SiO₂ nanocapsules synthesized by an interfacial polycondensation process using a basic catalyst were incorporated into a polydimethylsiloxane matrix for the first time to prepare phase change composites at different loadings. Furthermore, the composites containing the nanocapsules were systematically compared with the composites containing the paraffin@SiO₂ microcapsules synthesized using an acidic catalyst. It is shown that, at every identical mass fraction, the composites containing the nanocapsules not only possessed larger latent heat than those containing the microcapsules, but also exhibited higher thermal conductivity and lower hardness. The enhancement in thermal conductivity as well as the decline in hardness for the composite containing the nanocapsules are revealed to originate from a larger amount of hydroxyl groups at the surfaces of the nanocapsules than the microcapsules, which could form more hydrogen bonds with the polymer matrix. This bonding favored the interfacial heat conductance between the nanocapsules and the matrix together with decreasing the crosslinking density of the matrix. Subsequently, composites with enhanced thermal conductivity were developed by combining the nanocapsules with a BN filler. By evaluating the performance for chip heat dissipation, it was found that, when the chip was heated at a power of 10 W, the incorporation of the paraffin@SiO₂ nanocapsules at a loading of 36 wt% into the polymer matrix made a remarkable decrease in the chip equilibrium temperature by 31.7 °C, and a further decline by 8.9 °C occurred when combined with 16 wt% BN. This work sheds light on facilitating the interfacial heat conductance between phase change capsules and the polymer matrix by hydrogen bonding.

Vascular smooth muscle-inspired architecture enables soft yet tough self-healing materials for durable capacitive strain-sensor

Catastrophically mechanical failure of soft self-healing materials is unavoidable due to their inherently poor resistance to crack propagation. Here, with a model system, i.e., soft self-healing polyurea, we present a biomimetic strategy of surpassing trade-off between soft self-healing and high fracture toughness, enabling the conversion of soft and weak into soft yet tough self-healing material. Such an achievement is inspired by vascular smooth muscles, where core-shell structured Galinstan micro-droplets are introduced through molecularly interfacial metal-coordinated assembly, resulting in an increased crack-resistant strain and fracture toughness of 12.2 and 34.9 times without sacrificing softness. The obtained fracture toughness is up to 111.16 ± 8.76 kJ/m², even higher than that of Al and Zn alloys. Moreover, the resultant composite delivers fast self-healing kinetics (1 min) upon local near-infrared irradiation, and possesses ultra-high dielectric constants (~14.57), thus being able to be fabricated into sensitive and self-healing capacitive strain-sensors tolerant towards cracks potentially evolved in service.

Highly Thermally Conductive Adhesion Elastomer Enhanced by Vertically Aligned Folded Graphene

Heat and stress transfer at an interface are crucial for the contact-based tactile sensing to measure the temperature, morphology, and modulus. However, fabricating a smart sensing material that combines high thermal conductivity, elasticity, and good adhesion is challenging. In this study, a composite is fabricated using a directional template of vertically aligned folded graphene (VAFG) and a copolymer matrix of poly-2-[[(butylamino)carbonyl]oxy]ethyl ester and polydimethylsiloxane, vinyl-end-terminated polydimethylsiloxane (poly(PBAx-ran-PDMS)). With optimized chemical cross-linking and supermolecular interactions, the poly(PBA-ran-PDMS)/VAFG exhibits high thermal conductivity (15.49 W m^-1 K^-1 ), an high elastic deformation, and an interfacial adhesion of up to 6500 N m^-1 . Poly(PBA-ran-PDMS)/VAFG is highly sensitive to temperature and pressure and demonstrates a self-learning capacity for manipulator applications. The smart manipulator can distinguish and selectively capture unknown materials in the dark. Thermally conductive, elastic, and adhesive poly(PBA-ran-PDMS)/VAFG can be developed into core materials in intelligent soft robots.

Parallel Structure Enhanced Polysilylaryl-enyne/Ca0.9La0.067TiO3 Composites with Ultra-High Dielectric Constant and Thermal Conductivity

With the rapid development of the microwave communication industry, microwave dielectric materials have been widely studied as the medium of signal transmission. Nowadays, with the increase in communication frequency, devices are miniaturized, and dielectric materials are required to have higher dielectric constants. At the same time, the miniaturization of devices brings about an increase in power density, which puts forward higher requirements for the thermal conductivity of materials. In this work, polysilylaryl-enyne (PSAE) and Ca_0.9La_0.067TiO₃ (CLT) were chosen as the matrix and filler, respectively, to construct a parallel model composite through a freeze casting method and a 0-3 model composite through the direct mixing method, respectively. After comparing the microstructures of the two models, their dielectric properties and thermal conductivity were measured and simulated. The parallel model composites in the stable range possess uniform parallel structures, and the solid content limit for them could be as high as 73.2%, which is much higher than that of the 0-3 model composites. While the 0-3 model composite possesses an optimal dielectric constant of 25.4 (@10 GHz) and a thermal conductivity of 0.965 W·m^-1·K^-1, the parallel model composite possesses a 2 times higher dielectric constant of 76.2 (@10 GHz) and a 1 times higher thermal conductivity of 2.095 W·m^-1·K^-1. Since the parallel model composite possesses much higher dielectric constant and thermal conductivity than traditional 0-3 model composites, it can be an excellent candidate for microwave communication.