Self-Exfoliation of Flake Graphite for Bioinspired Compositing with Aramid Nanofiber toward Integration of Mechanical and Thermoconductive Properties

Programmable and Shape-Color Synchronous Dual-Response Wood with Thermal Stimulus

Stimuli-responsive materials exhibit huge potential in sensors, actuators, and electronics; however, their further development for reinforcement, visualization, and biomass-incorporation remains challenging. Herein, based on the impregnation of thermochromic microcapsule (TCM)-doped dynamic covalent vitrimers, a programmable shape-color dual-responsive wood (SRW-TC) was demonstrated with robust anisotropic structures and exchangeable covalent adaptable networks. Under mild conditions, the resultant SRW-TC displays feasible shape memorability and programmability, resulting from the rigidity-flexibility shift induced by the glass-transition temperature (34.99 °C) and transesterification reaction triggered by the topology freezing transition temperature (149.62 °C). Furthermore, the obtained SRW-TC possesses satisfactory mechanical performance (tensile strength of 45.70 MPa), thermal insulation (thermal conductivity of 0.27 W/m K), anisotropic light management, and benign optical properties (transmittance of 51.73% and haze of 99.67% at 800 nm). Importantly, the incorporation of compatible TCM enables SRW-TC to visualize shape memory feasibility and rigidity/flexibility switching and respond to the external thermal stimulus through the thermal-induced shape-color synchronous dual-responsiveness, which successfully demonstrates the applications of sensing temperature, grasping objects, encrypting/decoding icon messages, and so on. The proposed facile and highly effective strategy could serve as a guideline for developing high-performance multifunctional wood composite with promising intelligent applications in performance visualization, environmental sensing, materials interactivity, information dual-encryption, local precision shape and color regulation, etc.

Application and Development of Smart Thermally Conductive Fiber Materials

In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective personal thermal management a current research hotspot. There is a growing demand for thermally conductive materials that are diversified and specific. Therefore, smart thermally conductive fiber materials characterized by their high thermal conductivity and smart response properties have gained increasing attention. This review provides a comprehensive overview of emerging materials and approaches in the development of smart thermally conductive fiber materials. It categorizes them into composite thermally conductive fibers filled with high thermal conductivity fillers, electrically heated thermally conductive fiber materials, thermally radiative thermally conductive fiber materials, and phase change thermally conductive fiber materials. Finally, the challenges and opportunities faced by smart thermally conductive fiber materials are discussed and prospects for their future development are presented.

Large-Scale Fabrication of Tunable Sandwich-Structured Silver Nanowires and Aramid Nanofiber Films for Exceptional Electromagnetic Interference (EMI) Shielding

The recent advancements in communication technology have facilitated the widespread deployment of electronic communication equipment globally, resulting in the pervasive presence of electromagnetic pollution. Consequently, there is an urgent necessity to develop a thin, lightweight, efficient, and durable electromagnetic interference (EMI) shielding material capable of withstanding severe environmental conditions. In this paper, we propose an innovative and scalable method for preparing EMI shielding films with a tunable sandwich structure. The film possesses a nylon mesh (NM) backbone, with AgNWs serving as the shielding coating and aramid nanofibers (ANFs) acting as the cladding layer. The prepared film was thin and flexible, with a thickness of only 0.13 mm. AgNWs can easily form a conductive network structure, and when the minimum addition amount was 0.2 mg/cm2, the EMI SE value reached 28.7 dB, effectively shielding 99.884% of electromagnetic waves and thereby meeting the commercial shielding requirement of 20 dB. With an increase in dosage up to 1.0 mg/cm2, the EMI SE value further improved to reach 50.6 dB. The NAAANF film demonstrated remarkable robustness in the face of complex usage environments as a result of the outstanding thermal, acid, and alkali resistance properties of aramid fibers. Such a thin, efficient, and environmentally resistant EMI shielding film provided new ideas for the broad EMI shielding market.

Highly Thermoconductive, Strong Graphene-Based Composite Films by Eliminating Nanosheets Wrinkles

Graphene-based thermally conductive composites have been proposed as effective thermal management materials for cooling high-power electronic devices. However, when flexible graphene nanosheets are assembled into macroscopic thermally conductive composites, capillary forces induce shrinkage of graphene nanosheets to form wrinkles during solution-based spontaneous drying, which greatly reduces the thermal conductivity of the composites. Herein, graphene nanosheets/aramid nanofiber (GNS/ANF) composite films with high thermal conductivity were prepared by in-plane stretching of GNS/ANF composite hydrogel networks with hydrogen bonds and π-π interactions. The in-plane mechanical stretching eliminates graphene nanosheets wrinkles by suppressing inward shrinkage due to capillary forces during drying and achieves a high in-plane orientation of graphene nanosheets, thereby creating a fast in-plane heat transfer channel. The composite films (GNS/ANF-60 wt%) with eliminated graphene nanosheets wrinkles showed a significant increase in thermal conductivity (146 W m-1 K-1) and tensile strength (207 MPa). The combination of these excellent properties enables the GNS/ANF composite films to be effectively used for cooling flexible LED chips and smartphones, showing promising applications in the thermal management of high-power electronic devices.

Functional Materials and Innovative Strategies for Wearable Thermal Management Applications

Highlights

This article systematically reviews the thermal management wearables with a specific emphasis on materials and strategies to regulate the human body temperature. Thermal management wearables are subdivided into the active and passive thermal managing methods. The strength and weakness of each thermal regulatory wearables are discussed in details from the view point of practical usage in real-life.

Abstract

Thermal management is essential in our body as it affects various bodily functions, ranging from thermal discomfort to serious organ failures, as an example of the worst-case scenario. There have been extensive studies about wearable materials and devices that augment thermoregulatory functionalities in our body, employing diverse materials and systematic approaches to attaining thermal homeostasis. This paper reviews the recent progress of functional materials and devices that contribute to thermoregulatory wearables, particularly emphasizing the strategic methodology to regulate body temperature. There exist several methods to promote personal thermal management in a wearable form. For instance, we can impede heat transfer using a thermally insulating material with extremely low thermal conductivity or directly cool and heat the skin surface. Thus, we classify many studies into two branches, passive and active thermal management modes, which are further subdivided into specific strategies. Apart from discussing the strategies and their mechanisms, we also identify the weaknesses of each strategy and scrutinize its potential direction that studies should follow to make substantial contributions to future thermal regulatory wearable industries.

Enhanced thermal properties of epoxy composites by constructing thermal conduction networks with low content of three-dimensional graphene

Micro/nano electronic devices heat dissipation depends heavily on the thermal interface materials (TIMs). Despite notable progress, it is hard to efficaciously enhance the thermal properties of the hybrid TIMs with high-load additives due to an absence of effective heat transfer routes. Herein, the low content of three-dimensional (3D) graphene with interconnected networks is adopted as the additive to improve the thermal properties of epoxy composite TIMs. The thermal diffusivity and thermal conductivity of the as-prepared hybrids were dramatically improved by constructing thermal conduction networks after adding 3D graphene as fillers. The 3D graphene/epoxy hybrid's optimal thermal characteristics were observed at 1.5 wt% of 3D graphene content, corresponding to a maximum enhancement of 683%. Besides, heat transfer experiments were further performed to determine the superb heat dissipation potential of the 3D graphene/epoxy hybrids. Moreover, the 3D graphene/epoxy composite TIM was also applied to high-power LED to improve heat dissipation. It effectively reduced the maximum temperature from 79.8 °C to 74.3 °C. These results are beneficial for the better cooling performance of electronic devices and provide useful guidelines for advancing the next-generation TIMs.

Flexible, Highly Thermally Conductive and Electrically Insulating Phase Change Materials for Advanced Thermal Management of 5G Base Stations and Thermoelectric Generators

Thermal management has become a crucial problem for high-power-density equipment and devices. Phase change materials (PCMs) have great prospects in thermal management applications because of their large capacity of heat storage and isothermal behavior during phase transition. However, low intrinsic thermal conductivity, ease of leakage, and lack of flexibility severely limit their applications. Solving one of these problems often comes at the expense of other performance of the PCMs. In this work, we report core-sheath structured phase change nanocomposites (PCNs) with an aligned and interconnected boron nitride nanosheet network by combining coaxial electrospinning, electrostatic spraying, and hot-pressing. The advanced PCN films exhibit an ultrahigh thermal conductivity of 28.3 W m-1 K-1 at a low BNNS loading (i.e., 32 wt%), which thereby endows the PCNs with high enthalpy (> 101 J g-1), outstanding ductility (> 40%) and improved fire retardancy. Therefore, our core-sheath strategies successfully balance the trade-off between thermal conductivity, flexibility, and phase change enthalpy of PCMs. Further, the PCNs provide powerful cooling solutions on 5G base station chips and thermoelectric generators, displaying promising thermal management applications on high-power-density equipment and thermoelectric conversion devices.