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Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review. COATINGS 2018. [DOI: 10.3390/coatings8080262] [Citation(s) in RCA: 30] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
Abstract
The attributes of electroplating as a low-cost, simple, scalable, and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, ultraviolet-visible spectroscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive X-ray spectroscopy, and photoelectrochemical cell studies. Based on the results of structural, morphological, compositional, optical, and electronic properties evaluated, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable for producing excellent devices. In this paper we will describe the progress of electroplating techniques mainly for the deposition of semiconductor thin film materials and their treatment processes, and fabrication of solar cells.
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Li B, Hu T, Ma N, Hu Z, Gong X, Wu C, Hara M. Preparation and optical properties of colloidal Ag0 nanoclusters from reduction of solution ionomer Ag-carboxylate ionic aggregates activated by swelling of covalently attached chain segments. Colloid Polym Sci 2017. [DOI: 10.1007/s00396-017-4033-9] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
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Qin SJ, Peng F, Chen XQ, Pan GB. Electrochemical fabrication and interfacial charge-transfer process of Ni/GaN(0001) electrodes. Phys Chem Chem Phys 2016; 18:6032-6. [PMID: 26841153 DOI: 10.1039/c5cp07378b] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
Abstract
The electrodeposition of Ni on single-crystal n-GaN(0001) film from acetate solution was investigated using scanning electron microscopy, X-ray diffraction, energy dispersive X-ray analysis, atomic force microscopy, and electrochemical techniques. The as-deposited Ni/n-GaN(0001) had a flat band potential of Ufb = -1.0 V vs. Ag/AgCl, which was much lower than that of bare GaN(0001). That is, a more feasible charge-transfer process occurred at the Ni/n-Ga(0001) interface. On the basis of a Tafel plot, an exchange current density of ∼1.66 × 10(-4) mA cm(-2) was calculated. The nuclei density increased when the applied potential was varied from -0.9 V to -1.2 V and, eventually the whole substrate was covered. In addition, the current transient measurements revealed that the Ni deposition process followed instantaneous nucleation in 5 mM Ni(CH3COO)2 + 0.5 M H3BO3.
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Affiliation(s)
- Shuang-Jiao Qin
- Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, 215123 Suzhou, P. R. China. and Department of Chemistry, College of Sciences, Shanghai University, 99 Shangda Road, 200444 Shanghai, P. R. China
| | - Fei Peng
- Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, 215123 Suzhou, P. R. China.
| | - Xue-Qing Chen
- Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, 215123 Suzhou, P. R. China.
| | - Ge-Bo Pan
- Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, 215123 Suzhou, P. R. China.
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Bayley PM, Trease NM, Grey CP. Insights into Electrochemical Sodium Metal Deposition as Probed with in Situ 23Na NMR. J Am Chem Soc 2016; 138:1955-61. [DOI: 10.1021/jacs.5b12423] [Citation(s) in RCA: 69] [Impact Index Per Article: 8.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
Affiliation(s)
- Paul M. Bayley
- Department
of Chemistry, University of Cambridge, Lensfield Road, Cambridge, U.K. CB2 1EW
| | - Nicole M. Trease
- Department
of Chemistry, University of Cambridge, Lensfield Road, Cambridge, U.K. CB2 1EW
| | - Clare P. Grey
- Department
of Chemistry, University of Cambridge, Lensfield Road, Cambridge, U.K. CB2 1EW
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Zhao Y, Deng FX, Hu LF, Liu YQ, Pan GB. Electrochemical deposition of copper on single-crystal gallium nitride(0001) electrode: nucleation and growth mechanism. Electrochim Acta 2014. [DOI: 10.1016/j.electacta.2014.03.051] [Citation(s) in RCA: 14] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]
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Ji J, Zhou Z, Yang X, Zhang W, Sang S, Li P. One-dimensional nano-interconnection formation. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2013; 9:3014-3029. [PMID: 23606447 DOI: 10.1002/smll.201201318] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/13/2012] [Revised: 11/01/2012] [Indexed: 06/02/2023]
Abstract
Interconnection of one-dimensional nanomaterials such as nanowires and carbon nanotubes with other parts or components is crucial for nanodevices to realize electrical contacts and mechanical fixings. Interconnection has been being gradually paid great attention since it is as significant as nanomaterials properties, and determines nanodevices performance in some cases. This paper provides an overview of recent progress on techniques that are commonly used for one-dimensional interconnection formation. In this review, these techniques could be categorized into two different types: two-step and one-step methods according to their established process. The two-step method is constituted by assembly and pinning processes, while the one-step method is a direct formation process of nano-interconnections. In both methods, the electrodeposition approach is illustrated in detail, and its potential mechanism is emphasized.
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Affiliation(s)
- Jianlong Ji
- MicroNano System Research Center, College of Information Engineering, Taiyuan University of Technology, Taiyuan, 030024, PR China
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Rapecki T, Stojek Z, Donten M. Nucleation of metals on conductive polymers: Electrodeposition of silver on thin polypyrrole films. Electrochim Acta 2013. [DOI: 10.1016/j.electacta.2013.05.039] [Citation(s) in RCA: 11] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/18/2023]
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Electrodeposition of uniformly distributed Ru and Ru–Pt nanoparticles onto n-type Si electrodes. Electrochim Acta 2013. [DOI: 10.1016/j.electacta.2013.02.043] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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Castrillejo Y, Hernández P, Rodriguez J, Vega M, Barrado E. Electrochemistry of scandium in the eutectic LiCl–KCl. Electrochim Acta 2012. [DOI: 10.1016/j.electacta.2012.03.124] [Citation(s) in RCA: 24] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022]
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11
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Oskam G, Long JG, Nikolova M, Searson PC. Electrochemical Deposition of Metals on Semiconductors. ACTA ACUST UNITED AC 2011. [DOI: 10.1557/proc-451-257] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/13/2022]
Abstract
ABSTRACTThe general concepts governing the electrochemical deposition of metal films on semiconductors are discussed, and recent results on the fabrication of Schottky junctions consisting of silicon electrodeposited with platinum, copper and gold are presented. In order to obtain good adherent metal films, the density of nuclei should be high and the films should be grown at low current densities where the charge transfer process is rate limiting. This situation can be realized using potential controlled electrochemical deposition. For metal deposition on silicon, the surface should be pretreated in HF to dissolve the oxide layer. Furthermore, the surface should be stable during deposition which can be achieved by tailoring the deposition solutions and by using electrochemical deposition at negative potentials. It is shown that by using this approach, n-type silicon / Pt, Au, and Cu Schottky junctions can be fabricated of a quality comparable to that of junctions prepared by sputter and vapor deposition techniques.
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Kolb DM, Randler RJ, Wielgosz RI, Ziegler JC. The Initial Stages of Metal Deposition on Metal and Semiconductor Electrodes Studied byIn SituStm. ACTA ACUST UNITED AC 2011. [DOI: 10.1557/proc-451-19] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/13/2022]
Abstract
ABSTRACTThe deposition of Cu onto Au(100) and of Pb onto n- Si(111) electrodes from aqueous solutions has been monitoredin situby scanning tunneling microscopy. In the first case, a bcc structure of the Cu overlayer is observed, which allows pseudomorphic growth on Au(100) up to the 10th layer. Then a slow structural transition to fee begins. In contrast, Pb on Si(111) is shown to deposit as 3D crystallites with flat (111) terminated surfaces.
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Macherzynski M, Milczarek G, Mamykin S, Romanyuk V, Kasuya A. Electrochemical preparation of photosensitive porous n-type Si electrodes, modified with Pt and Ru nanoparticles. Electrochim Acta 2010. [DOI: 10.1016/j.electacta.2010.02.008] [Citation(s) in RCA: 9] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
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Yue G, Zhang S, Zhu Y, Lu X, Li S, Li Z. A promising method for electrodeposition of aluminium on stainless steel in ionic liquid. AIChE J 2009. [DOI: 10.1002/aic.11698] [Citation(s) in RCA: 43] [Impact Index Per Article: 2.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/07/2022]
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Bermejo M, Gómez J, Martínez A, Barrado E, Castrillejo Y. Electrochemistry of terbium in the eutectic LiCl–KCl. Electrochim Acta 2008. [DOI: 10.1016/j.electacta.2008.02.058] [Citation(s) in RCA: 60] [Impact Index Per Article: 3.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/22/2022]
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Tsuda T, Nohira T, Ito Y. Nucleation and surface morphology of aluminum–lanthanum alloy electrodepsited in a LaCl3-saturated AlCl3–EtMeImCl room temperature molten salt. Electrochim Acta 2002. [DOI: 10.1016/s0013-4686(02)00168-8] [Citation(s) in RCA: 43] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
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In Situ Electrochemical Deposition of Pt Nanoparticles on Carbon and Inside Nafion. ACTA ACUST UNITED AC 2001. [DOI: 10.1149/1.1361233] [Citation(s) in RCA: 64] [Impact Index Per Article: 2.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
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Ziegler J, Reitzle A, Bunk O, Zegenhagen J, Kolb D. Metal deposition on n-Si(111):H electrodes. Electrochim Acta 2000. [DOI: 10.1016/s0013-4686(00)00611-3] [Citation(s) in RCA: 59] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
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Platinum electrodeposits on glassy carbon: The formation mechanism, morphology, and adsorption properties. RUSS J ELECTROCHEM+ 2000. [DOI: 10.1007/bf02757674] [Citation(s) in RCA: 24] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/22/2022]
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Krumm R, Guel B, Schmitz C, Staikov G. Nucleation and growth in electrodeposition of metals on n-Si(111). Electrochim Acta 2000. [DOI: 10.1016/s0013-4686(00)00418-7] [Citation(s) in RCA: 79] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
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Voigt O, Davepon B, Staikov G, Schultze J. Localized electrochemical deposition and dissolution of Cu on microstructured Ti surfaces. Electrochim Acta 1999. [DOI: 10.1016/s0013-4686(99)00078-x] [Citation(s) in RCA: 14] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
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23
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Characterization of electrochemically deposited gold nanocrystals on glassy carbon electrodes. J Electroanal Chem (Lausanne) 1999. [DOI: 10.1016/s0022-0728(99)00154-0] [Citation(s) in RCA: 175] [Impact Index Per Article: 7.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
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Gloaguen F, Léger J, Lamy C, Marmann A, Stimming U, Vogel R. Platinum electrodeposition on graphite: electrochemical study and STM imaging. Electrochim Acta 1999. [DOI: 10.1016/s0013-4686(98)00332-6] [Citation(s) in RCA: 128] [Impact Index Per Article: 5.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]
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Kelaidopoulou A, Kokkinidis G, Milchev A. Nucleation and growth of metal catalysts. Part I. Electrodeposition of platinum on tungsten. J Electroanal Chem (Lausanne) 1998. [DOI: 10.1016/s0022-0728(97)00546-9] [Citation(s) in RCA: 45] [Impact Index Per Article: 1.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
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Vereecken P, Strubbe K, Gomes W. An improved procedure for the processing of chronoamperometric data: Application to the electrodeposition of Cu upon (100) n-GaAs. J Electroanal Chem (Lausanne) 1997. [DOI: 10.1016/s0022-0728(97)00195-2] [Citation(s) in RCA: 21] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/27/2022]
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28
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Sutter E, Mathieu C, Moulayat N, Etcheberry A. Effect of copper coating on the behaviour of p-InP electrodes. J Electroanal Chem (Lausanne) 1997. [DOI: 10.1016/s0022-0728(96)05020-6] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/27/2022]
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Vereecken P, Kerchove F, Gomes W. Electrochemical behaviour of (1 0 0) GaAs in copper(II)-containing solutions. Electrochim Acta 1996. [DOI: 10.1016/0013-4686(95)00276-k] [Citation(s) in RCA: 18] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
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Koinuma M, Uosaki K. An electrochemical AFM study on electrodeposition of copper on p-GaAs(100) surface in HCl solution. Electrochim Acta 1995. [DOI: 10.1016/0013-4686(95)00070-u] [Citation(s) in RCA: 20] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
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Electrochemical features of electrodes modified with Multiple Nano Contacts (MNCs) from colloidal noble metal particles. Electrochim Acta 1995. [DOI: 10.1016/0013-4686(95)00033-b] [Citation(s) in RCA: 29] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
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Real time scanning tunneling microscope imaging of Sn electrodeposition on n-GaAs. J Electroanal Chem (Lausanne) 1992. [DOI: 10.1016/0022-0728(92)80539-g] [Citation(s) in RCA: 7] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022]
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37
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Sonneveld P, Visscher W, Barendrecht E. Nucleation and growth of zinc on a glassy carbon electrode from a zincate solution. Electrochim Acta 1992. [DOI: 10.1016/0013-4686(92)85056-q] [Citation(s) in RCA: 26] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]
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Allongue P, Blonkowski S, Souteyrand E. Experimental investigation of charge transfer at the semiconductor/electrolyte junction. Electrochim Acta 1992. [DOI: 10.1016/0013-4686(92)85032-g] [Citation(s) in RCA: 26] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]
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