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Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum. Electrochim Acta 2009. [DOI: 10.1016/j.electacta.2008.09.052] [Citation(s) in RCA: 51] [Impact Index Per Article: 3.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/22/2022]
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Hwang BJ, Tsai YW, Sarma LS, Chen CH, Lee JF, Strehblow HH. In Situ XAS Investigation of Transformation of Co Monolayer on Carbon-Supported Platinum Clusters Underpotential Control. J Phys Chem B 2004. [DOI: 10.1021/jp047273r] [Citation(s) in RCA: 10] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
Affiliation(s)
- B. J. Hwang
- Nanoelectrochemistry Laboratory, Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, R.O.C
| | - Y. W. Tsai
- Nanoelectrochemistry Laboratory, Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, R.O.C
| | - Loka S. Sarma
- Nanoelectrochemistry Laboratory, Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, R.O.C
| | - C. H. Chen
- Nanoelectrochemistry Laboratory, Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, R.O.C
| | - J.-F. Lee
- Nanoelectrochemistry Laboratory, Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, R.O.C
| | - H. H. Strehblow
- Nanoelectrochemistry Laboratory, Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, R.O.C
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Herrero E, Buller LJ, Abruña HD. Underpotential deposition at single crystal surfaces of Au, Pt, Ag and other materials. Chem Rev 2001; 101:1897-930. [PMID: 11710235 DOI: 10.1021/cr9600363] [Citation(s) in RCA: 472] [Impact Index Per Article: 20.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
Affiliation(s)
- E Herrero
- Department of Chemistry and Chemical Biology, Baker Laboratory, Cornell University, Ithaca, New York 14853-130, USA
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Hartig P, Wünsche M, Küssner T, Schumacher R. Kinetic and topographic investigation of copper deposition/stripping in an acid copper environment. Electrochem commun 1999. [DOI: 10.1016/s1388-2481(99)00081-8] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022] Open
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Pt+Cu and Pd+Cu alloy particles formed in the underpotential deposition region of Cu2+ in perchloric acid solution. Electrochim Acta 1998. [DOI: 10.1016/s0013-4686(97)10159-1] [Citation(s) in RCA: 11] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/18/2022]
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Underpotential deposition of copper on Pt(S)-[n(111) × (100)] electrodes in sulfuric acid solution. J Electroanal Chem (Lausanne) 1995. [DOI: 10.1016/0022-0728(94)03803-b] [Citation(s) in RCA: 34] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/18/2022]
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Dakkouri A, Batina N, Kolb D. The influence of organic additives on the underpotential deposition of Cu on Pt(111). Electrochim Acta 1993. [DOI: 10.1016/0013-4686(93)85118-i] [Citation(s) in RCA: 18] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
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Schumacher R, Helbig W, Haß I, Wünsche M, Meyer H. The application of fast potential steps to noble metal electrodes: a correlation of electrodissolution with changes in the surface morphology and composition. J Electroanal Chem (Lausanne) 1993. [DOI: 10.1016/0022-0728(93)80324-b] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/17/2022]
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Wünsche M, Nichols R, Schumacher R, Beckmann W, Meyer H. Influence of the additives (TU) and (PEG) on the underpotential deposition of copper on platinum electrodes: a coulometric, microgravimetric and topographic study. Electrochim Acta 1993. [DOI: 10.1016/0013-4686(93)80233-p] [Citation(s) in RCA: 18] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
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