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For: Cao J, Wu Z, Yang J, Li S, Tang H, Xie G. Site-selective electroless plating of copper on a poly(ethylene terephthalate) surface modified with a self-assembled monolayer. Colloids Surf A Physicochem Eng Asp 2012. [DOI: 10.1016/j.colsurfa.2012.09.045] [Citation(s) in RCA: 16] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022]
Number Cited by Other Article(s)
1
Heeschen E, DeLucia E, Arin Manav Y, Roberts D, Davaji B, Barecka MH. Low cost 3D printable flow reactors for electrochemistry. HARDWAREX 2024;17:e00505. [PMID: 38226322 PMCID: PMC10788492 DOI: 10.1016/j.ohx.2023.e00505] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/01/2023] [Revised: 11/15/2023] [Accepted: 12/16/2023] [Indexed: 01/17/2024]
2
Atli A, Trouillet V, Cadete Santos Aires FJ, Ehret E, Lemaire E, Simon S. A generalized sample preparation method by incorporation of metal–organic compounds into polymers for electroless metallization. J Appl Polym Sci 2021. [DOI: 10.1002/app.50276] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/10/2022]
3
Huang D, Huang M, Sun D, Liu B, Xuan R, Liu J, Sun R, Li J, Zhang G, Yu D. Selective metallization of glass with improved adhesive layer and optional hydrophobic surface. Colloids Surf A Physicochem Eng Asp 2021. [DOI: 10.1016/j.colsurfa.2021.126339] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
4
Wang KT, Wang WY, Wei TC. Photomask-Free, Direct Selective Electroless Deposition on Glass by Controlling Surface Hydrophilicity. ACS OMEGA 2019;4:7706-7710. [PMID: 31459860 PMCID: PMC6648132 DOI: 10.1021/acsomega.9b00259] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Abstract] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 01/28/2019] [Accepted: 04/17/2019] [Indexed: 06/10/2023]
5
Chen GS, Yang TM, Chen ST, Cheng YL, Fang JS. A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier. Electrochem commun 2018. [DOI: 10.1016/j.elecom.2017.12.015] [Citation(s) in RCA: 9] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/30/2022]  Open
6
Huang J, Chen Z, Zhou F, Wang H, Yuan Y, Chen W, Gao M, Zhan Y. High-adhesive electroless copper plating on polyethylene surface modified with primer. J Solid State Electrochem 2017. [DOI: 10.1007/s10008-016-3503-1] [Citation(s) in RCA: 7] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
7
Huang J, Chen Z. Method for electroless nickel plating on the surface of CaCO3 powders. RSC Adv 2017. [DOI: 10.1039/c7ra03110f] [Citation(s) in RCA: 8] [Impact Index Per Article: 1.1] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]  Open
8
Konishi T, Yamaguchi K. Surface Control of a Photoresponsive Self-Assembled Monolayer and Selective Deposition of Ag Nanoparticulate Ink. BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN 2016. [DOI: 10.1246/bcsj.20150403] [Citation(s) in RCA: 18] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/12/2022]
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