Self-reducible copper complex inks with two amines for copper conductive films via calcination below 100 °C

A compact tri-notched flexible UWB antenna based on an inkjet-printable and plasma-activated silver nano ink

The rapid development of ultrawideband (UWB) communication systems has resulted in increasing performance requirements for the antenna system. In addition to a wide bandwidth, fast propagation rates and compact dimensions, flexibility, wearability or portability are also desirable for UWB antennas, as are excellent notch characteristics. Although progress has been made in the development of flexible/wearable antennas desired notch properties are still rather limited. Moreover, most presently available flexible UWB antennas are fabricated using environmentally not attractive subtractive etching-based processes. The usage of facile additive sustainably inkjet printing processes also utilizing low temperature plasma-activated conductive inks is rarely reported. In addition, the currently used tri-notched flexible UWB antenna designs have a relatively large footprint, which poses difficulties when integrated into miniaturized and compact communication devices. In this work, a silver nano ink is used to fabricate the antenna via inkjet printing and an efficient plasma sintering procedure. For the targeted UWB applications miniaturized tri-notched flexible antenna is realized on a flexible polyethylene terephthalate (PET) substrate with a compact size of 17.6 mm × 16 mm × 0.12 mm. The antenna operates in the UWB frequency band (2.9-10.61 GHz), and can shield interferences from WiMAX (3.3-3.6 GHz), WLAN (5.150-5.825 GHz) and X-uplink (7.9-8.4 GHz) bands, as well as exhibits a certain of bendability. Three nested "C" slots of different sizes were adopted to achieve notch features. The simulation and test results demonstrate that the proposed antenna can generate signal radiation in the desired UWB frequency band while retaining the desired notch properties and having acceptable SAR values on-body, making it a viable candidate for usage in flexible or wearable communication transmission devices. The research provides a facile and highly efficient method for fabricating flexible/wearable UWB antennas, that is, the effective combination of inkjet printing processing, flexible substrates, low temperature-activated conductive ink and antenna structure design.

Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink

Conductive inks are one of the most important functional materials for printed flexible electronic devices, and their properties determine the methods of subsequent patterning and metallization. In comparison with copper nanoparticle or nanowire inks, copper particle-free inks employing copper(II) formate (Cuf) as a precursor have attracted the interest of researchers due to their flexibility in preparation, excellent stability, and lower conversion temperature. Alkanolamines can provide Cuf with excellent solubility in alcohols while being less toxic and having a certain reducibility, making them preferable ligands in comparison with aliphatic amines and pyridine. However, there have been few studies on the effects of the alkanolamine types on the performance of Cuf inks. Also, the decomposition mechanism of copper-alkanolamine complex inks is not clear. In this work, different kinds of alkanolamines were chosen as ligands to formulate Cuf inks to address the mentioned issues. The influences of amine types on the stability, wettability, thermal decomposition behavior, and electrical performance of the formulated Cuf particle-free inks were investigated in detail. The results show that the utilization of alkanolamines could provide Cuf with excellent solubility in alcohols, resulting in an ink with good stability and favorable wetting properties. The thermal decomposition temperature and electrical performance of the formulated copper ink are largely dependent on the amine used. When amines with a longer carbon chain and more branches were utilized to prepare the ink, a decreased decomposition temperature was observed on the derived inks because of the steric hindrance effect. Copper films with good morphology and conductivity could be obtained at low temperatures by selecting the appropriate alkanolamine. Copper particle-free conductive ink from 2-amino-2-methyl-1-propanol demonstrated better morphology and electrical performance (16.09 μΩ·cm) and was successfully used for conductive circuits by direct-writing.

Copper inks for printed electronics: a review

Conductive inks have attracted tremendous attention owing to their adaptability and the convenient large-scale fabrication. As a new type of conductive ink, copper-based ink is considered to be one of the best candidate materials for the conductive layer in flexible printed electronics owing to its high conductivity and low price, and suitability for large-scale manufacturing processes. Recently, tremendous progress has been made in the preparation of cooper-based inks for electronic applications, but the antioxidation ability of copper-based nanomaterials within inks or films, that is, long-term reliability upon exposure to water and oxygen, still needs more exploration. In this review, we present a comprehensive overview of copper inks for printed electronics from ink preparation, printing methods and sintering, to antioxidation strategies and electronic applications. The review begins with an overview of the development of copper inks, followed by a demonstration of various preparation methods for copper inks. Then, the diverse printing techniques and post-annealing strategies used to fabricate conductive copper patterns are discussed. In addition, antioxidation strategies utilized to stabilize the mechanical and electrical properties of copper nanomaterials are summarized. Then the diverse applications of copper inks for electronic devices, such as transparent conductive electrodes, sensors, optoelectronic devices, and thin-film transistors, are discussed. Finally, the future development of copper-based inks and the challenges of their application in printed electronics are discussed.