Electron beam-induced modification of organic monolayers on Si(111) surfaces used for selective electrodeposition

Patterning Cu nanostructures tailored for CO2 reduction to electrooxidizable fuels and oxygen reduction in alkaline media

Due to the limited availability of noble metal catalysts, such as platinum, palladium, or gold, their substitution by more abundant elements is highly advisable. Considerably challenging is the controlled and reproducible synthesis of stable non-noble metallic nanostructures with accessible active sites. Here, we report a method of preparation of bare (ligand-free) Cu nanostructures from polycrystalline metal in a controlled manner. This procedure relies on heterogeneous localized electrorefining of polycrystalline Cu on indium tin oxide (ITO) and glassy carbon as model supports using scanning electrochemical microscopy (SECM). The morphology of nanostructures and thus their catalytic properties are tunable by adjusting the electrorefining parameters, i.e., the electrodeposition voltage, the translation rate of the metal source and the composition of the supporting electrolyte. The activity of the obtained materials towards the carbon dioxide reduction reaction (CO2RR), oxygen reduction reaction (ORR) in alkaline media and hydrogen evolution reaction (HER), is studied by feedback mode SECM. Spiky Cu nanostructures obtained at a high concentration of chloride ions exhibit enhanced electrocatalytic activity. Nanostructures deposited under high cathodic overpotentials possess a high surface-to-volume ratio with a large number of catalytic sites active towards the reversible CO2RR and ORR. The CO2RR yields easily electrooxidizable compounds - formic acid and carbon monoxide. The HER seems to occur efficiently at the crystallographic facets of Cu nanostructures electrodeposited under mild polarization.

Copper Contamination of Self-Assembled Organic Monolayer Modified Silicon Surfaces Following a "Click" Reaction Characterized with LAPS and SPIM

A copper(I)-catalyzed azide alkyne cycloaddition (CuAAC) reaction combined with microcontact printing was used successfully to pattern alkyne-terminated self-assembled organic monolayer-modified silicon surfaces. Despite the absence of a copper peak in X-ray photoelectron spectra, copper contamination was found and visualized using light-addressable potentiometric sensors (LAPS) and scanning photo-induced impedance microscopy (SPIM) after the "click"-modified silicon surfaces were rinsed with hydrochloric acid (HCl) solution, which was frequently used to remove copper residues in the past. Even cleaning with an ethylenediaminetetraacetic acid (EDTA) solution did not remove the copper residue completely. Different strategies for avoiding copper contamination, including the use of bulky chelators for the copper(I) catalyst and rinsing with different reagents, were tested. Only cleaning of the silicon surfaces with an EDTA solution containing trifluoroacetic acid (TFA) after the click modification proved to be an effective method as confirmed by LAPS and SPIM results, which showed the expected potential shift due to the surface charge introduced by functional groups in the monolayer and allowed, for the first time, imaging the impedance of an organic monolayer.

"Click" Patterning of Self-Assembled Monolayers on Hydrogen-Terminated Silicon Surfaces and Their Characterization Using Light-Addressable Potentiometric Sensors

Two potential strategies for chemically patterning alkyne-terminated self-assembled monolayers (SAMs) on oxide-free silicon or silicon-on-sapphire (SOS) substrates were investigated and compared. The patterned surfaces were validated using a light-addressable potentiometric sensor (LAPS) for the first time. The first strategy involved an integration of photolithography with "click" chemistry. Detailed surface characterization (i.e. water contact angle, ellipsometry, AFM, and XPS) and LAPS measurements showed that photoresist processing not only decreases the coverage of organic monolayers but also introduces chemically bonded contaminants on the surfaces, thus significantly reducing the quality of the SAMs and the utility of "click" surface modification. The formation of chemical contaminants in photolithography was also observed on carboxylic acid- and alkyl-terminated monolayers using LAPS. In contrast, a second approach combined microcontact printing (μCP) with "click" chemistry; that is azide (azido-oligo(ethylene glycol) (OEG)-NH2) inks were printed on alkyne-terminated SAMs on silicon or SOS through PDMS stamps. The surface characterization results for the sample printed with a flat featureless PDMS stamp demonstrated a nondestructive and efficient method of μCP to perform "click" reactions on alkyne-terminated, oxide-free silicon surfaces for the first time. For the sample printed with a featured PDMS stamp, LAPS imaging showed a good agreement with the pattern of the PDMS stamp, indicating the successful chemical patterning on non-oxidized silicon and SOS substrates and the capability of LAPS to image the molecular patterns with high sensitivity.

Substituent effects on the kinetics of bifunctional styrene SAM formation on H-terminated Si

Self-assembled monolayers (SAMs) on metal and semiconductor surfaces are of interest in electronic devices, molecular and biosensors, and nanostructured surface preparation. Bifunctionalized molecules, where one functional group attaches to the surface while the other remains free for further modification, allow for the rational design of multilayer chemisorbed thin films. In this study, substituted styrenes acted as a model system for SAM formation through an alkene moiety. Substituents ranging from activating to strongly deactivating for aromatic reactions were used to probe the effect of the electronic properties of functionalizing molecules on the rate of SAM formation. Substituted styrene SAMs were formed on hydrogen-terminated p-type Si(100) and n-type Si(111) via sonochemical functionalization. Monolayers were characterized via ellipsometry, IR spectroscopy, contact angle goniometry, and X-ray photoelectron spectroscopy (XPS). Initial rates of reaction for molecules that selectively attached through the alkene were further studied. A linear relationship was observed between the initial rates of surface functionalization and the substituent electron donating/withdrawing ability for the substituted styrenes, as described by their respective Hammett constants. This study provides precedent for applying well quantified homogeneous chemical reaction relationships to reactions at the solid-liquid interface.

One-dimensional nano-interconnection formation

Interconnection of one-dimensional nanomaterials such as nanowires and carbon nanotubes with other parts or components is crucial for nanodevices to realize electrical contacts and mechanical fixings. Interconnection has been being gradually paid great attention since it is as significant as nanomaterials properties, and determines nanodevices performance in some cases. This paper provides an overview of recent progress on techniques that are commonly used for one-dimensional interconnection formation. In this review, these techniques could be categorized into two different types: two-step and one-step methods according to their established process. The two-step method is constituted by assembly and pinning processes, while the one-step method is a direct formation process of nano-interconnections. In both methods, the electrodeposition approach is illustrated in detail, and its potential mechanism is emphasized.

Electrodeposition in capillaries: bottom-up micro- and nanopatterning of functional materials on conductive substrates

A cost-effective and versatile methodology for bottom-up patterned growth of inorganic and metallic materials on the micro- and nanoscale is presented. Pulsed electrodeposition was employed to deposit arbitrary patterns of Ni, ZnO, and FeO(OH) of high quality, with lateral feature sizes down to 200-290 nm. The pattern was defined by an oxygen plasma-treated patterned PDMS mold in conformal contact with a conducting substrate and immersed in an electrolyte solution, so that the solid phases were deposited from the solution in the channels of the patterned mold. It is important that the distance between the entrance of the channels, and the location where deposition is needed, is kept limited. The as-formed patterns were characterized by high resolution scanning electron microscope, energy-dispersive X-ray analysis, atomic force microscopy, and X-ray diffraction.