Reference Citation Analysis: Find an Article, Find a Category, Find a Journal, Find a Scholar

For: Lin CC, Hu CC, Lu YT, Guo RH. Reconsider the depolarization behavior of copper electrodeposition in the presence of 3-mercapto-1-propanesulfonate. Electrochem commun 2018. [DOI: 10.1016/j.elecom.2018.05.003] [Citation(s) in RCA: 11] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022] Open

For:	Lin CC, Hu CC, Lu YT, Guo RH. Reconsider the depolarization behavior of copper electrodeposition in the presence of 3-mercapto-1-propanesulfonate. Electrochem commun 2018. [DOI: 10.1016/j.elecom.2018.05.003] [Citation(s) in RCA: 11] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022] Open

Number	Cited by Other Article(s)
1	Xiang J, Wang Y, Zeng C, Xu Y, Yang W, Tian L, Ruan H, Yang Q. Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath. Electrocatalysis (N Y) 2022. [DOI: 10.1007/s12678-022-00743-5] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse
2	The Synergistic Effects of Additives on the Micro Vias Copper Filling. J Electroanal Chem (Lausanne) 2022. [DOI: 10.1016/j.jelechem.2022.116456] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse
3	Li J, Zhou G, Hong Y, He W, Wang S, Wang C, Chen Y, Zhou J, Miao H, Weng Z, Andersson M. In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate. Electrochim Acta 2020. [DOI: 10.1016/j.electacta.2019.135358] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse