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For: Venkatraman K, Joi A, Dordi Y, Akolkar R. Electroless atomic layer deposition of copper. Electrochem commun 2018. [DOI: 10.1016/j.elecom.2018.05.007] [Citation(s) in RCA: 6] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]  Open
Number Cited by Other Article(s)
1
Ahmadi K, Dole N, Wu D, Salavati-Fard T, Grabow LC, Robles Hernandez FC, Brankovic SR. Electroless Pb Monolayer Deposition—Prelude for Further Advances in Catalyst Monolayer Synthesis via Surface Limited Redox Replacement Reaction. ACS Catal 2021. [DOI: 10.1021/acscatal.0c05255] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
2
Wet-chemical etching of metals for advanced semiconductor technology nodes: Ru etching in acidic Ce4+ solutions. Electrochim Acta 2019. [DOI: 10.1016/j.electacta.2019.03.065] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
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