Indirect electrografting of aryl iodides

Organic Donor-Acceptor Thermally Activated Delayed Fluorescence Photocatalysts in the Photoinduced Dehalogenation of Aryl Halides

We report a family of donor-acceptor thermally activated delayed fluorescent (TADF) compounds based on derivatives of DMAC-TRZ, that are strongly photoreducing. Both Eox and thus E*ox could be tuned via substitution of the DMAC donor with a Hammett series of p-substituted phenyl moieties while Ered remained effectively constant. These compounds were assessed in the photoinduced dehalogenation of aryl halides, and analogues bearing electron withdrawing groups were found to produce the highest yields. Substrates of up to Ered=-2.72 V could be dehalogenated at low PC loading (1 mol %) and under air, conditions much milder than previously reported for this reaction. Spectroscopic and chemical studies demonstrate that all PCs, including literature reference PCs, photodegrade, and that it is these photodegradation products that are responsible for the reactivity.

Direct vs Indirect Grafting of Alkyl and Aryl Halides

The direct and indirect electrochemical grafting of alkyl and aryl halides (RX, ArX) on carbon, metal and polymer surfaces is examined. Their electrochemical reduction occurs at highly negative potential in organic solvents and very often produces carbanions because the reduction potentials of RX and ArX are more negative than those of their corresponding radicals. Therefore, direct electrografting of alkyl and aryl radicals generated from RX and ArX is not easy to perform. This obstacle is overcome using aryl radicals derived from the 2,6-dimethylbenzenediazonium salt (2,6-DMBD), which do not react on the electrode surface due to their steric hindrance but react in solution by abstracting an iodine or bromine atom from RX (X=I, Br) or ArI to give alkyl or aryl radicals. As a consequence, alkyl and aryl radicals are generated at very low driving force by diverting the reactivity of aryl radicals derived from an aryl diazonium salt; they attack the electrode surface and form strongly attached organic layers. This strategy applies to the chemical modification of polymers (polyethylene, polymethylmethacrylate) by alkyl halides under heating.

Nanofabrication Techniques in Large-Area Molecular Electronic Devices

The societal impact of the electronics industry is enormous—not to mention how this industry impinges on the global economy. The foreseen limits of the current technology—technical, economic, and sustainability issues—open the door to the search for successor technologies. In this context, molecular electronics has emerged as a promising candidate that, at least in the short-term, will not likely replace our silicon-based electronics, but improve its performance through a nascent hybrid technology. Such technology will take advantage of both the small dimensions of the molecules and new functionalities resulting from the quantum effects that govern the properties at the molecular scale. An optimization of interface engineering and integration of molecules to form densely integrated individually addressable arrays of molecules are two crucial aspects in the molecular electronics field. These challenges should be met to establish the bridge between organic functional materials and hard electronics required for the incorporation of such hybrid technology in the market. In this review, the most advanced methods for fabricating large-area molecular electronic devices are presented, highlighting their advantages and limitations. Special emphasis is focused on bottom-up methodologies for the fabrication of well-ordered and tightly-packed monolayers onto the bottom electrode, followed by a description of the top-contact deposition methods so far used.