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For: Quinet M, Lallemand F, Ricq L, Hihn J, Delobelle P, Arnould C, Mekhalif Z. Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum. Electrochim Acta 2009;54:1529-36. [DOI: 10.1016/j.electacta.2008.09.052] [Citation(s) in RCA: 51] [Impact Index Per Article: 3.4] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/22/2022]
Number Cited by Other Article(s)
1
Yu N, Wu K, Tao L. Synchronous reduction-fixation of reducible heavy metals from aqueous solutions: Application of novel mesoporous MFT/SBA-15 composite materials. CHEMOSPHERE 2021;276:130112. [PMID: 33684860 DOI: 10.1016/j.chemosphere.2021.130112] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/07/2020] [Revised: 02/21/2021] [Accepted: 02/23/2021] [Indexed: 06/12/2023]
2
Cu–MoS2 Superhydrophobic Coating by Composite Electrodeposition. COATINGS 2020. [DOI: 10.3390/coatings10030238] [Citation(s) in RCA: 11] [Impact Index Per Article: 2.8] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
3
Shape evolution and effect of organic additives in the electrosynthesis of Cu nanostructures. J Solid State Electrochem 2019. [DOI: 10.1007/s10008-019-04360-z] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/26/2022]
4
Xu GR, Ge C, Liu D, Jin L, Li YC, Zhang TH, Rahman MM, Li XB, Kim W. In-situ electrochemical deposition of dendritic Cu-Cu2S nanocomposites onto glassy carbon electrode for sensitive and non-enzymatic detection of glucose. J Electroanal Chem (Lausanne) 2019. [DOI: 10.1016/j.jelechem.2019.05.059] [Citation(s) in RCA: 9] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/14/2022]
5
Sarma A, Dippel AC, Gutowski O, Etter M, Lippmann M, Seeck O, Manna G, Sanyal MK, Keller TF, Kulkarni S, Guha P, Satyam PV, Zimmermann MV. Electrodeposition of nanowires of a high copper content thiourea precursor of copper sulfide. RSC Adv 2019;9:31900-31910. [PMID: 35530788 PMCID: PMC9072728 DOI: 10.1039/c9ra04293h] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/07/2019] [Accepted: 09/21/2019] [Indexed: 12/21/2022]  Open
6
Electrodeposition of Cu2S nanoparticles on fluorine-doped tin oxide for efficient counter electrode of quantum-dot-sensitized solar cells. J IND ENG CHEM 2018. [DOI: 10.1016/j.jiec.2017.12.056] [Citation(s) in RCA: 22] [Impact Index Per Article: 3.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
7
Yilmaz G, Lu X, Ho GW. Cross-linker mediated formation of sulfur-functionalized V2O5/graphene aerogels and their enhanced pseudocapacitive performance. NANOSCALE 2017;9:802-811. [PMID: 27982151 DOI: 10.1039/c6nr08233e] [Citation(s) in RCA: 16] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/12/2023]
8
Chang T, Jin Y, Wen L, Zhang C, Leygraf C, Wallinder IO, Zhang J. Synergistic effects of gelatin and convection on copper foil electrodeposition. Electrochim Acta 2016. [DOI: 10.1016/j.electacta.2016.06.051] [Citation(s) in RCA: 23] [Impact Index Per Article: 2.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/21/2022]
9
Effect of ethylene glycol on electrochemical and morphological features of platinum electrodeposits from chloroplatinic acid. J APPL ELECTROCHEM 2015. [DOI: 10.1007/s10800-015-0820-5] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/23/2022]
10
Zhang M, Yu X, Qin G, Zhu Y, Wang M, Wei Q, Zhang Y, Zhang X. Latent fingerprint enhancement on conductive substrates using electrodeposition of copper. Sci China Chem 2015. [DOI: 10.1007/s11426-015-5347-4] [Citation(s) in RCA: 9] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
11
HOSHI Y, ITO Y, KATO T, SHITANDA I, ITAGAKI M. Interpretation of Negative Resistance Observed in Electrochemical Impedance during Copper Electrodeposition Containing Thiourea. ELECTROCHEMISTRY 2015. [DOI: 10.5796/electrochemistry.83.142] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/20/2022]  Open
12
Zhang Q, Yu X, Hua Y, Xue W. The effect of quaternary ammonium-based ionic liquids on copper electrodeposition from acidic sulfate electrolyte. J APPL ELECTROCHEM 2014. [DOI: 10.1007/s10800-014-0774-z] [Citation(s) in RCA: 17] [Impact Index Per Article: 1.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
13
The effect of thiourea, l(−) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition. J APPL ELECTROCHEM 2013. [DOI: 10.1007/s10800-013-0596-4] [Citation(s) in RCA: 13] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
14
Nekouie RK, Rashchi F, Joda NN. Effect of organic additives on synthesis of copper nano powders by pulsing electrolysis. POWDER TECHNOL 2013. [DOI: 10.1016/j.powtec.2012.12.046] [Citation(s) in RCA: 21] [Impact Index Per Article: 1.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/27/2022]
15
Inhibition effect of some aromatic amines on copper electrodeposition from acidic baths. J APPL ELECTROCHEM 2012. [DOI: 10.1007/s10800-012-0385-5] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/14/2022]
16
ABDEL-RAHMAN HH, HARFOUSH AA, MOUSTAFA AHE. Electrodeposition of Copper in the Presence of Aliphatic and Aromatic Diamines as Organic Additives. ELECTROCHEMISTRY 2012. [DOI: 10.5796/electrochemistry.80.226] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/20/2022]  Open
17
Devillers S, Lemineur Q, Delhalle J, Mekhalif Z. Exploratory study of copper particles electrodeposition on nickel by induction heating. Electrochim Acta 2011. [DOI: 10.1016/j.electacta.2011.03.130] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]
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