Scanning electrochemical microscopy for the fabrication of copper nanowires: Atomic contacts with quantized conductance, and molecular adsorption effect

Synthesis and modelling of the mechanical properties of Ag, Au and Cu nanowires

The recent interest to nanotechnology aims not only at device miniaturisation, but also at understanding the effects of quantised structure in materials of reduced dimensions, which exhibit different properties from their bulk counterparts. In particular, quantised metal nanowires made of silver, gold or copper have attracted much attention owing to their unique intrinsic and extrinsic length-dependent mechanical properties. Here we review the current state of art and developments in these nanowires from synthesis to mechanical properties, which make them leading contenders for next-generation nanoelectromechanical systems. We also present theories of interatomic interaction in metallic nanowires, as well as challenges in their synthesis and simulation.

Copper Nanowires through Oriented Mesoporous Silica: A Step towards Protected and Parallel Atomic Switches

The formation of copper atomic contacts has been investigated. Copper nanowires were grown by electrochemical deposition, in the scanning electrochemical microscopy (SECM) configuration, from a platinum microelectrode to an indium tin oxide (ITO) substrate. Self-termination leaves copper filaments between the two electrodes with an atomic point contact at the ITO electrode. Histogram analysis shows that the conductance of this contact is close to, or less than, 1 G0. Atomic contacts were also fabricated on ITO electrodes covered with vertically-aligned mesoporous silica films. Scanning Transmission Electron Microscopy images show that copper filaments occupy individual isolated nanopores. Contacts generated on bare ITO break down rapidly in sodium salicylate, whereas those generated in ITO/nanopores are unaffected; the nanopores protect the copper filaments. Finally, atomic switch behaviour was obtained using these ITO and ITO/nanopores electrodes.

1D copper nanostructures: progress, challenges and opportunities

One-dimensional noble metal nanostructures are important components in modern nanoscience and nanotechnology due to their unique optical, electrical, mechanical, and thermal properties. However, their cost and scalability may become a major bottleneck for real-world applications. Copper, being an earth-abundant metallic element, is an ideal candidate for commercial applications. It is critical to develop technologies to produce 1D copper nanostructures with high monodispersity, stability and oxygen-resistance for future low-cost nano-enabled materials and devices. This article covers comprehensively the current progress in 1D copper nanostructures, most predominantly nanorods and nanowires. First, various synthetic methodologies developed so far to generate 1D copper nanostructures are thoroughly described; the methodologies are in conjunction with the discussion of microscopic, spectrophotometric, crystallographic and morphological characterizations. Next, striking electrical, optical, mechanical and thermal properties of 1D copper nanostructures are highlighted. Additionally, the emerging applications of 1D copper nanostructures in flexible electronics, transparent electrodes, low cost solar cells, field emission devices are covered, amongst others. Finally, there is a brief discussion of the remaining challenges and opportunities.