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For: He X, Azarian MH, Pecht MG. Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation. Electrochim Acta 2014. [DOI: 10.1016/j.electacta.2014.06.041] [Citation(s) in RCA: 10] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]

For:	He X, Azarian MH, Pecht MG. Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation. Electrochim Acta 2014. [DOI: 10.1016/j.electacta.2014.06.041] [Citation(s) in RCA: 10] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]

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Cited by Other Article(s)

Yan D, Wang Y, Liu J, Zhao D, Ming P, Song J. Electrochemical 3D printing of superhydrophobic pillars with conical, cylindrical, and inverted conical shapes. Colloids Surf A Physicochem Eng Asp 2021. [DOI: 10.1016/j.colsurfa.2021.126869] [Citation(s) in RCA: 15] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/03/2023]

The effect of organic additives for the prevention of copper electrochemical migration. J Electroanal Chem (Lausanne) 2019. [DOI: 10.1016/j.jelechem.2018.10.031] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/20/2022]

Zhong Z, Ali A, Jamal R, Simayi R, Xiang L, Ding S, Abdiryim T. Poly(EDOT-pyridine-EDOT) and poly(EDOT-pyridazine-EDOT) hollow nanosphere materials for the electrochemical detection of Pb2+and Cu2+. J Electroanal Chem (Lausanne) 2018. [DOI: 10.1016/j.jelechem.2018.05.022] [Citation(s) in RCA: 21] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]

Zhong X, Chen L, Medgyes B, Zhang Z, Gao S, Jakab L. Electrochemical migration of Sn and Sn solder alloys: a review. RSC Adv 2017. [DOI: 10.1039/c7ra04368f] [Citation(s) in RCA: 48] [Impact Index Per Article: 6.9] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/20/2022] Open