Electrochemical Micromachining under Mechanical Motion Mode

Ordered growth of metal oxides in patterned multi-angle microstructures

Herein, we report a facile method combining top-down patterning transfer and bottom-up nanorod growth for preparing large-area and ordered TiO₂ nanorod arrays. Pre-crystallization seeding was patterned with nanostructured morphologies via interfacial tension-driven precursor solution scattering on various types and period templates. This is a widely applicable strategy for capillary force-driven interfacial patterns, which also shows great operability in complex substrate morphologies with multiple-angle mixing. Moreover, the customized patterned lithographic templates containing English words, Arabic numerals, and Chinese characters are used to verify the applicability and controllability of this hybrid method. In general, our work provides a versatile strategy for the low-cost and facile preparation of hydrothermally growable metal oxide (e.g., ZnO and MnO₂) nanostructures with potential applications in the fields of microelectronic devices, photoelectric devices, energy storage, and photocatalysis.

Photoassisted Electrochemical Micropatterning of Gold Film

Electrochemical etching is a powerful and popular method for fabricating micropatterns on metal substrates for use in electronic devices, electrochemical sensors, and plasmonic substrates. In order to achieve micropatterning, either a prepatterned insulating layer (mask) or a scanning microelectrode is often required to selectively trigger electrochemical etching at the desired locations. In the present work, we employed a well-focused light beam to enable the photoassisted electrochemical etching of gold film with a spatial resolution close to the optical diffraction limit (∼300 nm). It was found that the simultaneous application of light irradiation and appropriate potential were critical for the oxidative dissolution (i.e., etching) of gold to occur. Superior controllability of light beam allowed for the direct-write micropatterning without the need of mask or probe. Etching kinetics and mechanism were also studied by monitoring the dynamic evolution of optical transparency with a conventional transmission bright-field microscope, together with characterizations on the as-obtained patterns with atomic force microscopy and electron microscopy. This study is anticipated to contribute a feasible method for the micropatterning of gold film with implications for nanoelectronics and electrochemical sensors.

Analysis on Machining Performance of Nickel-Base Superalloy by Electrochemical Micro-milling with High-Speed Spiral Electrode

As one of the most promising micro-machining methods, electrochemical micro-machining is widely used in the field of metal micro-structures. The electrochemical micro-milling on Nickel-base superalloy by using high-speed spiral electrode was studied in detail. Firstly, the electric field and flow field models of micro-electrochemical milling are established and analyzed by the finite element method. Then, the milling profile was predicted and the effect of high-speed rotation of electrodes on electrolyte promotion and secondary electrolysis prevention were analyzed. Secondly, the influence of the main machining parameters, such as rotating speed, electrical parameters, and feed rate on machining precision and efficiency was analyzed experimentally. Finally, by optimizing the machining parameters, a series of micro-graphic structures with a width of about 150 μm were obtained on Nickel-base superalloy 718 by using the spiral electrode with a diameter of 100 μm. The experimental and simulation results show that the high-speed rotation of electrodes can greatly improve the machining efficiency and stability. It was proved that micro-electrochemical milling with the high-speed rotating electrode technique is an effective method for machining micro-metal parts.

Experimental Research on Machining Localization and Surface Quality in Micro Electrochemical Milling of Nickel-Based Superalloy

Micro electrochemical machining is becoming increasingly important in the microfabrication of metal parts. In this paper, the machining characteristics of micro electrochemical milling with nanosecond pulse were studied. Firstly, a mathematical model for the localization control of micro electrochemical milling with nanosecond pulse was established. Secondly, groups of experiments were conducted on nickel-based superalloy and the effects of parameters such as applied voltage, pulse on time, pulse period, electrolyte concentration and electrode diameter on machining localization and surface roughness were analyzed. Finally, by using the optimized machining parameters, some 2D complex shapes and 3D square cavity structures with good shape precision and good surface quality were successfully obtained. It was proved that the micro electrochemical milling with nanosecond pulse technique is an effective machining method to fabricate metal microstructures.

Electrochemical micro/nano-machining: principles and practices

Micro/nano-machining (MNM) is becoming the cutting-edge of high-tech manufacturing because of the ever increasing industrial demands for super smooth surfaces and functional three-dimensional micro/nano-structures in miniaturized and integrate devices, and electrochemistry plays an irreplaceable role in MNM.

Confined Chemical Etching for Electrochemical Machining with Nanoscale Accuracy

In the past several decades, electrochemical machining (ECM) has enjoyed the reputation of a powerful technique in the manufacturing industry. Conventional ECM methods can be classified as electrolytic machining and electroforming: the former is based on anodic dissolution and the latter is based on cathodic deposition of metallic materials. Strikingly, ECM possesses several advantages over mechanical machining, such as high removal rate, the capability of making complex three-dimensional structures, and the practicability for difficult-to-cut materials. Additionally, ECM avoids tool wear and thermal or mechanical stress on machining surfaces. Thus, ECM is widely used for various industrial applications in the fields of aerospace, automobiles, electronics, etc. Nowadays, miniaturization and integration of functional components are becoming significant in ultralarge scale integration (ULSI) circuits, microelectromechanical systems (MEMS), and miniaturized total analysis systems (μ-TAS). As predicted by Moore's law, the feature size of interconnectors in ULSI circuits are down to several nanometers. In this Account, we present our perseverant research in the last two decades on how to "confine" the ECM processes to occur at micrometer or even nanometer scale, that is, to ensure ECM with nanoscale accuracy. We have been developing the confined etchant layer technique (CELT) to fabricate three-dimensional micro- and nanostructures (3D-MNS) on different metals and semiconductor materials since 1992. In general, there are three procedures in CELT: (1) generating the etchant on the surface of the tool electrode by electrochemical or photoelectrochemical reactions; (2) confining the etchant in a depleted layer with a thickness of micro- or nanometer scale; (3) feeding the tool electrode to etch the workpiece. Scavengers, which can react with the etchant, are usually adopted to form a confined etchant layer. Through the subsequent homogeneous reaction between the scavenger and the photo- or electrogenerated etchant in the electrolyte solution, the diffusion distance of the etchant is confined to micro- or nanometer scale, which ensures the nanoscale accuracy of electrochemical machining. To focus on the "confinement" of chemical etching reactions, external physical-field modulations have recently been introduced into CELT by introducing various factors such as light field, force field, hydrodynamics, and so on. Meanwhile, kinetic investigations of the confined chemical etching (CCE) systems are established based on the finite element analysis and simulations. Based on the obtained kinetic parameters, the machining accuracy is tunable and well controlled. CELT is now applicable for 1D milling, 2D polishing, and 3D microfabrication with an accuracy at nanometer scale. CELT not only inherits all the advantages of electrochemical machining but also provides advantages over photolithography and nanoimprint for its applicability to different functional materials without involving any photocuring and thermoplastic resists. Although there are some technical problems, for example, mass transfer and balance, which need to be solved, CELT has shown its prospective competitiveness in electrochemical micromachining, especially in the semiconductor industry.