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For: Chao YJ, Liu CR, Pan LS, Lee CL. Activity of Small Silver Nanocubes as Activators for Electroless Copper Deposition. Electrochim Acta 2015. [DOI: 10.1016/j.electacta.2015.04.161] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/23/2022]
Number Cited by Other Article(s)
1
Stohr T, Fischer A, Muench F, Antoni M, Wollstadt S, Lohaus C, Kunz U, Clemens O, Klein A, Ensinger W. Electroless Nanoplating of Pd−Pt Alloy Nanotube Networks: Catalysts with Full Compositional Control for the Methanol Oxidation Reaction. ChemElectroChem 2020. [DOI: 10.1002/celc.201901939] [Citation(s) in RCA: 9] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]
2
Huang J, Chen Z, Zhou F, Wang H, Yuan Y, Chen W, Gao M, Zhan Y. High-adhesive electroless copper plating on polyethylene surface modified with primer. J Solid State Electrochem 2017. [DOI: 10.1007/s10008-016-3503-1] [Citation(s) in RCA: 7] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
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