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Guo L, Li S, He Z, Fu Y, Qiu F, Liu R, Yang G. Electroplated Copper Additives for Advanced Packaging: A Review. ACS OMEGA 2024; 9:20637-20647. [PMID: 38764660 PMCID: PMC11097365 DOI: 10.1021/acsomega.4c01707] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 02/22/2024] [Revised: 04/07/2024] [Accepted: 04/22/2024] [Indexed: 05/21/2024]
Abstract
Acid copper electroplating stands as a core technology in advanced packaging processes, facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between transistors. The deposition quality of copper interconnect materials has a crucial impact on the final performance of chips, directly influencing their yield, reliability, and stability. In this intricate process, additives play a pivotal role in regulating the deposition quality and behavior of metal copper. This mini-review comprehensively summarizes the recent research progress in the field of electroplating copper additives for advanced packaging, both domestically and internationally, delving into the types and mechanisms of various additive molecules, including accelerators, inhibitors, and leveling agents. Through in-depth research on these additives, we gain a profound understanding of their specific roles in the electroplating process and the intricate interaction mechanisms among them, providing theoretical support for optimizing the electroplating process. Furthermore, this mini-review also delves into a thorough analysis of the current issues and challenges facing acid copper electroplating, exploring the key factors that constrain the further development of electroplating copper technology. Based on this analysis, we propose several potential solutions and research directions, offering crucial references for the development and application of electroplating copper additives in advanced packaging. In conclusion, this mini-review aims to provide a comprehensive perspective and profound understanding of the development and application of electroplating copper additives through a review and analysis of recent research progress, ultimately aiming to promote the further advancement of advanced packaging technology.
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Affiliation(s)
- Lanfeng Guo
- School
of Chemistry and Chemical Engineering, Chongqing
University, Chongqing 400044, China
- Hubei
Sinophorus Electronic Materials Co., Ltd., Hubei 443007, China
| | - Shaoping Li
- Hubei
Three Gorges Laboratory, Hubei 443007, China
| | - Zhaobo He
- Hubei
Sinophorus Electronic Materials Co., Ltd., Hubei 443007, China
| | - Yanmei Fu
- Hubei
Sinophorus Electronic Materials Co., Ltd., Hubei 443007, China
| | - Facheng Qiu
- College
of Chemistry and Chemical Engineering, Chongqing
University of Technology, Chongqing 400054, China
| | - Renlong Liu
- School
of Chemistry and Chemical Engineering, Chongqing
University, Chongqing 400044, China
| | - Guangzhou Yang
- College
of Chemistry and Chemical Engineering, Chongqing
University of Technology, Chongqing 400054, China
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2
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Li S, Ming P, Zhang J, Zhang Y, Yan L. Concurrently Fabricating Precision Meso- and Microscale Cross-Scale Arrayed Metal Features and Components by Using Wire-Anode Scanning Electroforming Technique. MICROMACHINES 2023; 14:mi14050979. [PMID: 37241603 DOI: 10.3390/mi14050979] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/30/2023] [Revised: 04/22/2023] [Accepted: 04/27/2023] [Indexed: 05/28/2023]
Abstract
In order to improve the thickness uniformity of the electroformed metal layer and components, a new electroforming technique is proposed-wire-anode scanning electroforming (WAS-EF). WAS-EF uses an ultrafine inert anode so that the interelectrode voltage/current is superimposed upon a very narrow ribbon-shaped area at the cathode, thus ensuring better localization of the electric field. The anode of WAS-EF is in constant motion, which reduces the effect of the current edge effect. The stirring paddle of WAS-EF can affect the fluid flow in the microstructure, and improve the mass transfer effect inside the structure. The simulation results show that, when the depth-to-width ratio decreases from 1 to 0.23, the depth of fluid flow in the microstructure can increase from 30% to 100%. Experimental results show that. Compared with the traditional electroforming method, the single metal feature and arrayed metal components prepared by WAS-EF are respectively improved by 15.5% and 11.4%.
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Affiliation(s)
- Shicheng Li
- School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China
| | - Pingmei Ming
- School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China
| | - Junzhong Zhang
- School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China
| | - Yunyan Zhang
- School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China
| | - Liang Yan
- School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China
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3
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Ren P, An M, Yang P, Zhang J. Inhibition of multi-site adsorption of polyethylene glycol during copper via-filling process. Colloids Surf A Physicochem Eng Asp 2022. [DOI: 10.1016/j.colsurfa.2022.129823] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022]
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Wang Q, Peng Y, Mou Y, Chen M. Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives. MICROMACHINES 2022; 13:1539. [PMID: 36144162 PMCID: PMC9505335 DOI: 10.3390/mi13091539] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 09/05/2022] [Revised: 09/14/2022] [Accepted: 09/15/2022] [Indexed: 06/16/2023]
Abstract
Interconnections are essential for integrating the packaging substrate, and defect-free copper-filling can further improve the reliability in through holes (THs). The coating properties and filling processes are mainly dominated by the interplays among additives in the direct current electroplating. The acidic copper sulfate electroplating solution contained three typical convection-dependent additives and chloride ions (Cl-). The THs with aspect ratios (ARs) of 6.25, 5, and 4.17 (thickness of 500 μm) were selected as the study subjects. The effects of Cl- and ARs on the interactions among the additives were investigated in detail using electrochemical measurements, which were verified by the THs filling experiments. The additive compounds present a convection enhanced inhibition effect and cathodic polarization, leading to a copper filling capacity increase with ARs and the amelioration of copper compactness and corrosion resistance. The defect-free copper filling of THs and a uniform mirror bright surface circuit can be achieved simultaneously using compound additives at a relatively high speed.
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Affiliation(s)
- Qing Wang
- School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
| | - Yang Peng
- School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
| | - Yun Mou
- School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
| | - Mingxiang Chen
- School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
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Preparation of ultra-thin sandwich Cu-Cu/CNTs-Cu composite foil with high tensile strength by electrodeposition. J Electroanal Chem (Lausanne) 2022. [DOI: 10.1016/j.jelechem.2022.116495] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022]
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Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating. COATINGS 2022. [DOI: 10.3390/coatings12070995] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
Abstract
The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board. We systematically investigated the effects of reverse pulse parameters in the period pulse reverse (PPR) plating on the uniformity and microstructure of the copper deposition, including reverse pulse frequency, reverse pulse duty cycle and reverse pulse current density. The Cu deposition behavior (throwing power) and its crystallographic characteristics, including grain size, crystallographic orientation, and grain boundary, were characterized by means of field-emission scanning electron microscopy (FE-SEM), X-ray diffractometer (XRD), and electron backscatter diffraction (EBSD). Our results clarify that the reverse pulse current density and duty ratio should be low to achieve the full filling and high uniformity of the through holes. The reverse pulse frequency of 1500 Hz would prevent the through holes to be fully filled. The copper electrodeposition in PTH prepared by double pulse electrodeposition has the good (111) surface texture and grain boundary distribution. This work demonstrated that the period pulse reverse (PPR) plating provides unique advantages in achieving the ultra-uniform copper deposition in the high aspect ratio plated through holes.
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Wang Q, Liu J, Lei Z, Mou Y, Chen M. Computational and experiments exploration of convection on Cu filling characteristics of multiple aspect-ratio micro through-holes. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140218] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022]
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Ho VC, Lim H, Kim MJ, Mun J. Improving the Performance of Aqueous Zinc-ion Batteries by Inhibiting Zinc Dendrite Growth: Recent Progress. Chem Asian J 2022; 17:e202200289. [PMID: 35546083 DOI: 10.1002/asia.202200289] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/21/2022] [Revised: 05/03/2022] [Indexed: 11/07/2022]
Abstract
Aqueous zinc-ion batteries (ZIBs) are promising candidates for the next-generation high-energy storage devices, owing to their resource availability, low cost, eco-friendliness, and high safety. The zinc (Zn) metal anode in a suitable battery system, including an electrolyte and a high-performance cathode electrode, can deliver an excellent electrochemical performance. However, several obstacles must be overcome to utilize aqueous ZIBs. Among these, Zn dendrite growth, corrosion, and side reactions severely impair the performance of rechargeable ZIBs. To deal with these issues, a profound understanding of the mechanism of the matter occurring in electrochemical cycles is essential to thoroughly solve the challenges. Instead of focusing solely on techniques for improving the performance of Zn metal anodes, this review delves into and summarizes the causes of side reactions and dendrite formation, thereby establishing a logical system of methodologies for improving the electrochemical performance of mild aqueous ZIBs. The correlation between the Zn metal anode, aqueous electrolyte, separators and the performance of ZIBs is also discussed in detail. There is also a brief perspective on the future development of Zn metal anodes in aqueous solutions. This study sheds a light on the challenges associated with the construction of high-performance ZIBs, which will significantly aid in their practical implementation.
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Affiliation(s)
- Van-Chuong Ho
- School of Advanced Materials Science & Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419 (Republic of, Korea
| | - Hana Lim
- Department of Applied Chemistry, Kyung Hee University, 1732, Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, Korea
| | - Myung Jun Kim
- Department of Applied Chemistry, Kyung Hee University, 1732, Deogyeong-daero, Giheung-gu, Yongin-si, Gyeonggi-do, 17104, Korea
| | - Junyoung Mun
- School of Advanced Materials Science & Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419 (Republic of, Korea
- SKKU Institute of Energy Science and Technology (SIEST), SungkyunKwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419 (Republic of, Korea
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Li WQ, Jin L, Yang JQ, Wang ZY, Zhan D, Yang FZ, Tian ZQ. Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination agents. ChemElectroChem 2022. [DOI: 10.1002/celc.202200423] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]
Affiliation(s)
- Wei-Qing Li
- Xiamen University College of Chemistry and Chemical Engineering CHINA
| | - Lei Jin
- Xiamen University College of Chemistry and Chemical Engineering CHINA
| | - Jia-Qiang Yang
- Xiamen University College of Chemistry and Chemical Engineering CHINA
| | - Zhao-Yun Wang
- Xiamen University College of Chemistry and Chemical Engineering CHINA
| | - Dongping Zhan
- Xiamen University College of Chemistry and Chemical Engineering CHINA
| | - Fang-Zu Yang
- Xiamen University College of Chemistry and Chemical Engineering No. 422, Siming South Road 361005 Xiamen, Fujian CHINA
| | - Zhong-Qun Tian
- Xiamen University College of Chemistry and Chemical Engineering CHINA
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Sun Y, Pan J, Liu L, Fang Y, Han G, Liu J. Improvement of performance stability of electrolytic copper foils by bi-component additives. J APPL ELECTROCHEM 2022. [DOI: 10.1007/s10800-022-01707-9] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
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11
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Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140018] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
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12
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Han M, Uk Yoo B, Kim M, Lee JY, Hwan Lee K, Ho Park Y, Choe S. In-line detection of Cu+-related species in aged Cu plating bath using flow cell-based electrochemical method. J Electroanal Chem (Lausanne) 2021. [DOI: 10.1016/j.jelechem.2021.115696] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
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13
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Wei XF, Zhu QS, Guo JD, Shang JK. Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor. J Solid State Electrochem 2021. [DOI: 10.1007/s10008-021-05055-0] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
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14
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Unveiling the synergistic inhibition of Cl− copper plating: Pivotal roles of adsorption and desorption. J Electroanal Chem (Lausanne) 2021. [DOI: 10.1016/j.jelechem.2021.115624] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
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15
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Zhang Y, An M, Yang P, Zhang J. Recent Advances in Electroplating of Through-Hole Copper Interconnection. Electrocatalysis (N Y) 2021. [DOI: 10.1007/s12678-021-00687-2] [Citation(s) in RCA: 6] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
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16
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Effect of the macro- and microthrowing power of the electrolyte on the uniformity of distribution of electroplated copper in through-holes for PCB. J Solid State Electrochem 2021. [DOI: 10.1007/s10008-021-04922-0] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022]
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17
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The effect of tricyclazole as a novel leveler for filling electroplated copper microvias. J Electroanal Chem (Lausanne) 2018. [DOI: 10.1016/j.jelechem.2018.08.042] [Citation(s) in RCA: 22] [Impact Index Per Article: 3.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022]
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Li Y, Hu W, Sun Y, Wang Z, Mosleh A. A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism. MATERIALS 2017; 10:ma10040382. [PMID: 28772743 PMCID: PMC5506925 DOI: 10.3390/ma10040382] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 02/15/2017] [Revised: 03/28/2017] [Accepted: 03/29/2017] [Indexed: 11/16/2022]
Abstract
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration. In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
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Affiliation(s)
- Yaqiu Li
- Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China.
| | - Weiwei Hu
- Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China.
- B. John Garrick Institute for the Risk Sciences, University of California, Los Angeles, CA 90095, USA.
| | - Yufeng Sun
- Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China.
| | - Zili Wang
- Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China.
| | - Ali Mosleh
- B. John Garrick Institute for the Risk Sciences, University of California, Los Angeles, CA 90095, USA.
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