Electrochemical aspects of tin electrodeposition on copper in acid solutions

Morphology and Structure of Electrolytically Synthesized Tin Dendritic Nanostructures

The formation of tin dendritic nanostructures by electrolysis from the alkaline electrolyte has been investigated. Morphology and structure of Sn dendrites produced applying both potentiostatic and galvanostatic regimes of the electrolysis are characterized by SEM and XRD, respectively. Depending on the applied cathodic potentials, three types of Sn dendrites were obtained: (a) needle-like and spear-like, (b) fern-like, and (c) stem-like dendrites. The very branchy dendrites with branches of the prismatic shape obtained by the galvanostatic regime of electrolysis represented a novel type of Sn dendrites, not previously reported in the literature. To explain the formation of various dendritic forms, correlation with the polarization characteristics for this electrodeposition system is considered. The needle-like and the spear-like dendrites represented monocrystals of (200),(400) preferred orientation, the fern-like dendrites exhibited the predominant (220),(440) preferred orientation, while in the stem-like particles Sn crystallites were oriented to a greater extent in the (440) crystal plane than in other planes. The galvanostatically synthesized Sn particles possessed the strong (200),(400) preferred orientation. The strong influence of parameters and regimes of electrodeposition on structural characteristics of Sn dendrites is explained by the fundamental laws of electrocrystallization taking into consideration the concept of slow-growing and fast-growing crystal planes.

Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride–Urea Deep Eutectic Solvents

The electrochemical behavior and electrodeposition of Sn were investigated in choline chloride (ChCl)–urea deep eutectic solvents (DESs) containing SnCl2 by cyclic voltammetry (CV) and chronoamperometry techniques. The electrodeposition of Sn(II) was a quasi-reversible, single-step two-electron-transfer process. The average transfer coefficient and diffusion coefficient of 0.2 M Sn(II) in ChCl–urea at 323 K were 0.29 and 1.35 × 10−9 cm2∙s−1. The nucleation overpotential decreased with the increase in temperature and SnCl2 concentration. The results of the chronoamperometry indicated that the Sn deposition on tungsten electrode occurred by three-dimensional instantaneous nucleation and diffusion controlled growth using the Scharifker–Hills model. Scanning electron microscopy (SEM) showed that the morphology of the deposits is uniform, as a dense and compact film prepared by potentiostatic electrolysis on Cu substrate. X-ray diffraction (XRD) analysis revealed that the deposits were pure metallic Sn.

Quasiperiodic behavior in the electrodeposition of Cu/Sn multilayers: extraction of activation energies and wavelet analysis

The oscillatory electro-deposition of Cu/Sn in the presence of a surfactant shows quasiperiodic behavior, which is described by the coupling between a mainly activation and a mainly diffusion-controlled processes.