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For: Onabuta Y, Kunimoto M, Nakai H, Homma T. First-principle study of the oxidation mechanism of formaldehyde and hypophosphite for copper and nickel electroless deposition process. Electrochim Acta 2019;307:536-42. [DOI: 10.1016/j.electacta.2019.03.150] [Citation(s) in RCA: 8] [Impact Index Per Article: 1.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]
Number Cited by Other Article(s)
1
Hu G, Huang R, Wang H, Zhao Q, Zhang X. Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating. J Solid State Electrochem 2022. [DOI: 10.1007/s10008-022-05172-4] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/30/2022]
2
Muench F. Electroless Plating of Metal Nanomaterials. ChemElectroChem 2021. [DOI: 10.1002/celc.202100285] [Citation(s) in RCA: 6] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/21/2022]
3
Wu B, Tan B, Tan G, Zeng M, Luo J, Hu G, Luo J, Hao Z, Lai S, Liu B. Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent. RSC Adv 2021;11:39153-39168. [PMID: 35492463 PMCID: PMC9044480 DOI: 10.1039/d1ra07952b] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/29/2021] [Accepted: 12/01/2021] [Indexed: 11/21/2022]  Open
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