1
|
Miao L, Zhan L, Liao S, Li Y, He T, Yin S, Wu L, Qiu H. The Recent Advances of Polymer-POSS Nanocomposites With Low Dielectric Constant. Macromol Rapid Commun 2024; 45:e2300601. [PMID: 38232689 DOI: 10.1002/marc.202300601] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/11/2023] [Revised: 12/22/2023] [Indexed: 01/19/2024]
Abstract
This study provides a comprehensive overview of the preparation methods for polyhedral oligomeric silsesquioxane (POSS) monomers and polymer/POSS nanocomposites. It focuses on the latest advancements in using POSS to design polymer nanocomposites with reduced dielectric constants. The study emphasizes exploring the potential of POSS, either alone or in combination with other materials, to decrease the dielectric constant and dielectric loss of various polymers, including polyimides, bismaleimide resins, poly(aryl ether)s, polybenzoxazines, benzocyclobutene resins, polyolefins, cyanate ester resins, and epoxy resins. In addition, the research investigates the impact of incorporating POSS on improving the thermal properties, mechanical properties, surface properties, and other aspects of these polymers. The entire study is divided into two parts, discussing systematically the role of POSS in reducing dielectric constants during the preparation of POSS composites using both physical blending and chemical synthesis methods. The goal of this research is to provide valuable strategies for designing a new generation of low dielectric constant materials suitable for large-scale integrated circuits in the semiconductor materials domain.
Collapse
Affiliation(s)
- Li Miao
- Key Laboratory of Organosilicon Chemistry and Materials Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| | - Lingling Zhan
- Key Laboratory of Organosilicon Chemistry and Materials Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| | - Shenglong Liao
- School of engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| | - Yang Li
- Key Laboratory of Organosilicon Chemistry and Materials Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| | - Tian He
- Key Laboratory of Organosilicon Chemistry and Materials Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| | - Shouchun Yin
- Key Laboratory of Organosilicon Chemistry and Materials Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| | - Lianbin Wu
- Key Laboratory of Organosilicon Chemistry and Materials Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| | - Huayu Qiu
- Key Laboratory of Organosilicon Chemistry and Materials Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou, 311121, P.R. China
| |
Collapse
|
2
|
Li H, Wang X, Gong Y, Zhao H, Liu Z, Tao L, Peng Y, Ma K, Hu Z, Dastan D. Polyimide/crown ether composite film with low dielectric constant and low dielectric loss for high signal transmission. RSC Adv 2023; 13:7585-7596. [PMID: 36908549 PMCID: PMC9993404 DOI: 10.1039/d2ra07043j] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/06/2022] [Accepted: 02/21/2023] [Indexed: 03/14/2023] Open
Abstract
Dielectric properties of polyimide (PI) are constrained by its inherent molecular structure and inter-chain packing capacities. The compromised dielectric properties of PI, however, could be rescued by introducing trifluoromethyl and forming a host-guest inclusion complex with the introduction of crown ethers (CEs). Herein, we report PI/crown ether composite films as a communication substrate that could be applied under high frequency circumstances. In this work, three kinds of bisphenol A-containing diamine (2,2'-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(2-methyl-4-aminophenoxy)phenyl]propane, and 2,2-bis[4-(2-trifluoro methyl-4-aminophenoxy)phenyl]propane) are synthesized and polymerized with 4,4'-(hexafluoroisopropylidene)diphthalic anhydride to prepare low-dielectric PI films by means of thermal imidization. Crown ethers are introduced into the PI with different mass fractions to obtain three series of PI films. Following the combination of trifluoromethyl into the molecular chain of PI, high frequency dielectric loss of modified PI films can be effectively reduced. The properties of these materials (especially the dielectric properties) are thoroughly explored by crown ether addition. The results show that the crown ether addition process can offer crown ethers with increased free volume of PI matrix, thus allowing them to generate a special necklace-like supramolecular structure, which makes the crown ether disperse more uniformly in the PI matrix, resulting in improved dielectric properties. Importantly, the dielectric constant and dielectric loss of the composite films at high frequencies are remarkably reduced to 2.33 and 0.00337, respectively. Therefore, these composite films are expected to find extensive use as a 5G communication substrate at high frequencies in the future.
Collapse
Affiliation(s)
- Heming Li
- School of Chemical Engineering, University of Science and Technology Liaoning Anshan 114051 China
| | - Xinming Wang
- School of Chemical Engineering, University of Science and Technology Liaoning Anshan 114051 China
| | - Yuze Gong
- School of Chemical Engineering, University of Science and Technology Liaoning Anshan 114051 China .,Sinochem LantianFluoro Materials Co., Ltd China
| | - Hongbin Zhao
- School of Chemical Engineering, University of Science and Technology Liaoning Anshan 114051 China .,Oxiranchem Holding Group Co. Ltd Liaoyang 111003 China
| | - Zhaobin Liu
- Oxiranchem Holding Group Co. Ltd Liaoyang 111003 China
| | - Lin Tao
- School of Chemical Engineering, University of Science and Technology Liaoning Anshan 114051 China
| | - Youyou Peng
- Montverde Future Academy Shanghai 88 jianhao Road, Pudong New District Shanghai 201318 China
| | - Ke Ma
- School of Chemical Engineering, University of Science and Technology Liaoning Anshan 114051 China
| | - Zhizhi Hu
- School of Chemical Engineering, University of Science and Technology Liaoning Anshan 114051 China .,Oxiranchem Holding Group Co. Ltd Liaoyang 111003 China
| | - Davoud Dastan
- Department of Materials Science and Engineering, Cornell University Ithaca NY 14850 USA
| |
Collapse
|
3
|
Ultra-low-permittivity, high hydrophobic, and excellent thermally stable fluoroelastomer/polyimide composite films employing dielectric reduction. Eur Polym J 2022. [DOI: 10.1016/j.eurpolymj.2022.111667] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
|