Reference Citation Analysis: Find an Article, Find a Category, Find a Journal, Find a Scholar

For: Tan W, He H, Gao Y, Peng Y, Dai X. Nucleation and growth mechanisms of an electrodeposited Ni-Se-Cu coating on nickel foam. J Colloid Interface Sci 2021;600:492-502. [PMID: 34023707 DOI: 10.1016/j.jcis.2021.05.002] [Citation(s) in RCA: 7] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/14/2021] [Revised: 04/19/2021] [Accepted: 05/01/2021] [Indexed: 11/15/2022]

For:	Tan W, He H, Gao Y, Peng Y, Dai X. Nucleation and growth mechanisms of an electrodeposited Ni-Se-Cu coating on nickel foam. J Colloid Interface Sci 2021;600:492-502. [PMID: 34023707 DOI: 10.1016/j.jcis.2021.05.002] [Citation(s) in RCA: 7] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/14/2021] [Revised: 04/19/2021] [Accepted: 05/01/2021] [Indexed: 11/15/2022]

Number	Cited by Other Article(s)
1	El Haimer C, Lghazi Y, Bahar J, Youbi B, Ait Himi M, Aynaou A, Bimaghra I. Electrochemical properties of Bi2Se3 layers semiconductor elaborated by electrodeposition. J Electroanal Chem (Lausanne) 2022. [DOI: 10.1016/j.jelechem.2022.116906] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/31/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse
2	Regulating the electronic structure of Fe-based metal organic frameworks by electrodeposition of Au nanoparticles for electrochemical overall water splitting. J Colloid Interface Sci 2022;626:426-434. [DOI: 10.1016/j.jcis.2022.06.163] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/28/2022] [Revised: 06/27/2022] [Accepted: 06/28/2022] [Indexed: 02/05/2023] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse
3	Zhou J, Meng X, Ouyang P, Zhang R, Liu H, Xu C, Liu Z. Electrochemical behavior and electrodeposition of Fe-Co-Ni thin films in choline chloride/urea deep eutectic solvent. J Electroanal Chem (Lausanne) 2022. [DOI: 10.1016/j.jelechem.2022.116516] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse
4	The Synergistic Effects of Additives on the Micro Vias Copper Filling. J Electroanal Chem (Lausanne) 2022. [DOI: 10.1016/j.jelechem.2022.116456] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse
5	Liu W, Tan W, He H, Yang Y. Electrodeposition of self–supported Ni–Mg–La electrocatalyst on Ni foam for efficient hydrogen evolution reaction. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140058] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse