The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

Toxicological analysis of Eisenia fetida in soil under the coexistence of rockwool substrate andtricyclazole

This study investigated the combined effects of rockwool, a novel seedling substrate, and tricyclazole (TCA) on the bioavailability of TCA to Eisenia fetida. The single addition of rockwool and TCA alone to the soil inhibited the growth of E. fetida. A high concentration (300 mg·L-1) of TCA significantly decreased the biomass of E. fetida. The addition of 20-mesh rockwool reduced this effect on earthworm biomass by decreasing the soil TCA through adsorption, effectively mitigating TCA bioaccumulation in earthworms. A mechanistic analysis showed that the Mg-O functional group on the rockwool surface combined with the CC functional group in TCA to generate Mg-O-C, and the adsorption process was dominated by chemisorption. Toxicology experiments demonstrated that malondialdehyde and cellulase could be used as biomarkers of inhibitory effects of combined rockwool and TCA in soil on E. fetida. Macrogenomic analyses revealed that small particle sizes and high concentrations of rockwool caused co-stress effects on earthworms when TCA was present. When the particle size of rockwool increased, the toxic effect of TCA on earthworms instead decreased at higher rockwool concentrations. Therefore, in practical agricultural production, the particle size of rockwool can be controlled to realize the adsorption of TCA and reduce the toxic effects of TCA and rockwool on earthworms.

Electroplated Copper Additives for Advanced Packaging: A Review

Acid copper electroplating stands as a core technology in advanced packaging processes, facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between transistors. The deposition quality of copper interconnect materials has a crucial impact on the final performance of chips, directly influencing their yield, reliability, and stability. In this intricate process, additives play a pivotal role in regulating the deposition quality and behavior of metal copper. This mini-review comprehensively summarizes the recent research progress in the field of electroplating copper additives for advanced packaging, both domestically and internationally, delving into the types and mechanisms of various additive molecules, including accelerators, inhibitors, and leveling agents. Through in-depth research on these additives, we gain a profound understanding of their specific roles in the electroplating process and the intricate interaction mechanisms among them, providing theoretical support for optimizing the electroplating process. Furthermore, this mini-review also delves into a thorough analysis of the current issues and challenges facing acid copper electroplating, exploring the key factors that constrain the further development of electroplating copper technology. Based on this analysis, we propose several potential solutions and research directions, offering crucial references for the development and application of electroplating copper additives in advanced packaging. In conclusion, this mini-review aims to provide a comprehensive perspective and profound understanding of the development and application of electroplating copper additives through a review and analysis of recent research progress, ultimately aiming to promote the further advancement of advanced packaging technology.

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler. Galvanostatic Measurements (GMs), Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) tests were carried out to investigate the electrochemical behaviors of HPTT and its synergistic effect with other additives, in comparison with 1-phenyltetrazole-5-thione (PMT). GMs showed a convection-dependent interaction between PEP and HPTT. LSV and EIS tests indicated both HPTT and PMT enhanced the inhibition effect of PEP, and the synergistic effect of HPTT and PEP was stronger than that of PMT. Cross-section images illustrated the filling rate of the microvia with a 150 μm diameter and a 75 μm depth was 95.6% in 60 minutes with HPTT as the leveler. Frontier Molecular Orbitals (FMO) and Electrostatic Potential (ESP) of HPTT and PMT using quantum chemical calculations predicted the reaction sites for electrophilic and nucleophilic attack. Quantum chemical calculations suggested that HPTT is easier than PMT to bond to a copper surface and PEP.

Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler.