Fracture toughness of the novel in-situ polytriazolesulfone modified epoxy resin for carbon fiber/epoxy composites

Molecular dynamics study on the influence of thermal aging on the mechanical properties of epoxy resins for high voltage bushing

CONTEXT

Thermal aging significantly deteriorates the mechanical properties and service performance of epoxy resins used for the high-voltage bushing. Current studies on the thermal aging behavior of epoxy resins mainly focus on experimental observations. However, an in-depth understanding of the mechanism of thermal aging of epoxy resins requires the monitoring of structural evolution of epoxy resins during thermal aging at the molecular level. To thoroughly analyze the intrinsic factors affecting structural evolution and the effect of thermal aging on the mechanical properties of epoxy resin for high-voltage bushing, epoxy resin models with different crosslinking degrees were established and thermal aging treatments at various temperatures and time periods were carried out by molecular dynamics simulation. It was found that the tensile strength of the epoxy resin was enhanced with the increase of the crosslinking degree, which was related to the elevation of the proportion of C-N and O-H bonds in its structure. With the increase of thermal aging temperature, the tensile strength of the epoxy resin decreased, which was related to the formation of weak bonds. At the early stage of thermal aging and after a period of high-temperature thermal aging, the strength of epoxy resin significantly decreases. The thermal aging of the epoxy resin is accelerated under external loading. In addition, the crosslinking degree and curing agent also affect the thermal aging resistance of epoxy resins. The results of this study can provide guidance for predicting and improving the thermal aging resistance of epoxy resins.

METHODS

Materials Studio was used to construct molecular models and complete crosslinking reactions. DGEBA and 44DDS (or 33DDS) were mixed at a ratio of 2:1, followed by crosslinking reaction. During this process, the Nose method was used to control temperature, the Berendsen method was used to control pressure, and the polymer consistent force field (PCFF) was used to control the motion and force of atoms. Isobaric-isothermal ensemble (NPT ensemble) was used to heat up epoxy resin models to various thermal aging temperatures of 400 K, 500 K, 600 K and 700 K. The models were maintained at these temperatures for different thermal aging times of 100 ps, 200 ps, 300 ps, 400 ps, 500 ps, 600 ps, 700 ps and 800 ps. Afterwards, the models were cooled down to 300 K and subjected to uniaxial tensile testing at this temperature with a strain rate of 1 × 109 s-1. The structural configurations and stress-strain data during the tensile process were recorded. The flow stress of the material was derived by counting the average stress in the 20-50% strain interval.

Experimental and Numerical Investigation on Pile Foundation Underpinning Structure System in Urban Overpass

In view of the complexity of the pile foundation underpinning structure system and the stringent requirements of the construction process, this paper briefly describes the necessity of introducing epoxy resin reinforcing adhesive of planting rebar in the design of pile foundation underpinning beam structure to improve the mechanical properties of the reinforced beam new and old concrete joint surfaces and proposes a new type of pile foundation replacement beam system construction method by "chiseling + prestressed reinforcement + epoxy resin reinforcing adhesive". This paper uses an actual pile foundation underpinning project of an urban overpass as a prototype, designs and creates a model structure with a similarity ratio of 1/6, and performs repeated progressive static loading tests to study the load carrying capacity, displacement change, and other properties of the strengthened replacement structure, as well as analyses and distorts the overall working performance and failure mode of them. On this basis, the prototype structure's finite element analysis model was built, and the finite element analysis results were compared with the test results to obtain the mechanical properties and deformation characters of the actual pile foundation underpinning structure system corresponding to the actual underpinning beam load. This paper's study can lay the theoretical and experimental foundation for the smooth development of similar projects.

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

In this research, diglycidyl ethers of bisphenol-A (BADGE) and polyethylene glycol (PEGDGE) were binarily cured with a mixture of diamine curing agents including isophorone diamine and polyethylene glycol diamine (PEGDA) in the absence/presence of aminated graphene oxide nanoplatelets (AGNPs, 0.5 wt.%). Four molar ratios of diglycidyl ethers and curing agents were used stoichiometrically in isothermal curing systems. The films prepared from the epoxy networks were entirely strong and pliable. All epoxy thermosets were evaluated using field emission-scanning electron microscopy (FE-SEM), Fourier transform infrared (FT-IR) spectroscopy, X-ray diffraction (XRD), and diffuse reflectance-ultraviolet/visible spectroscopy (DR-UV/vis). The absorption coefficients of the epoxy and AGNPs-loaded epoxy materials decreased with increasing the molar ratio of PEGDGE resin and polyethylene glycol diamine curing agent. According to dynamic mechanical analysis no phase heterogeneity occurred in the structure of the prepared thermostats. When the thermoset materials were loaded by AGNPs filler, the peaks associated with alpha relaxations shifted to higher temperatures. Moreover, thermogravimetric analysis demonstrated that the thermal stability of the prepared epoxy thermosets slightly increased after the addition of the nanoplatelets. In addition, the thermal resistance of the prepared thermosets decreased to some extent by increasing the participation rate of monomers containing polyoxyethylene.

Self-extracted corn-stalk cellulose/epoxy resin composites

In order to make full use of crop waste stalk, corn-stalk cellulose (CSC) was extracted by acid-base method and used as modifier of epoxy resin (E51) to prepare the self-extracted corn-stalk cellulose/epoxy resin composites (CSCEC). Differential scanning calorimeter (DSC), thermogravimetry (TG) analysis, dynamic mechanical analysis (DMA), morphology analysis by scanning electron microscope (SEM), the mechanical properties by electronic universal testing machine and impact testing machine were used for characterization and analysis. The experimental results showed that when the CSC content was 20 wt%, the impact strength of the composite was 2.50 kJ/m², which was 127.2% higher than that of pure epoxy resin. When the CSC content was 20 wt%, the Tg of epoxy resin obtained by DMA was the lowest, 167.4 °C, which decreased by 11.3 °C compared with that of pure epoxy resin. The SEM result showed that the fracture surface of the composite became obviously rough and had of obvious folds, which was a ductile fracture. These results indicated that the addition of CSC could toughen the epoxy resin.

Tribological and thermal characteristics of epoxy-based composites by incorporating polyaryletherketone

Current research work focuses on the tribological and thermal properties of epoxy resin matrix composites, which were modified by polyaryletherketone (PAEK-C). The results of the infrared spectra and morphologies of fracture surfaces experiments corroborate the successful synthesis of the materials. From the tribological experiments, it can be known that when the mass fraction of PAEK-C was 10 phr., the corresponding composite exhibited the outstanding wear performances, which could be ascribed to the higher H/E ratio. Based on the results of tribological experiments, it could be obtained that the main wear mechanism is governed by combination of the plastic deformation, creation of vertical cracks in the sliding track, separation of debris, and material waves due to adhesions. In addition, the glass transition temperatures ( Tg) and heat-resistance index ( THRI) of the PAEK-C/epoxy resin higher than those of pure epoxy resin matrix, respectively. Furthermore, when the mass fraction of PAEK-C increased, the heat resistance index ( THRI) of the corresponding composite is 196.3°C, which is higher than that of neat epoxy resin (180.9°C). Also, according to the results of thermogravimetric analysis experiments, it could conclude that the activation energy of the curing process is situated in the range of 150–160 kJ mol−1 depending on the mass fraction of epoxy resins.

Preparation of environment-friendly solid epoxy resin with high-toughness via one-step banburying

Solid epoxy resin is highly desired in adhesives, electronic materials and coatings due to the attractive characteristics of solvent-free, highly efficient utilization and convenient storage and transportation. However, the challenges remain in fabricating high-toughness solid epoxy resin through a facile and efficient way. Here, a high-performance environment-friendly solid epoxy resin was fabricated by employing maleic anhydride grafted ethylene-vinyl acetate copolymer (EVA-g-MAH) as the flexibilizer via one-step banburying method. The results showed that the modified epoxy resin maintained a high glass transition temperature (T_g) and thermal stability, while its impact strength, tensile toughness and flexural toughness were significantly increased compared with the neat epoxy resin. The impact strength, tensile toughness and flexural toughness of R-EM10 are improved 138%, 195% and 149%, respectively. The EVA-g-MAH was introduced in the epoxy matrix as a separate phase to increase toughness via transfer stress and dissipated energy. The attractive properties of this facile fabrication process and the high-toughness, as well as the environment-friendly performance make this solid epoxy highly promising for large-scale industrial application.

High-toughness and environment-friendly solvent free solid epoxy resin through a low-cost, facile and large-scale fabrication process.

Comparative Study on Toughening Effect of PTS and PTK in Various Epoxy Resins

This study investigated the toughening effect of in situ polytriazoleketone (PTK) and polytriazolesulfone (PTS) toughening agent when applied to various epoxy resins, such as diglycidyl ether of bisphenol A (DGEBA), diglycidyl ether of bisphenol F (DGEBF), and triglycidyl p-aminophenol (TGAP) with 3,3'-diaminodiphenylsulfone as a curing agent. The fracture toughness, tensile properties, and thermal properties of the prepared epoxy samples were evaluated and compared. When PTK was mixed with DGEBF, the fracture toughness was improved by 27% with 8.6% increased tensile strength compared to the untoughened DGEBF. When PTS was mixed with TGAP, the fracture toughness was improved by 51% without decreasing tensile properties compared to the untoughened TGAP. However, when PTK or PTS was mixed with other epoxy resins, the fracture toughness decreased or improved with decreasing tensile properties. This is attributed to the poor miscibility between the solid-state monomer of PTK (4,4'-bis(propynyloxy)benzophenone (PBP)) or PTS (4,4'-sulfonylbis(propynyloxy)benzene (SPB)) and the epoxy resin, resulting in the polymerization of low molecular weight PTK or PTS in epoxy resin. Therefore, the toughening effect of PTK or PTS can be maximized by the appropriate selection of epoxy resin based on the miscibility between PBP or SPB and the resin.

Rapid Preparation of MWCNTs/Epoxy Resin Nanocomposites by Photoinduced Frontal Polymerization

Due to their excellent mechanical and thermal properties and medium resistance, epoxy/carbon nanotubes and nanocomposites have been widely used in many fields. However, the conventional thermosetting process is not only time- and energy-consuming, but also causes the agglomeration of nanofillers, which leads to unsatisfactory properties of the obtained composites. In this study, multi-walled carbon nanotubes (MWCNTs)/epoxy nanocomposites were prepared using UV photoinduced frontal polymerization (PIFP) in a rapid fashion. The addition of MWCNTs modified by a surface carboxylation reaction was found to enhance the impact strength and heat resistance of the epoxy matrix effectively. The experimental results indicate that with 0.4 wt % loading of modified MWCNTs, increases of 462.23% in the impact strength and 57.3 °C in the glass transition temperature Tg were achieved. A high-performance nanocomposite was prepared in only a few minutes using the PIFP approach. Considering its fast, energy-saving, and environmentally friendly production, the PIFP approach displays considerable potential in the field of the fast preparation, repair, and deep curing of nanocomposites and coatings.