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Shao Y, Yan J, Zhi Y, Li C, Li Q, Wang K, Xia R, Xiang X, Liu L, Chen G, Zhang H, Cai D, Wang H, Cheng X, Yang C, Ren F, Yu Y. A universal packaging substrate for mechanically stable assembly of stretchable electronics. Nat Commun 2024; 15:6106. [PMID: 39030235 PMCID: PMC11271615 DOI: 10.1038/s41467-024-50494-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/13/2024] [Accepted: 07/10/2024] [Indexed: 07/21/2024] Open
Abstract
Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries. The key design of the substrate was to introduce module-specific stretchability and universal adhesiveness by regionally tuning the bulk molecular mobility and surface molecular polarity of a near-hermetic elastic polymer matrix. The packaging substrate can customize the deformation of different modules while avoiding delamination upon stretching up to 600%. Based on this substrate, we fabricated a fully stretchable bioelectronic device that can serve as a respiration sensor or an electric generator with an in vivo lifetime of 10 weeks. This substrate could be a versatile platform for device assembly.
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Affiliation(s)
- Yan Shao
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
- School of Materials Science and Engineering, Yancheng Institute of Technology, Yancheng, 224051, China
| | - Jianfeng Yan
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Yinglin Zhi
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Chun Li
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Qingxian Li
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Kaimin Wang
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Rui Xia
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Xinyue Xiang
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Liqian Liu
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Guoli Chen
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Hanxue Zhang
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Daohang Cai
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Haochuan Wang
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Xing Cheng
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Canhui Yang
- Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, 518055, China
| | - Fuzeng Ren
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
| | - Yanhao Yu
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
- Guangdong Provincial Key Laboratory of Sustainable Biomimetic Materials and Green Energy, Southern University of Science and Technology, Shenzhen, 518055, China.
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Liao T, Wu J, Tang Z, Su Q, Huang Z, Gu Y, Li Y, Xie J, Lin X, Yi G. Construction of sacrificial network in styrene-ethylene/butadiene-styrene triblock copolymer composites and their mechanical behaviors. JOURNAL OF MACROMOLECULAR SCIENCE PART A-PURE AND APPLIED CHEMISTRY 2021. [DOI: 10.1080/10601325.2021.1967170] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
Affiliation(s)
- Tingting Liao
- School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China
| | - Jianyu Wu
- School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China
| | - Zilun Tang
- School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China
| | - Qiuping Su
- School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China
| | - Zhiyi Huang
- School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China
| | - Yuxin Gu
- Kinte Material Technology Co., Ltd, Dongguan, China
| | - Yong Li
- Kinte Material Technology Co., Ltd, Dongguan, China
| | - Jing Xie
- Kinte Material Technology Co., Ltd, Dongguan, China
| | - Xiaofeng Lin
- School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China
| | - Guobin Yi
- School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China
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