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For: Wang L, Wang M, Lu J, Ardhi REA, Liu J, Liu G, Lee JK. Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits. J Taiwan Inst Chem Eng 2019;95:202-7. [DOI: 10.1016/j.jtice.2018.07.003] [Citation(s) in RCA: 8] [Impact Index Per Article: 1.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/22/2022]
Number Cited by Other Article(s)
1
Li X, Jiang M, Du Y, Ding X, Xiao C, Wang Y, Yang Y, Zhuo Y, Zheng K, Liu X, Chen L, Gong Y, Tian X, Zhang X. Self-healing liquid metal hydrogel for human-computer interaction and infrared camouflage. MATERIALS HORIZONS 2023;10:2945-2957. [PMID: 37165676 DOI: 10.1039/d3mh00341h] [Citation(s) in RCA: 18] [Impact Index Per Article: 18.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/12/2023]
2
Neumann TV, Kara B, Sargolzaeiaval Y, Im S, Ma J, Yang J, Ozturk MC, Dickey MD. Aerosol Spray Deposition of Liquid Metal and Elastomer Coatings for Rapid Processing of Stretchable Electronics. MICROMACHINES 2021;12:146. [PMID: 33535606 PMCID: PMC7912875 DOI: 10.3390/mi12020146] [Citation(s) in RCA: 14] [Impact Index Per Article: 4.7] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/31/2020] [Revised: 01/24/2021] [Accepted: 01/28/2021] [Indexed: 11/16/2022]
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