Image quality of microns-thick specimens in the ultra-high voltage electron microscope

Sample thickness affects contrast and measured shape in TEM images and in electron tomograms

We investigated the effect of nanoparticle (NP) image broadening and its contrast change dependence on a support matrix thickness in a transmission electron microscope (TEM). We measured the effect of NP size and atomic number on its image broadening. Based on the experimental TEM images we generated tomograms of NPs on four types of support matrix. The measured shape aspect ratio of the NPs in such tomograms depends on the geometry of the support matrix. For example, the aspect ratio of 6 nm NP placed on a thin film with window-frame support is 1.14, while the aspect ratio of 6 nm NP on a rod-shaped support with 910 nm diameter is 1.67 in a tomogram.

Application of ultra-high voltage electron microscope tomography to 3D imaging of microtubules in neurites of cultured PC12 cells

Electron tomography methods using the conventional transmission electron microscope have been widely used to investigate the three-dimensional distribution patterns of various cellular structures including microtubules in neurites. Because the penetrating power of electrons depends on the section thickness and accelerating voltage, conventional TEM, having acceleration voltages up to 200 kV, is limited to sample thicknesses of 0.2 µm or less. In this paper, we show that the ultra-high voltage electron microscope (UHVEM), employing acceleration voltages of higher than 1000 kV (1 MV), allowed distinct reconstruction of the three-dimensional array of microtubules in a 0.7-µm-thick neurite section. The detailed structure of microtubules was more clearly reconstructed from a 0.7-µm-thick section at an accelerating voltage of 1 MV compared with a 1.0 µm section at 2 MV. Furthermore, the entire distribution of each microtubule in a neurite could be reconstructed from serial-section UHVEM tomography. Application of optimised UHVEM tomography will provide new insights, bridging the gap between the structure and function of widely-distributed cellular organelles such as microtubules for neurite outgrowth. LAY DESCRIPTION: An optimal 3D visualisation of microtubule cytoskeleton using ultra-high voltage electron microscopy tomography The ultra-high voltage electron microscope (UHVEM) is able to visualise a micrometre-thick specimen at nanoscale spatial resolution because of the high-energy electron beam penetrating such a specimen. In this study, we determined the optimal conditions necessary for microtubule cytoskeleton imaging within 0.7-µm-thick section using a combination with UHVEM and electron tomography method. Our approach provides excellent 3D information about the complex arrangement of the individual microtubule filaments that make up the microtubule network.

Automatic system for electron tomography data collection in the ultra-high voltage electron microscope

In this study, we report an automatic system for collection of tilt series for electron tomography based on the ultra-HVEM in Osaka University. By remotely controlling the microscope and reading the observation image, the system can track the field of view and do focus in each tilt angle. The automatic tracking is carried out with an image matching technique based on normalized correlation coefficient. Auto focus is realized by the optimization of image sharpness. A toolkit that can expand the field of view with technique of image stitching is also developed. The system can automatically collect the tilt series with much smaller time consumption.

The influence of structure depth on image blurring of micrometres-thick specimens in MeV transmission electron imaging

This study investigates the influence of structure depth on image blurring of micrometres-thick films by experiment and simulation with a conventional transmission electron microscope (TEM). First, ultra-high-voltage electron microscope (ultra-HVEM) images of nanometer gold particles embedded in thick epoxy-resin films were acquired in the experiment and compared with simulated images. Then, variations of image blurring of gold particles at different depths were evaluated by calculating the particle diameter. The results showed that with a decrease in depth, image blurring increased. This depth-related property was more apparent for thicker specimens. Fortunately, larger particle depth involves less image blurring, even for a 10-μm-thick epoxy-resin film. The quality dependence on depth of a 3D reconstruction of particle structures in thick specimens was revealed by electron tomography. The evolution of image blurring with structure depth is determined mainly by multiple elastic scattering effects. Thick specimens of heavier materials produced more blurring due to a larger lateral spread of electrons after scattering from the structure. Nevertheless, increasing electron energy to 2MeV can reduce blurring and produce an acceptable image quality for thick specimens in the TEM.

Electron tomographic resolution of microns-thick specimens in the ultrahigh voltage electron microscope

In this study, we determine the electron tomography (ET) resolution for microns-thick specimens by experiment in the ultra-high voltage electron microscope. A tilt series of projection images of a tilted 8μm thick epoxy-resin film are first acquired. Tomographic reconstructions are then calculated and the resolution is evaluated with the Fourier shell correlation method. The ET resolution of 32nm is achieved under the condition of 2MV accelerating voltage. We also demonstrate that some high tilt angle projections may be little useful for improving the final ET resolution because of the corresponding poor image qualities. These results are helpful to understand the possibility and limitation of ET applications in microns-thick specimens.

The influence of the sample thickness on the lateral and axial resolution of aberration-corrected scanning transmission electron microscopy

The lateral and axial resolution of three-dimensional (3D) focal series aberration-corrected scanning transmission electron microscopy was studied for samples of different thicknesses. The samples consisted of gold nanoparticles placed on the top and at the bottom of silicon nitride membranes of thickness between 50 and 500 nm. Atomic resolution was obtained for nanoparticles on top of 50-, 100-, and 200-nm-thick membranes with respect to the electron beam traveling downward. Atomic resolution was also achieved for nanoparticles placed below 50-, 100-, and 200-nm-thick membranes but with a lower contrast at the larger thicknesses. Beam broadening led to a reduced resolution for a 500-nm-thick membrane. The influence of the beam broadening on the axial resolution was also studied using Monte Carlo simulations with a 3D sample geometry.

Note: direct measurement of the point-to-point resolution for microns-thick specimens in the ultrahigh-voltage electron microscope

We report on a direct measurement method and results of the point-to-point resolution for microns-thick amorphous specimens in the ultrahigh-voltage electron microscope (ultra-HVEM). We first obtain the ultra-HVEM images of nanometer gold particles with different sizes on the top surfaces of the thick epoxy-resin specimens. Based on the Rayleigh criterion, the point-to-point resolution is then determined as the minimum distance between centers of two resolvable tangent gold particles. Some values of resolution are accordingly acquired for the specimens with different thicknesses at the accelerating voltage of 2 MV, for example, 18.5 nm and 28.4 nm for the 5 μm and 8 μm thick epoxy-resin specimens, respectively. The presented method and results provide a reliable and useful approach to quantifying and comparing the achievable spatial resolution for the thick specimens imaged in the mode of transmission electron including the scanning transmission electron microscope.