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For: Herrmann M, Meisel P, Lippmann W, Hurtado A. Joining technology—A challenge for the use of SiC components in HTRs. Nuclear Engineering and Design 2016. [DOI: 10.1016/j.nucengdes.2015.12.022] [Citation(s) in RCA: 7] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
Number Cited by Other Article(s)
1
Spreading behavior of AgCuTi/Cu at elevated temperatures: A molecular dynamics study. J Mol Liq 2020. [DOI: 10.1016/j.molliq.2020.114332] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/22/2022]
2
Lee HG, Kim D, Lee SJ, Park JY, Kim WJ. Thermal conductivity analysis of SiC ceramics and fully ceramic microencapsulated fuel composites. NUCLEAR ENGINEERING AND DESIGN 2017. [DOI: 10.1016/j.nucengdes.2016.11.005] [Citation(s) in RCA: 21] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
3
Jung YI, Park JH, Kim HG, Park DJ, Park JY, Kim WJ. Effect of Ti and Si Interlayer Materials on the Joining of SiC Ceramics. NUCLEAR ENGINEERING AND TECHNOLOGY 2016. [DOI: 10.1016/j.net.2016.03.001] [Citation(s) in RCA: 18] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/22/2022]
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