A novel cross-linked polyimide film: synthesis and dielectric properties

Improvement in Acid Resistance of Polyimide Membranes: A Sustainable Cross-Linking Approach via Green-Solvent-Based Fenton Reaction

In this study, we present a facile surface modification method using green solvents for a commercial polyimide (PI) nanofiltration membrane to exhibit good acid stability. To enhance acid stability, the PI organic solvent nanofiltration membrane was modified using Fenton's reaction, an oxidative cross-linking process, using environmentally friendly solvents: water and ethanol. The surface properties of the pristine and modified PI membranes were investigated and compared using various analytical tools. We studied the surface morphology using scanning electron microscopy, performed elemental analysis using X-ray photoelectron spectroscopy, investigated chemical bonds using attenuated total reflectance-Fourier transform infrared spectroscopy, and studied thermal stability using thermogravimetric analysis. The acid resistances of the pristine and modified membranes were confirmed through performance tests. The pristine PI nanofiltration membrane exposed to a 50 w/v% sulfuric acid for 4 h showed an increase in the normalized water flux to 205% and a decrease in the MgSO₄ normalized rejection to 44%, revealing damage to the membrane. The membrane modified by the Fenton reaction exhibited a decline in flux and improved rejection, which are typical performance changes after surface modification. However, the Fenton-modified membrane exposed to 50 w/v% sulfuric acid for 4 h showed a flux increase of 7% and a rejection increase of 4%, indicating improved acid resistance. Furthermore, the Fenton post-treatment enhanced the thermal stability and organic solvent resistance of the PI membrane. This study shows that the acid resistance of PI membranes can be successfully improved by a novel and facile Fenton reaction using green solvents.

Design of oriented mesoporous silica films for guiding protein adsorption states

The highly-oriented cylindrical mesoporous silica films were synthesized on the rubbing-treated polyimide by adjusting the molar ratio of the orientation-directing agent (Brij56) to the structure-directing agent (P123) as surfactants in the silica precursor solutions for guiding protein adsorption states. As a result, the diameter and the orientation degree of mesopores changed with the molar ratio of Brij56 to P123. The maximum orientation degree (93%) of cylindrical mesopores oriented in the direction perpendicular to the rubbing direction was observed when the molar ratio of Brij56 to P123 was 3. Then, the dissolution features in simulated body fluid and the protein adsorption properties of the oriented cylindrical mesoporous silica films were investigated. The silica skeletons were gradually dissolved from the upper film surfaces and subsequently, the mesopore structures were collapsed when the films were immersed for 90 min. Moreover, the protein adsorption amount and the ratio from the mono-component and two-component solutions on the films were higher than those on the unoriented cylindrical mesoporous silica films due to the formation of open-ended cylindrical mesopore shapes and sizes. In addition, the shapes of the proteins adsorbed on the films had anisotropy, which would be reflected by the cylindrical mesopore shapes generated by the dissolution of silica layers and subsequent exposure of inner mesopore surfaces. Therefore, the synthesized highly-oriented cylindrical mesoporous silica films were useful to adsorb mesoscale biomolecules such as proteins and can effectively guide their anisotropic adsorption shapes, and therefore have the potential to be used as surface-coating films of polyimide in biomedical fields.

Dielectric, mechanical and thermal properties of all-organic PI/PSF composite films by in situ polymerization

All-organic high dielectric materials are highly required in the field of modern electronic industry and energy storage. In this work, all-organic polyimide/polysulfone composite films with different amounts of PSF (PI/PSF-X) were prepared by in situ polymerization followed by film casting and thermal treatment. The dielectric, mechanical and thermal properties of these PI/PSF-X composite films are characterized by dielectric measurement, tensile test, thermogravimetric analysis and dynamic mechanical analysis. The results suggest that the PI/PSF-X composite films have good dielectric properties, good mechanical properties and excellent thermal properties, which are suitable for applications in electronic devices in harsh environments, especially in high-temperature environments.

Recent Progress in Aromatic Polyimide Dielectrics for Organic Electronic Devices and Circuits

Polymeric dielectrics play a key role in the realization of flexible organic electronics, especially for the fabrication of scalable device arrays and integrated circuits. Among a wide variety of polymeric dielectric materials, aromatic polyimides (PIs) are flexible, lightweight, and strongly resistant to high-temperature processing and corrosive etchants and, therefore, have become promising candidates as gate dielectrics with good feasibility in manufacturing organic electronic devices. More significantly, the characteristics of PIs can be conveniently modulated by the design of their chemical structures. Herein, from the perspective of structure optimization and interface engineering, a brief overview of recent progress in PI-based dielectrics for organic electronic devices and circuits is provided. Also, an outlook of future research directions and challenges for polyimide dielectric materials is presented.

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (T_g) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100–200 kHz and in the temperature range of 25–300 °C. The temperature coefficient of dielectric constant is less than 0.001 °C⁻¹ even at 400 °C. By cycling heating and cooling up to ten times or heating at 300 °C for 12 h, the film shows good reversibility and robustness of the dielectric properties. This crosslinked PEN film will be a potential candidate as high performance film capacitor electronic devices materials used at high temperature.

Novel soluble polyimides containing pyridine and fluorinated units: preparation, characterization, and optical and dielectric properties

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF₃)₂– groups were firstly designed and synthesized.

Ternary composites of linear and hyperbranched polyimides with nanoscale silica for low dielectric constant, high transparency, and high thermal stability

A new series of ternary polyimide–silica composites was developed to obtain polymer films with low dielectric constant, high optical transparency, and good thermal stability.

Highly dispersible ternary composites with high transparency and ultra low dielectric constants based on hyperbranched polyimide with organosilane termini and cross-linked polyimide with silica

Flexible insulating materials that are both thermally and mechanically stable, highly transparent, and have low dielectric constants are highly desirable for electronic applications.

Properties of some azo-copolyimide thin films used in the formation of photoinduced surface relief gratings

The patterning of the free standing azo-copolyimide films under different irradiation conditions led to the uniform surface relief gratings.

Hybrid ternary composites of hyperbranched and linear polyimides with SiO2: a research for low dielectric constant and optimized properties

The hybrid ternary composites with low dielectric constant and high thermal stability were fabricated through composition optimization by introducing suitable amounts of inorganic silica and hyperbranched polyimide into a linear polyimide system.