Preparation of Poly(poly(ethylene glycol)methyl ether methacrylate-co-styrene)-b-poly(2-(diethylamino)ethyl methacrylate-co-acrylonitrile) by nitroxide-mediated polymerisation in water

Preparation of Emulsifier-Free Styrene-Acrylic Emulsion via Reverse Iodine Transfer Polymerization

Styrene-acrylic emulsions containing hydroxyl functional monomer unit's component are widely used for maintenance coating. In this paper, a stable emulsifier-free styrene-acrylic emulsion with solid content over 43% could be obtained in 210 min via reverse iodine transfer polymerization (RITP). By adding a mixture of methacrylic acid (MAA) and poly(ethylene glycol)methyl ether methacrylate (PEGMA) into a system containing a high content of hydroxyl functional monomer component (19.4 wt.% of the total monomer mass), styrene (St) could be copolymerized with methyl methacrylate (MMA); the modified film exhibited good hardness properties, good adhesive properties, and low water absorption. An increase in the amount of PEGMA decreased the glass transition temperature (Tg). When 1.4 times the reference amount of initiator was added, the highest molecular weight Mn could reach 40,000 g.·mol-1 with 0.25 times the reference amount of iodine in the emulsion. The largest tensile strength of the dried emulsion film over 5.5 MPa endowed the material with good mechanical properties. Living polymerization was proven by the kinetics of RITP emulsion and chain extension reaction. TEM micrographs manifest the emulsification of the seed random copolymer. This paper may provide a potential methodology for preparing polymer materials with excellent mechanical properties.

Controlled Synthesis of Poly(pentafluorostyrene-ran-methyl methacrylate) Copolymers by Nitroxide Mediated Polymerization and Their Use as Dielectric Layers in Organic Thin-film Transistors

A library of statistically random pentafluorostyrene (PFS) and methyl methacrylate (MMA) copolymers with narrow molecular weight distributions was produced, using nitroxide mediated polymerization (NMP) to study the effect of polymer composition on the performance of bottom-gate top-contact organic thin-film transistors, when utilized as the dielectric medium. Contact angle measurements confirmed the ability to tune the surface properties of copolymer thin films through variation of its PFS/MMA composition, while impedance spectroscopy determined the effect of this variation on dielectric properties. Bottom-gate, top-contact copper phthalocyanine (CuPc) based organic thin-film transistors were fabricated using the random copolymers as a dielectric layer. We found that increasing the PFS content led to increased field-effect mobility, until a point after which the CuPc no longer adhered to the polymer dielectric.

Emulsifier-Free Acrylate-Based Emulsion Prepared by Reverse Iodine Transfer Polymerization

The self-emulsifying acrylate-based emulsions with solid content 45 wt.% were prepared in 3.5 h by reverse iodine transfer polymerization (RITP), and the polymer molecular weight (Mn) could be 30,000 g·mol-1. The influences of methacrylic acid (MAA) amount, soft/hard monomer mass ratio, and iodine amount on polymerization and latex were investigated. A moderate amount of ionized MAA was needed to stabilize the emulsion. Glass transition temperature (Tg) was decreased with the increasing mass ratio of soft/hard monomer. A higher iodine amount resulted in lower Mn. The increased Mn after chain extension of the polymer with water-insoluble monomers in iterative one-pot method proved the living of polymer. Compared with conventional emulsion polymerization, molecular weight (Mn) could be controlled, and Mn of polymer synthesized in RITP emulsion polymerization is higher; emulsion of polyacrylate-containing hydroxyl monomer units prepared by RITP emulsifier-free radical polymerization is more stable. Good properties, such as hardness, water resistance, adhesion, and increased value of maximum tensile of films modified by reaction of polyacrylate with melamine-formaldehyde (MF) resin, indicated potential application in baking coating.