Identification of the reaction mechanism between phenyl methacrylate and epoxy and its application in preparing low-dielectric epoxy thermosets with flexibility

Preparation and Properties of Fluorinated Poly(aryl ether)s with Ultralow Water Absorption and Dielectric Constant by Cross-Linked Network Strategy

Poly(aryl ether) materials are used in a wide range of applications in the communications and microelectronics fields for their outstanding mechanical and dielectric properties. In order to further improve the comprehensive performance, this work reports a series of cross-linkable poly(aryl ether)s (UCL-PAEn) containing trifluoroisopropyl and perfluorobiphenyl structures using 2,2-bis(4-hydroxyphenyl)hexafluoropropane, 2,2'-diallyl bisphenol A, and perfluorobiphenyl as starting materials. Their chemical structures and the effect of changes in the allyl content on the properties are thoroughly investigated. Owing to the introduction of fluorine atoms and cross-linked networks, the cross-linked poly(aryl ether) films present low dielectric constants (Dk = 1.93-2.24 at 1 MHz), low water absorption (0.14% -0.25%), and hydrophobic film surfaces (94.3-99.4°). Additionally, because of the presence of cross-linked networks, the CL-PAEn films exhibit superior thermal stability, with the 5% weight loss temperatures all above 445 °C and the maximum thermal decomposition rate temperatures all above 550 °C. The cross-linked films also demonstrate excellent mechanical properties, with tensile strength in the range of 57.1 -146.7 MPa and tensile modulus in the range of 1.8 GPa-4.5 GPa.

Recent Progress in Modification of Polyphenylene Oxide for Application in High-Frequency Communication

With the rapid development of highly integrated electronic devices and high-frequency microwave communication technology, the parasitic resistance-capacitance (RC) delay and propagation loss severely restrict the development of a high-frequency communication system. Benefiting from its low dielectric constants (Dk) and low dielectric loss factor (Df), polyphenylene oxide (PPO) has attracted widespread attention for its application in the dielectric layers of integrated circuits. However, PPO suffers from a very high melting viscosity, a larger coefficient of thermal expansion than copper wire and poor solvent resistance. Recently, many efforts have focused on the modification of PPO by various means for communication applications. However, review articles focusing on PPO are unexpectedly limited. In this article, the research progress concerning PPO materials in view of the modification of PPO has been summarized. The following aspects are covered: polymerization and design of special chemical structure, low molecular weight PPO and blending with thermosetting resin, hyperbranched PPO, thermosetting PPO and incorporating with fillers. In addition, the advantages and disadvantages of various types of modification methods and their applications are compared, and the possible future development directions are also proposed. It is believed that this review will arouse the interest of the electronics industry because of the detailed summary of the cutting-edge modification technology for PPO.

Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials

With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO₂ hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm^-1 k^-1, the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.

Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication

In an integrated circuit, signal propagation loss is proportional to the frequency, dissipation factor (D _f), and square root of dielectric constant (D _k). The loss becomes obvious as we move to high-frequency communication. Therefore, a polymer having low D _k and D _f is critical for copper-clad laminates at higher frequencies. For this purpose, a 4-vinylbenzyl ether phenoxy-2,3,5,6-tetrafluorophenylene-terminated OPE (VT-OPE) resin was synthesized and its properties were compared with the thermoset of commercial OPE-2St resin. The thermoset of VT-OPE shows a higher T _g (242 vs 229 °C), a relatively high cross-linking density (1.59 vs 1.41 mmole cm^-3), a lower coefficient of thermal expansion (55 vs 76 ppm/°C), better dielectric characteristic at 10 GHz (D _k values of 2.58 vs 2.75, D _f values of 0.005 vs 0.006), lower water absorption (0.135 vs 0.312 wt %), and better flame retardancy (UL-94 VTM-0 vs VTM-1 with dropping seriously) than the thermoset of OPE-2St. To verify the practicability of VT-OPE for copper-clad laminate, a laboratory process was also performed to prepare a copper-clad laminate, which shows a high peeling strength with copper foil (5.5 lb/in), high thermal reliability with a solder dipping test at 288 °C (>600 s), and the time for delamination of the laminate in thermal mechanical analysis (TMA) at 288 °C is over 60 min.

Effects of Peroxide Initiator on the Structure and Properties of Ultralow Loss Thermosetting Polyphenylene Oxide-Based Composite

Although thermosetting polyphenylene oxide- (PPO) based composites with excellent dielectric properties have been widely accepted as superior resin matrices of high-performance copper clad laminate (CCL) for 5G network devices, there has been limited information regarding the composition–process–structure–property relationships of the systems. In this work, the effects of peroxide initiator concentration on the structure and dielectric properties of a free radical cured ultralow loss PPO/Triallyl isocyanate (TAIC) composite system were studied. As expected, the glass transition temperature (T_g) and storage modulus increased with the advancing of crosslinking, whereas the dielectric loss showed an “abnormal” rise with the increase in crosslink density. Extensive studies were carried out by varying the initiator contents and characterizing the structure with spectroscopy, thermal analysis, and positron annihilation lifetime spectrum (PALS) techniques. The results show that the competition of polarity, crosslink density, free volume, and free TAIC are the key factors determining the dielectric properties of the composites.

Cure kinetics and properties of high-performance epoxy thermosets cured with active ester-terminated poly (aryl ether ketone)

Benzene-1,3,5-triyl tribenzoate (TBB), both 3,5-bis(benzoyloxy)benzoate-terminated poly (aryl ether ketone) oligomers (BPAPK and TMPK), containing active ester (Ph−O−(C=O)− structure), were prepared and served as curing agents for dicyclopentadiene novoalc epoxy (DCPD). The curing kinetics and properties of three epoxy thermosets were systematically investigated. The model reaction of TBB and glycidyl phenyl ether was designed to understand the curing mechanism of oxirane ring with active ester. TMPK/DCPD displays the lowest reaction activation energy, which is the result of the combined influence of free volume and diffusion. In addition, TMPK/DCPD has the highest Tg value (218°C), which enhances 34.6% and 42.5% compared with BPAPK/DCPD and TBB/DCPD, respectively. Meanwhile, TMPK/DCPD also shows superior dielectric and water resistance properties due to no secondary alcohol generated after curing and hydrophobic tetramethyl-substituted biphenyl structure. Herein, TMPK/DCPD as high-performance epoxy thermosets has potential applications in electronic packaging fields.

Flexible and low-k polymer featuring hard–soft-hybrid strategy

One of the main challenges for dielectric materials for advanced microelectronics is their high dielectric value and brittleness. In this study, we adopted a hard–soft-hybrid strategy and successfully introduced a hard, soft segment and covalent crosslinked structural unit into a hybridized skeleton via copolymerization of polydimethylsiloxane (PDMS), benzocyclobutene (BCB) and double-decker-shaped polyhedral silsesquioxanes (DDSQ) by a platinum-catalyzed hydrosilylation reaction, thus producing a random copolymer (PDBD) with a hybridized skeleton in the main chain. PDBD exhibited high molecular weight and thermal curing action without any catalyst. More importantly, the cured copolymer displayed high flexibility, high thermal stability and low dielectric constant, evidencing its potential applications in high-performance dielectric materials.

Hard–Soft-hybrid strategy is used to synthesize random copolymers with a hybridized main chain.

The reaction of activated esters with epoxides for self-curable, highly flexible, A2B2- and A3B3-type epoxy compounds

To achieve high-T_g and low-dissipation epoxy thermosets, bis(2-methoxy-4-(oxiran-2-ylmethyl)phenyl)isophthalate (2) and tris(2-methoxy-4-(oxiran-2-ylmethyl)phenyl)benzene-1,3,5-tricarboxylate (3) were prepared.

Using Dicyclopentadiene-Derived Polyarylates as Epoxy Curing Agents To Achieve High T g and Low Dielectric Epoxy Thermosets

To achieve high-T _g and low-dielectric epoxy thermosets, four dicyclopentadiene-derived polyarylates (26-P, 26-M, 236-P, and 236-M) were prepared from 2,6-dimethyl (or 2,3,6-trimethyl) phenol-dicyclopentadiene adduct with terephthaloyl (or isophthaloyl) chloride by high-temperature solution polymerization. The resulting polyarylates, exhibiting active ester linkages (Ph-O-(C=O)-) are found to be reactive toward a commercial dicyclopentadiene phenol epoxy (HP7200) in the presence of some lone-pair electron-containing compounds. Five compounds including 4-dimethylaminopyridine (DMAP), imidazole, 2-methylimidazole, triphenylphosphine, and triphenylimidazole have been evaluated as a catalyst for the curing reactions. We found that DMAP, with the smallest pK _b among them, is the best catalyst according to differential scanning calorimetry, infrared, and thermal analyses. The thermal and dielectric properties of the polyarylate/HP7200 thermosets are evaluated. We found that they exhibit a high T _g characteristic (e.g., T _g is 238 °C for DMAP-catalyzed, 236-P/HP7200 thermoset). Furthermore, because of the hydrophobic methyl and cycloaliphatic moieties, and the secondary hydroxyl-free structure, polyarylate/HP7200 thermosets show a relative low-dielectric constant of around 2.75 U. The detailed structure-properties relationship is discussed in this work.