Processable, high T polyimides from unsymmetrical diamines containing 4-phenoxy aniline and benzimidazole moieties

Comparison of Homo-Polyimide Films Derived from Two Isomeric Bis-Benzimidazole Diamines

Heteroaromatic polyimides (PIs) containing benzimidazole have attracted tremendous attention due to their positive impact on the properties of PIs. Some research on PIs containing 4,4'-[5,5'-bi-1H-benzimidazole]-2,2'-diylbis-benzenamine (4-AB) has been reported. However, reports are lacking on homo-polyimides (homo-PIs) containing 3,3'-[5,5'-bi-1H-benzimidazole]-2,2'-diylbis-benzenamine (3-AB), which is one of the isomers of 4-AB. In this paper, the influence of amino groups' positions on the performance of homo-PIs was investigated. It was found that the net charge of the amine N group in 4-AB was lower than that of 3-AB, resulting in higher reactivity of 4-AB. Consequently, PIs containing 4-AB displayed better mechanical performance. Molecular simulation confirmed that 3-AB and its corresponding PI chain exhibited distorted conformation, leading to the PI films containing 3-AB having a lighter color. In addition, the 3-AB structure was calculated to have higher rotational energy compared to 4-AB, resulting in a higher glass transition temperature (Tg) in PIs prepared from 3-AB. On the other hand, PIs containing 4-AB exhibited a higher level of molecular linearity, leading to a lower coefficient of thermal expansion (CTE) compared to PIs prepared from 3-AB. Furthermore, all PIs showed higher thermal stability with a 5% weight loss temperature above 530 °C and Tg higher than 400 °C.

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly "twisted" 4,4'-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation.

New fluorinated polyimides based on 1,2-bis(4-aminophenyl)-4,5-bis(4-trifluoromethylphenyl)-1H-imidazole

A new aromatic unsymmetrical diamine containing imidazolyl and trifluoromethyl groups, 1,2-bis(4-aminophenyl)-4,5-bis(4-trifluoromethylphenyl)-1H-imidazole was synthesized. A series of novel fluorinated polyimides (PIs) were prepared by polycondensation of this diamine monomer with various aromatic dianhydrides via one-step process. The resulting PIs bearing inherent viscosities of 0.45–0.61 dL/g were amorphous and readily soluble in organic polar solvents such as NMP, DMF, DMAc, THF, and CHCl3. These new PIs exhibited good thermal stability with 10% weight loss temperatures of 530–560°C and char yields of 61–65% at 800°C in nitrogen, as well as good flame retardancy with limited oxygen index value of 40.6–42.8, and outstanding hydrophobicity with the contact angle of 85.2–93.5°. Meanwhile, all the obtained PIs exhibited low water uptake of 0.30–0.53%, strong UV-vis absorption in the range of 267–310 nm in DMF solution, and their films presented high optical transparency with a cut-off wavelength in the 355–392 nm range. Except for the PI film derived from pyromellitic dianhydride, the other PI films had the tensile strength in the range of 53.2–74.1 MPa, elongation at breakage of 6–15%, and tensile modulus of 1.0–1.5 GPa, respectively.

Preparation and characterization of soluble heat-resistant polyimide films containing bis-N-phenyl-benzimidazole

To prepare soluble polyimides with high temperature resistance, two new diamine monomers, namely, 2,2′-(4,4′-oxybisphenylene)-bis(1-phenyl-5-aminobenzimidazole) (5a), and 2,2′-(4,4′-hexafluoroisopropylidene)-bis(1-phenyl-5- aminobenzimidazole) (5b), were synthesized and exploited to prepare three series of poly(benzimidazole imides)s (PBIIs) by a conventional two-stage synthesis. The resulting PI films were flexible and tough, possessing high glass-transition temperatures (Tgs = 311°C–390°C), improved optical transparency, and excellent solubility. Moreover, the effect of different configuration on performance was revealed, and these data provided a feasible method to enhance both Tg and solubility of PIs by incorporating N-phenyl benzimidazole and corresponding functional moieties.

Fabrication of rigid polyimide foams with overall enhancement of thermal and mechanical properties

Polyimide (PI) foams have been developed for decades and widely used as thermal insulation materials. However, the limited mechanical and thermal properties continually being a serious problem that restrict their further applications. In this study, a series of rigid PI foams with excellent mechanical and thermal performance were fabricated by the reaction of benzophenone-3,3',4,4'-tetracarboxylic dianhydride (BTDA) with two diamines of 2–(4-aminophenyl)-5-aminobenzimidazole (BIA) and 4,4'-diaminodiphenyl ether (ODA) with various molar ratios, and the cis-5-norbornene-endo-2,3-dicarbox-ylic acid (NA) was introduced as end-capping and foaming agent. The results demonstrate that the foaming degree decreases with increasing the BIA molar ratio in the polymer chains owing to the elevated melt viscosity of precursor. Furthermore, the prepared rigid PI foams exhibit excellent thermal and mechanical properties. When the BIA contend up to 40 mol%, the glass transition temperature ( Tg) and the temperature at 10% of weight loss ( Td 10 %) of PI foam increased ∼80°C and ∼35°C in comparison with the pristine PI-0, respectively. In addition, the compressive strength and modulus at 10% strain of PI-4 reached to 5.48 MPa and 23.8 MPa, respectively. For the above-mentioned advantages, the prepared rigid PI foams are promising candidates as thermal insulation and structure support composite materials in the aerospace and aviation industries.