Topological defects in tubular network block copolymers

Revealing the 3D Structure of Block Copolymers with Electron Microscopy: Current Status and Future Directions

Block copolymers (BCPs) are considered model systems for understanding and utilizing self-assembly in soft matter. Their tunable nanometric structure and composition enable comprehensive studies of self-assembly processes as well as make them relevant materials in diverse applications. A key step in developing and controlling BCP nanostructures is a full understanding of their three-dimensional (3D) structure and how this structure is affected by the BCP chemistry, confinement, boundary conditions, and the self-assembly evolution and dynamics. Electron microscopy (EM) is a leading method in BCP 3D characterization owing to its high resolution in imaging nanosized structures. Here we discuss the two main 3D EM methods: namely, transmission EM tomography and slice and view scanning EM tomography. We present each method's principles, examine their strengths and weaknesses, and discuss ways researchers have devised to overcome some of the challenges in BCP 3D characterization with EM- from specimen preparation to imaging radiation-sensitive materials. Importantly, we review current and new cutting-edge EM methods such as direct electron detectors, energy dispersive X-ray spectroscopy of soft matter, high temporal rate imaging, and single-particle analysis that have great potential for expanding the BCP understanding through EM in the future.

The Promise of Soft-Matter-Enabled Quantum Materials

The field of quantum materials has experienced rapid growth over the past decade, driven by exciting new discoveries with immense transformative potential. Traditional synthetic methods to quantum materials have, however, limited the exploration of architectural control beyond the atomic scale. By contrast, soft matter self-assembly can be used to tailor material structure over a large range of length scales, with a vast array of possible form factors, promising emerging quantum material properties at the mesoscale. This review explores opportunities for soft matter science to impact the synthesis of quantum materials with advanced properties. Existing work at the interface of these two fields is highlighted, and perspectives are provided on possible future directions by discussing the potential benefits and challenges which can arise from their bridging.

Visualizing the double-gyroid twin

Periodic gyroid network materials have many interesting properties (band gaps, topologically protected modes, superior charge and mass transport, and outstanding mechanical properties) due to the space-group symmetries and their multichannel triply continuous morphology. The three-dimensional structure of a twin boundary in a self-assembled polystyrene-b-polydimethylsiloxane (PS-PDMS) double-gyroid (DG) forming diblock copolymer is directly visualized using dual-beam scanning microscopy. The reconstruction clearly shows that the intermaterial dividing surface (IMDS) is smooth and continuous across the boundary plane as the pairs of chiral PDMS networks suddenly change their handedness. The boundary plane therefore acts as a topological mirror. The morphology of the normally chiral nodes and strut loops within the networks is altered in the twin-boundary plane with the formation of three new types of achiral nodes and the appearance of two new classes of achiral loops. The boundary region shares a very similar surface/volume ratio and distribution of the mean and Gaussian curvatures of the IMDS as the adjacent ordered DG grain regions, suggesting the twin is a low-energy boundary.

Defects and defect engineering in Soft Matter

Soft matter covers a wide range of materials based on linear or branched polymers, gels and rubbers, amphiphilic (macro)molecules, colloids, and self-assembled structures. These materials have applications in various industries, all highly important for our daily life, and they control all biological functions; therefore, controlling and tailoring their properties is crucial. One way to approach this target is defect engineering, which aims to control defects in the material's structure, and/or to purposely add defects into it to trigger specific functions. While this approach has been a striking success story in crystalline inorganic hard matter, both for mechanical and electronic properties, and has also been applied to organic hard materials, defect engineering is rarely used in soft matter design. In this review, we present a survey on investigations on defects and/or defect engineering in nine classes of soft matter composed of liquid crystals, colloids, linear polymers with moderate degree of branching, hyperbranched polymers and dendrimers, conjugated polymers, polymeric networks, self-assembled amphiphiles and proteins, block copolymers and supramolecular polymers. This overview proposes a promising role of this approach for tuning the properties of soft matter.

Atomic Layer Deposition of Inorganic Thin Films on 3D Polymer Nanonetworks

Atomic layer deposition (ALD) is a unique tool for conformally depositing inorganic thin films with precisely controlled thickness at nanoscale. Recently, ALD has been used in the manufacture of inorganic thin films using a three-dimensional (3D) nanonetwork structure made of polymer as a template, which is pre-formed by advanced 3D nanofabrication techniques such as electrospinning, block-copolymer (BCP) lithography, direct laser writing (DLW), multibeam interference lithography (MBIL), and phase-mask interference lithography (PMIL). The key technical requirement of this polymer template-assisted ALD is to perform the deposition process at a lower temperature, preserving the nanostructure of the polymer template during the deposition process. This review focuses on the successful cases of conformal deposition of inorganic thin films on 3D polymer nanonetworks using thermal ALD or plasma-enhanced ALD at temperatures below 200 °C. Recent applications and prospects of nanostructured polymer–inorganic composites or hollow inorganic materials are also discussed.