Hierarchical multiscale analysis of polyimide films by molecular dynamics simulation: Investigation of thermo-mechanical properties

Property investigation for high-Performance Polyimides fabricated via compression molding in solid-like state

A compacted body was fabricated by pulverulent polyimide (PI) block copolymers using solid-like state compression molding (SCM) technique. Polymer heated to solid-like state, i.e. the high-elastic non-melting state above the glass transition temperature ( Tg) and well below melting temperature, could achieve plasticity due to dramatic decreases in elastic modulus. Tensile properties were taken as response values, and the results of single-factor experiments indicated that molding temperature was the dominant parameter on mechanical performances, followed by molding pressure and holding time. Within this context, the SCM process possesses a longer processing time window whereas the processing temperature is narrow. The manufacturing defects induced by inappropriate processing conditions also hurt the tribological performance of PIs. Particles in a solid-like state could coalesce tightly only by exerting both high temperature and pressure in the SCM process. Thermoforming mechanism examined by atomic-scale molecular dynamics simulation indicated that non-bonding interaction forces, especially van der Waals forces play a key role in fusing among polymeric particles. This study is devoted to establishing the interdependence of structure-formability-property for high-temperature polymers that are not melt processible.

Localized Surface Hydrophilicity Tailoring of Polyimide Film for Flexible Electronics Manufacturing Using an Atmospheric Pressure Ar/H2O Microplasma Jet

The poor hydrophilicity of polyimide (PI) films limits their applications in flexible electronics, such as in wearable and implantable bio-MEMS devices. In this paper, an atmospheric pressure Ar/H₂O microplasma jet (μAPPJ) with a nozzle diameter of 100 μm was utilized to site-selectively tune the surface hydrophilicity of a PI film. The electrical and optical characteristics of the μAPPJ were firstly investigated, and the results showed that multi-spikes occurred during the plasma discharge and that diverse reactive species, such as O atoms and OH radicals, were generated in the plasma plume. The physical and chemical properties of pristine and microplasma-modified PI surfaces were characterized by the water contact angle (WCA), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The wettability of the PI surface was significantly enhanced after microplasma modification, and the WCA could be adjusted by varying the applied voltage, water vapor content, plasma treatment time and storage time. The AFM images indicated that the surface roughness increased after the plasma treatment, which partially contributed to an improvement in the surface hydrophilicity. The XPS results showed a reduction in the C content and an increase in the O content, and abundant hydrophilic polar oxygen-containing functional groups were also grafted onto the PI film surface. Finally, the interaction mechanism between the PI molecular chains and the microplasma is discussed. The breaking of C-N and C-O bonds and the grafting of OH radicals were the key pathways to dominate the reaction process.

Revealing the High-Modulus Mechanism of Polyimide Films Prepared with 3,4'-ODA

To prepare PIs (polyimides) with desirable thermal and mechanical properties is highly demanded due to their widespread applications in flexible optoelectronic devices and printed circuit boards. Here, the PI films of BPDA/4,4′-ODA, BPDA/3,4′-ODA, PMDA/4,4′-ODA, PMDA/3,4′-ODA systems were prepared, and it was found that the PIs with 3,4′-ODA always exhibit a high modulus compared with the PIs with 4,4′-ODA. To disclose the mechanism of high-modulus PI films with 3,4′-ODA, amorphous PI models and uniaxial drawing PI models were established and calculated based on MD simulation. The PI structural deformations at different length scales, i.e., molecular chain cluster scale and repeat unit scale, under the same stress were detailed and analyzed, including the variation of chain conformation, bond length, bond angle, internal rotation energy, and torsion angle. The results indicate that PIs with 3,4-ODA have higher internal rotation energy and smaller deformation with the same stress, consistent with the high modulus.

Molecular dynamics investigation of structural and mechanical properties of silica nanorod reinforced dental resin composites

In this work, molecular dynamics simulations are conducted to investigate the structural and mechanical properties of dental materials, i.e., the silica nanorod reinforced Bis-GMA/TEGDMA resin composite. The effects of loading content and size of the silica nanorods on the composite stiffness were performed by examining resin chain conformation, hydrogen bonds and matrix/filler binding energy. It is revealed that the presence of the silica nanorod causes polymer chain expansion, endowing the resins with higher stiffness. Moreover, the volumetric hydrogen bonds and binding energy increase considerably with the loading content, but decrease gradually with the diameter or show almost independence of the length. Furthermore, the composite moduli were quantified by the micromechanics models and the transverse moduli were well predicted by the Counto model, signifying a perfect bonding between the matrix and nanorod. The chain expansion and energetic matrix/filler interactions are believed to contribute to the significant mechanical reinforcement of the composites with the loading content. However, the length of the nanorod has a little effect on the composite moduli due to the unaltered interfacial interaction. In contrast, a smaller diameter is supposed to give a larger modulus, and this is not observed in this work due to the synergic effects of improved matrix/filler interaction and actual reduced filler volume fraction. The mechanical enhancement by the rod-like structures is more influenced by the loading content, but less so by the size of the nanorod, and it also exhibits superior mechanical performance as compared to nanoparticles. The findings thus extend the current understanding of the nanostructure and mechanical properties of silica nanorod reinforced dental resin composites from an atomic/molecular perspective.

Structural Evolution of Macromolecular Chain During Pre-imidization Process and Its Effects on Polyimide Film Properties

Pre-imidization has been found to have a determining role on the final properties of polyimide (PI) films. In this work, a series of 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA)/2,2'-bis(trifluoromethyl)benzidine (TFMB) PI models with specified pre-imidization degree (pre-ID) were constructed and analyzed on the basis of molecular dynamic (MD) simulation to reveal the real-time evolution of structure and properties that occurred during the pre-imidization process. The MD results indicated that the T_g of the models increased obviously with increasing pre-ID, which corresponded to the increase of rigid PI chain segments that restricted the mobility of molecular chains. In addition, the increase of fractional free volume and mean square end-to-end distance indicated looser chain packing and more extended chain conformation during the pre-imidization process. As a further verification, a series of corresponding PI films were experimentally prepared via a controlled partially pre-imidization process. Mechanical properties of the prepared PI films were tested to be significantly enhanced, and the coefficient of thermal expansion decreased from 61.5 to 47.6 ppm/°C with pre-ID increasing from 0% to 100%, which could be attributed to the orderly molecular chain arrangement formed during the chemical pre-imidization process, as disclosed by MD simulation. This work paves the way for the observation of the real-time structure and property evolutions of PI materials, especially during the pre-imidization process.

Effect of introduction of fluoromonomer copolymerization on properties of polyimide hollow fibers

The novel copolymerization polyimide (PI) hollow fibers (HFs) of 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) containing –CF3 groups were prepared and investigated through both simulation and experiment. To demonstrate the alteration attributable to the introduction of fluoromonomers, the condensed states of pyromellitic dianhydride (PMDA)/4,4′-oxybisbenzenamine (ODA), PMDA/6FDA/ODA, and 6FDA/ODA PI were constructed by Material Studio, and we simulated the mobility of molecular chain, free volume fraction, and O2/N2 dissolution–diffusion process. The molecular dynamics simulation results demonstrated that the properties of the copolymerized PI system with 6FDA were significantly improved, while the selectivity remained almost unchanged. Then, the films of copolymerized PI and HFs were prepared by the two-step method, and O2/N2 permeability of the PI copolymer films was characterized, indicating that although the gas permeation performance was greatly improved, the selectivity was not so satisfactory. However, the selection factor increased heavily after polydimethylsiloxane coating.