Stoichiometry and molecular dynamics of anhydride-cured epoxy resin incorporating octa-glycidyl POSS Co-Monomer

Low viscosity and low temperature curing reactive POSS/epoxy hybrid resin with enhanced toughness and comprehensive thermal performance

The mechanical and high-temperature resistance properties of epoxy resins cured at low temperatures (Tcuring ≤ 100 °C) are often inferior, and the most toughening modification methods for epoxy resins tend to compromise thermal resistance, which significantly limit the practical applications of it. Therefore, this work reported a low viscosity and low-temperature curing epoxy hybrid resin system (OPEP), adopting E-51 as a resin matrix, liquid anhydride (MHHPA) as a curing agent, tertiary amine (DMBA) as a curing accelerator, and reactive octa-epoxy terminated polyhedral oligomeric silsesquioxane (OG-POSS) as a toughening modifier. Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing. The OG-POSS exhibits superior compatibility and reactivity with the resin matrix, and its addition slightly reduces the Eα of the curing reaction and has a certain promotive effect on the curing of epoxy resin. In addition, the curing reaction rate of the OPEP resin complies with the Šesták-Berggren autocatalytic kinetics model. The impact strength, flexural strength, tensile strength, and elongation at break of the OPEP resin reached a maximum of 15.55 kJ m-2, 121.65 MPa, 90.36 MPa, and 2.48%, representing increases of 55.97%, 3.1%, 64.68%, and 26.51% compared to those of the pure resin, respectively. Notably, due to the heat-resistant inorganic silicon cage structure of OG-POSS, the thermal decomposition temperature (Td5), glass transition temperature (Tg), and heat distortion temperature (THDT) of the OPEP0.02 resin were 313.2 °C, 123.7 °C, and 102.0 °C, showing increases of 13.0 °C, 2.3 °C, and 6.8 °C compared to the pure resin, respectively, which is difficult to achieve for the general thermosetting resin toughening modification method. This research utilized organic-inorganic nanohybrid materials (POSS) to optimize the toughness and thermal stability of the resin in a coordinated manner, providing guidance for the preparation of high-performance epoxy resins that cure at low temperatures.

Curing Regime-Modulating Insulation Performance of Anhydride-Cured Epoxy Resin: A Review

Anhydride-cured bisphenol-A epoxy resin is widely used in the support, insulation and sealing key components of electrical and electronic equipment due to their excellent comprehensive performance. However, overheating and breakdown faults of epoxy resin-based insulation occur frequently under conditions of large current carrying and multiple voltage waveforms, which seriously threaten the safe and stable operation of the system. The curing regime, including mixture ratio and combination of curing time and temperature, is an important factor to determine the microstructure of epoxy resin, and also directly affects its macro performances. In this paper, the evolution of curing kinetic models of anhydride-cured epoxy resin was introduced to determine the primary curing regime. The influences of curing regime on the insulation performance were reviewed considering various mixture ratios and combinations of curing time and temperature. The curing regime-dependent microstructure was discussed and attributed to the mechanisms of insulation performance.

On Molecular Dynamics and Charge Transport in a Flexible Epoxy Resin Network

An epoxy based on diglycidyl ether of bisphenol A was reacted with a long-chain poly(oxypropylene diamine) hardener in the presence of an accelerator, resulting in a flexible epoxy network. Tensile properties were tested as a function of accelerator concentration. All systems exhibited high levels of extensibility, with strain at failure values in excess of 65%. Molecular dynamics in a formulation containing 10 phr of accelerator were then examined using dielectric spectroscopy over the temperature range of 103-433 K. At low temperatures, a molecular relaxation process (γ relaxation) was observed and shown to conform well to both the Arrhenius equation and activated tunnelling. A stronger relaxation appeared (203-303 K) just before the onset of charge transport, which dominated the behaviour at higher temperatures. The former takes an unusual bimodal form, which we consider a result of overlapping β and α relaxations, consequently termed αβ mode. Analysis of this mechanism revealed a Vogel-Fulcher-Tammann (VFT) behaviour. The temperature-dependent DC conductivity, σ_DC (deduced from the low-frequency charge transport contribution to ε_r″), also revealed VFT behaviour with an onset statistically equivalent to that of the αβ mode, therefore suggesting that charge transport, at this temperature regime, is strongly affiliated with cooperative molecular motion.

Improving the Physical-Mechanical Property of Dental Composites by Grafting Methacrylate-Polyhedral Oligomeric Silsesquioxane onto a Filler Surface

Endowing dental composites with excellent interfacial bonding through filler surface modification is pivotal to improve the physical-mechanical property and prolong the life of composite fillings. In this study, methacrylate-polyhedral oligomeric silsesquioxane (MA-POSS) acts as a "molecular bridge" between the commonly used SiO₂ particles and the methacrylate-based resin matrix via a thiol-ene click reaction to construct MA-POSS/SiO₂ (p-SiO₂) hybrid particles. Synthesized p-SiO₂ exhibited the roughest surface morphology and had more polymerizable groups, in comparison with SiO₂ and silanized SiO₂. Furthermore, the p-SiO₂ particles were used as a reinforcement to fabricate bisphenol A glycerolate dimethacrylate/tri(ethyleneglycol) dimethacrylate-based dental composites, where the SiO₂- and silanized SiO₂-filled composites served as the control groups, and the filler loading was fixed at 65 wt %. Results of the mechanical properties indicated that the hybrid p-SiO₂ particles significantly improved the flexural strength, flexural modulus, compressive strength, and work of fracture of dental composites, giving improvements of 251.2, 17.89, 122.3, and 1094%, respectively, over the SiO₂-filled composites due to the strong interfacial interaction between the resin matrix and p-SiO₂. Additionally, this optimal p-SiO₂-loaded composite also presented better polymerization shrinkage, acceptable degree of conversion, curing depth, and cell viability. Grafting of MA-POSS onto a filler surface is a promising filler surface modification to improve the resin matrix/filler interfacial interaction, leading to the enhanced overall performance of composites.