Investigation of the controllable thermal curing reaction for ultrahigh T polyarylene ether nitrile compositions

Fabrication of High-Performance Colorimetric Membrane by Incorporation of Polydiacetylene into Polyarylene Ether Nitriles Electrospinning Nanofibrous Membranes

Polyarylene ether nitrile (PEN) is a novel high-performance engineering plastic with various applications, particularly in thermoresistance-required fields. In this study, a well-known stimuli-response polydiacetylene monomer, 10, 12-pentacosadiynoic acid (PCDA), was encapsulated within electrospun PEN nanofibers to fabricate a colorimetric membrane with satisfactory thermal and corrosion resistance. To optimize the compatibility with PCDA, two PENswith distinct molecular chains were utilized: PEN−PPL and PEN−BPA. The chemical structure and elemental mapping analysis revealed that the PCDA component was successfully incorporated into the PEN fibrous. The PCDA bound significantly better to the PEN−PPL than to the PEN−BPA; due to the carboxyl groups present on the side chains of PEN−PPL, the surface was smooth and the color changed uniformly as the temperature rose. However, owing to its poor compatibility with PEN−BPA, the PCDA formed agglomerations on the fibers. The thermal analysis demonstrated that the membranes obtained after PCDA compounding maintained their excellent heat resistance. The 5% weight loss temperatures of composite nanofibrous membranes manufactured by PEN−PPL and PEN−BPA were 402 °C and 506 °C, respectively, and their glass transition temperatures were 219 °C and 169 °C, respectively, indicating that the blended membranes can withstand high temperatures. The evaluation of application performance revealed that the composite membranes exhibited good dimensional stability upon high thermal and corrosive situations. Specifically, the PEN−P−PCDA did not shrink at 170 °C. Both composite membranes were dimensionally stable when exposed to the alkali aqueous solution. However, PEN−P−PCDA is more sensitive to OH−, exhibiting color transition at pH > 8, whereas PEN−B−PCDA exhibited color transition at high OH− concentrations (pH ≥ 13), with enhanced alkali resistance stability owing to its nanofibrous architecture. This exploratory study reveals the feasibility of PEN nanofibers functionalized using PCDA as a desirable stimulus-response sensor even in high-temperature and corrosive harsh environments.

Poly(arylene ether nitrile)/lamellar MXene nanosheet composite films fabricated via bio-inspired dopamine surface chemistry

2D lamellar MXene nanosheets have shown the promising candidate for preparing dielectric polymer composites due to their excellent electrical and mechanical properties. However, the high dielectric loss and low temperature resistance restrict their further application, which are still big challenges. In this work, MXene nanosheets were modified by dopamine mediated chemical crosslinking with polyethylenimine, which was further incorporated into the temperature-resistant poly (arylene ether nitrile) (PEN) matrix via a simple solution-casting method to prepare the dielectric MXene/PEN composite film. Specially, the insulating layer originated from polyethylenimine and polydopamine not only enhanced the interface polarization and the uniform dispersion of MXene in the polymer matrix, but also prevented the formation of conductive network. As a result, the MXene/PEN composite film achieved the high dielectric constant of 13.3 (1 kHz) when filling content was 7 wt%, and the dielectric loss was suppressed to 0.042. As the filling content reached 5 wt%, the MXene/PEN composite film had the maximum tensile strength and tensile modulus of 70.9 MPa and 3042.6 MPa, respectively, while maintaining a high elongation at break larger than 6.5%. In addition, the composite film retained the thermal decomposition temperature (T10%) of 460–521°C and the glass transition temperature higher than 149°C. Therefore, this work provides an alternative way to prepare thermally stable and dielectric polymer composite film with high mechanical strength and low dielectric loss, which is essential to the modern electronic applications.