Rapid Response Diagnosis of Multi-stage Assembly Process with Compliant non-ideal Parts using Self-evolving Measurement System

Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis

During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product.

Uncertainty Evaluation in Multistage Assembly Process Based on Enhanced OOPN

This study investigated the uncertainty of the multistage assembly process from the viewpoint of a stream of defects in the product assembly process. The vulnerable spots were analyzed and the fluctuations were controlled during this process. An uncertainty evaluation model was developed for the assembly process on the basis of an object-oriented Petri net (OOPN) by replacing its transition function with a fitted defect changing function. The definition of entropy in physics was applied to characterize the uncertainty of the model in evaluating the assembly process. The uncertainty was then measured as the entropy of the semi-Markov chain, which could be used to calculate the uncertainty of a specific subset of places, as well as the entire process. The OOPN model could correspond to the Markov process because its reachable token can be directly mapped to the Markov process. Using the steady-state probability combined with the uncertainty evaluation, the vulnerable spots in the assembly process were identified and a scanning test program was proposed to improve the quality of the assembly process. Finally, this work analyzed the assembly process on the basis of the uncertainty of the assembly structure and the variables of the assembly process. Finally, the case of a certain product assembly process was analyzed to test the advantages of this method.