Ren W, Xu J, Lian Z, Yu P, Yu H. Modeling and Experimental Study of the Localized Electrochemical Micro Additive Manufacturing Technology Based on the FluidFM.
MATERIALS (BASEL, SWITZERLAND) 2020;
13:E2783. [PMID:
32575589 PMCID:
PMC7345769 DOI:
10.3390/ma13122783]
[Citation(s) in RCA: 6] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 04/17/2020] [Revised: 06/09/2020] [Accepted: 06/17/2020] [Indexed: 12/02/2022]
Abstract
In this work, the localized electrochemical micro additive manufacturing technology based on the FluidFM (fluidic force microscope) has been introduced to fabricate micro three-dimensional overhang metal structures at sub-micron resolution. It breaks through the localized deposition previously achieved by micro-anode precision movement, and the micro-injection of the electrolyte is achieved in a stable electric field distribution. The structure of electrochemical facilities has been designed and optimized. More importantly, the local electrochemical deposition process has been analyzed with positive source diffusion, and the mathematical modeling has been revealed in the particle conversion process. A mathematical model is proposed for the species flux under the action of pulsed pressure in an innovatively localized liquid feeding process. Besides, the linear structure, bulk structure, complex structure, and large-area structure of the additive manufacturing are analyzed separately. The experimental diameter of the deposited cylinder structure is linearly fitted. The aspect ratio of the structure is greater than 20, the surface roughness value is between 0.1-0.2 μm at the surface of bulk structures, and the abilities are verified for deposition of overhang, hollow complex structures. Moreover, this work verifies the feasibility of 3D overhang array submicron structure additive manufacturing, with the application of pulsed pressure. Furthermore, this technology opens new avenues for the direct fabrication of nano circuit interconnection, tiny sensors, and micro antennas.
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