Electrical and mechanical properties of polyimide films treated by plasma formed in water and isopropanol

Prediction and Interpretability Study of the Glass Transition Temperature of Polyimide Based on Machine Learning with Quantitative Structure-Property Relationship (Tg-QSPR)

The glass transition temperature (Tg) is a crucial characteristic of polyimides (PIs). Developing a Tg predictive model using machine learning methodologies can facilitate the design of PI structures and expedite the development process. In this investigation, a data set comprising 1257 PIs was assembled, with Tg values determined using differential scanning calorimetry. 210 molecular descriptors were computed using RDKit, and subsequently, six distinct feature selection methodologies were employed to refine the descriptor set. Quantitative structure-property relationship models targeting Tg (Tg-QSPR) were then constructed using five ensemble learning algorithms and one deep learning algorithm. These models exhibited high predictive accuracy and robustness, with the CATBoost model demonstrating the highest accuracy, achieving a coefficient of determination of 0.823 for the test set, a mean absolute error of 20.1 °C, and a root-mean-square error of 29.0 °C. The study identified the NumRotatableBonds descriptor as particularly influential on Tg, showing a negative correlation with the property. Additionally, the model's accuracy was validated using ten new PI films not included in the original data set, resulting in absolute errors ranging from 2.5 to 26.9 °C and absolute percentage error rates of 1.0-12.8%. These findings underscore the importance of utilizing extensive and diverse data sets for predictive modeling to enhance accuracy and stability. Furthermore, exploring the interpretability of the model and experimentally validating newly synthesized PIs have augmented the practical utility of the model. Under the guidance of the Tg-QSPR models, it will be possible to accelerate the performance prediction and structural design of PIs in the future.

Research Progress and Application of Polyimide-Based Nanocomposites

Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

Synthesis of a Novel Rigid Semi-Alicyclic Dianhydride and Its Copolymerized Transparent Polyimide Films' Properties

A new series of colorless polyimides (CPIs) with outstanding thermal properties and mechanical properties were fabricated by the copolymerization of a novel dianhydride and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 2,2′-bistrifluoromethyl benzidine (TFDB). The novel dianhydride, 10-oxo-9-phenyl-9-(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetraacid dianhydride (3FPODA), possessed a rigid semi-alicyclic structure, –CF₃ and phenyl side groups, and an active carbonyl group. Benefitting from the special structure of 3FPODA, the glass transition temperatures (T_g) of the new CPIs improved from 330 °C to 377 °C, the coefficient of thermal expansion (CTE) decreased from 46 ppm/K to 24 ppm/K, and the tensile strength (T_S), tensile modulus (T_M), and elongation at break (E_B) increased from 84 MPa to 136 MPa, 3.2 GPa to 4.4 GPa, and 2.94% to 4.13% with the increasing amount of 3FPODA, respectively. Moreover, the active carbonyl group of the 3FPODA could enhance the CPI’s adhesive properties. These results render the new dianhydride 3FPODA an ideal candidate monomer for the fabrication of high-performance CPIs.