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Thermal rise during photopolymerization and degree of conversion of bulk fill and conventional resin composites

BACKGROUND

Light curing of resin composite is associated with a thermal rise that may have harmful effect on the health of the vital pulp. In addition, desirable polymerization is important to achieve mechanical properties and clinical function. The purpose of this in-vitro study was to compare the thermal rise under normal dentin during photopolymerization and degree of conversion (DC) of bulk fill and conventional resin composite using continuous high- and soft-start mode.

MATERIALS AND METHODS

In this in-vitro study, Cl I cavities with a dimension of 4 mm × 4 mm × 4 mm and remaining dentin thickness of 1 mm were prepared on 56 extracted human molars. The temperature rise during the light curing of conventional resin composite (Tetric N Ceram, Ivoclar Vivadent) by incremental filling technique and bulk-fill resin composite (Tetric N Ceram Bulk Fill, Ivoclar Vivadent) by bulk-filling technique were measured with a K-type thermocouple wire. DC of both resin composites was measured using Fourier-transform infrared spectroscopy. Data were analyzed using one-way ANOVA, Tamhane and Duncan post hoc, two-way ANOVA at the significance level of α = 0.05.

RESULTS

Photopolymerization temperature rise due to soft start mode and the first layer of conventional composite was higher than continuous high mode and bulk-filling technique, respectively (P < 0.001). DC of conventional resin composite was higher than bulk-fill composite (P < 0.001).

CONCLUSION

Soft-start mode produced higher thermal rise than continuous high mode and conventional resin composite showed higher DC than bulk-fill composite.

Synthesis of fluorinated dimethacrylate monomer and its application in preparing Bis-GMA free dental resin

With the aim to reduce human exposure to Bis-phenol A derivatives, a novel fluorinated dimethacrylate monomer FUDMA was synthesized and mixed with triethyleneglycol dimethacrylate (TEGDMA) to prepare 2,2-bis[4-(2-hydroxy-3-methacryloy- loxypropyl)phenyl]propane (Bis-GMA) free dental resin system. Physicochemical properties, such as double bond conversion (DC), polymerization shrinkage (VS), water sorption (WS) and solubility (SL), flexural strength (FS) and modulus (FM), and fracture energy of FUDMA/TEGDMA resin system were investigated. Bis-GMA/TEGDMA resin system was used as a control. The results showed that, compared with Bis-GMA/TEGDMA resin system, FUDMA/TEGDMA had advantages like higher DC, lower VS, and higher fracture energy, but had no disadvantages. Therefore, FUDMA/TEGDMA resin system had better comprehensive physicochemical properties than Bis-GMA/TEGDMA resin system, and FUDMA had potential to be used as a substitute for Bis-GMA.

Kinetics of pulpal temperature rise during light curing of 6 bonding agents from different generations, using light emitting diode and quartz-tungsten-halogen units: An in-vitro simulation

BACKGROUND

Application of bonding agents (BA) into deep cavities and light curing them might increase pulpal temperature and threaten its health. The purpose of this study was to evaluate temperature rise of pulp by light curing six BA using two different light curing units (LCU), through a dent in wall of 0.5 mm.

MATERIALS AND METHODS

This in vitro experiment was carried out on 96 slices of the same number of human third molars (6 BAs × 2 LCUs × 8 specimens in each group). There were 6 groups of BAs: N Bond, G-Bond, OptiBond XTR, Clearfil SE, Adper Single Bond 2 and V Bond. Each group of BA (n = 16) had two subgroups of light emitting diode (LED) and quartz-tungsten-halogen light cure units (n = 8). Each of these 16 specimens were subjected to light emitting for 20 s, once without any BAs (control) and later when a BA was applied to surface of disk. Temperature rises in 140 s were evaluated. Their mean temperature change in first 20 s were calculated and analyzed using two-way repeated-measures and one-way analysis of variance (ANOVA) and Tukey (α = 0.05). Furthermore rate of temperature increase was calculated for each material and LCU.

RESULTS

Minimum and maximum temperature rises in all subgroups were 1.7 and 2.8°C, respectively. Repeated measures ANOVA showed that both of adhesive and LCU types had significant effect on temperature rise after application of adhesives. Tukey post-hoc analysis showed Clearfil SE showed significantly higher temperature rise in comparison with Adper Single bond 2 (P = 0.047) and N Bond (P = 0.038). Temperature rose in a linear fashion during first 30-40 s and after that it was non-linear.

CONCLUSION

20 s of light curing seems safe for pulpal health (with critical threshold of 5.5°C). However, in longer durations and especially when using LED units, the process should be broken to two sessions.