Comprehensive recovery of Sn-Cu bearing residue and preparation of high purity SnO2 and CuSO4·5H2O

Optimization, Kinetic Studies of Tin Leaching from Waste Printed Circuit Boards and Selective Tin Recovery from Its Pregnant Solution

To protect natural resources and avoid environmental pollution, an effective method is proposed to recover tin (Sn) from waste printed circuit boards (WPCBs). In order to realize the efficient recovery of Sn, it is necessary to study the effects of experimental parameters on Sn leaching and understand the leaching kinetics of leaching processes. The statistical and mathematical technique (response surface methodology (RSM)) was used to study the effects of interactions of experimental parameters on the leaching rate and optimize experimental parameters. Moreover, a comprehensive understanding of the leaching kinetics of Sn in hydrochloric acid solution was obtained. The results show that the maximum Sn leaching rate was 97.6% which was obtained under the following optimal condition: 74.1 °C, 4.94 mol/L HCl, 495.5 rpm, and a solid–liquid ratio of 0.08 g/mL. The leaching mechanism of Sn was controlled by mixed control reaction with an activation energy of 20.3 kJ/mol. A macroscopic kinetic equation was also established, which summarizes the relationships between the experimental parameters and the leaching rates and can predict leaching results. The Sn in pregnant leach solution was recovered as stannic oxide (SnO2) by precipitation-high temperature calcining technique. In this paper, a complete flowsheet for Sn recovery from WPCBs was developed.