Delamination mechanism study of large size waste printed circuit boards by using dimethylacetamide

Life cycle analysis on sequential recovery of copper and gold from waste printed circuit boards

Informal recycling activities of waste printed circuit boards, such as pyrolysis and landfilling, cause severe environmental harm to society. Pyrolysis of resin and polymer fraction leads to the generation of toxic effluents, and landfilling causes the leaching of heavy metals into the groundwater. A sustainable and eco-friendly way to recover base and precious elements will be an economically attractive option. Current research studied the cradle-to-gate environmental impacts of the sequential recovery of copper and gold through delamination, leaching, solvent extraction, electrowinning and cementation from waste printed circuit boards with the help of life cycle assessment.GaBi software was utilized to assess environmental impacts such as global warming, abiotic depletion (fossil), acidification potential and human toxicity potential during the process. Inventory data was collected by conducting several experiments and from optimizing parameters for recycling and separating 4.53 g of copper and 2.25 mg of gold from 16 g of component-free waste printed circuit boards. Results indicate that the chemical pre-treatment or delamination process for separating metal clads from the non-metallic fraction is primarily involved in the impact category. The higher impact during delamination is due to electricity consumption. The proposed study also corroborates the industrial viability of recycling valuable metals from waste printed circuit boards to minimize the environmental impacts. The outcomes of this work could be beneficial in creating the environmental guiding principle for WPCBs recycling plants.

Progress in Chemical Recycling of Carbon Fiber Reinforced Epoxy Composites

Carbon fiber reinforced polymer (CFRP) composites are indispensable in a variety of applications, because of their high specific strength. CFRPs are generally constructed by carbon fibers as reinforcements and crosslinked polymers as binders. Due to the irreversible nature of the crosslinked polymers, CFRPs are neither repairable nor recyclable. Once the material is damaged or out of service, landfill or incineration are the typical ways to deal with the waste. These methods are taking no advantages from the residue value of the waste and adds burdens to the environment. To extend the service life and reduce the waste and cost, it is desirable to develop effective recycling technology to reserve the residue value of carbon fiber and polymer matrix. In the past decade, chemical recycling by cleaving the covalent bonds in a solvent has been considered as an ideal path for the recycling of CFRP wastes and deserves more investigations and attentions, because it has the potential to recover both valuable CFs and polymer matrix. In this review, the discussion is focused on the recent progress on the chemical recycling of CFRP. The primary matrix resin of CFRP discussed in this review is epoxy resin which is the most widely used polymer matrix in industry. In addition, the challenges and outlook are also provided. This article is protected by copyright. All rights reserved.

A review on recent advancements in recovery of valuable and toxic metals from e-waste using bioleaching approach

This review is intent on the environmental pollution generated from printed circuit boards and the methods employed to retrieve valuable and hazardous metals present in the e-wastes. Printed circuit boards are the key components in the electronic devices and considered as huge e-pollutants in polluting our surroundings and the environment as a whole. Composing of toxic heavy metals, it causes serious health effects to the plants, animals and humans in the environment. A number of chemical, biological and physical approaches were carried out to recover the precious metals and to remove the hazardous metals from the environment. Chemical leaching is one of the conventional PCBs recycling methods which was carried out by using different organic solvents and chemicals. Need of high cost for execution, generation of secondary wastes in the conventional methods, forces to discover the advanced recycling methods such as hydrometallurgical, bio-metallurgical and bioleaching processes to retrieve the valuable metals generate through e-wastes. Among them, bioleaching process gain extra priority due to its higher efficiency of metal recovery from printed circuit boards. There are different classes of microorganisms have been utilized for precious metal recovery from the PCBs through bioleaching process such as chemolithoautotrophy, heterotrophy and different fungal species including Aspergillus sp. and Penicillium sp. The current status and scope for further studies in printed circuit boards recycling are discussed in this review.

Assessment of Pre-Treatment Techniques for Coarse Printed Circuit Boards (PCBs) Recycling

Waste electrical and electronic equipment or e-waste generation has been skyrocketing over the last decades. This poses waste management and value recovery challenges, especially in developing countries. Printed circuit boards (PCBs) are mainly employed in value recovery operations. Despite the high energy costs of generating crushed and milled particles of the order of several microns, those are employed in conventional hydrometallurgical techniques. Coarse PCB pieces (of order a few centimetres) based value recovery operations are not reported at the industrial scale as the complexities of the internal structure of PCBs limit efficient metal and non-metal separation. Since coarse PCB particles’ pre-treatment is of paramount importance to enhance metal and non-metal separations, thermal, mechanical, chemical and electrical pre-treatment techniques were extensively studied. It is quite evident that a single pre-treatment technique does not result in complete metal liberation and therefore several pre-treatment flowsheets were formulated for coarse PCB particles. Thermal, mechanical and chemical pre-treatments integrated flowsheets were derived and such flowsheets are seldom reported in the e-waste literature. The potential flowsheets need to be assessed considering socio-techno-economic considerations to yield the best available technologies (BAT). In the wider context, the results of this work could be useful for achieving the United Nations sustainable development goals.

Microwave-assisted organic swelling promotes fast and efficient delamination of waste printed circuit boards

A large amount of waste printed circuit boards (WPCBs) that contain valuable metals, namely gold and copper, are produced annually. WPCBs are constituted by a multi-layer structure reinforced by a brominated epoxy resin (BER), which is very difficult to separate into the metallic and non-metallic components. The main aim of this work was to evaluate the ability of microwave for assisting in the delamination of WPCBs by organic swelling of the BER. Additionally, its performance was compared with other strategies (thermostatic and ultrasonic baths) previously described in the literature. Firstly, a library of solvents [dimethyl formamide (DMF), dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), cyclohexanone (CH), γ-butyrolactone (GBL), tetrahydrofurfuryl alcohol (TFA) and dimethyl malonate (DM)] was selected based on the calculation of Hansen solubility parameters plus others exclusion parameters and their performance to detach all components of WPCBs (25 mm²) was tested by microwave (200 °C for 10 min), thermostatic (153 °C for 10 min) and ultrasonic (60 °C for 25 h) baths. Microwave showed to be the most efficient approach and the delamination order for WPCBs was: NMP > DMSO >DMF > DMAc. Subsequent optimization of key parameters (dimensions of WPCBs and reaction time) were obtained: dimensions of 225 mm² using NMP (solid/liquid ratio of 300 g/L) at 200 °C with 2 cycles of 10 min. In conclusion, microwave-assisted swelling revealed to be more efficient and faster process to delaminate WPCBs into metallic and non-metallic components, which are important advantages when envisaging a future industrial waste management implementation.

Effect of thermal shock process on the microstructure and peel resistance of single-sided copper clad laminates used in waste printed circuit boards

Efficient pre-processing is essential to the mechanical recovery of waste printed circuit boards (WPCBs). In this work, a thermal shock pretreatment was utilized to damage the interface between metals and nonmetals of single-sided copper clad laminates (SSCCLs), which are usually employed as the base material of printed circuit boards (PCBs). The effects of three thermal shock treatment parameters-i.e., peak temperature, holding time, and thermal shock cycle times-on the adhesion strength of SSCCLs were evaluated by orthogonal experiments. Microstructures and peel resistance of SSCCLs before and after thermal shock were characterized by scanning electron microscopy (SEM) and 90° peel test, respectively. Our results showed that the impact of three major factors that influence liberation efficiency was in the sequence of peak temperature > shock cycle times > holding time. Furthermore, the optimal thermal shock level could be achieved when the peak temperature was 300°C with the soaking time of 30 min and three cycle times. In the meantime, the corresponding peel strength of the SSCCLs (0.065 N/mm) was sharply decreased by 94% in comparison with those without thermal shock treatment. The manual dismantling experimental data verified the good feasibility of the optimal thermal shock process, suggesting that the copper foil could be readily dismantled from the substrate by hand after pretreatment, with a successful separation rate of 100% and a peeling efficiency of ~ 30 seconds per piece. Therefore, the optimal thermal shock process could notably improve liberation of metals and nonmetals, which would be helpful for efficient recycling of WPCBs.Implications: The interface between copper foil and laminate dielectric in a PCB can be weakened significantly via efficient thermal shock method. Thus, a good liberation could be achieved after thermal shock. In this work, a manual peeling of copper foil from the SSCCL substrates was achieved efficiently after optimal thermal shock pretreatment, confirming the feasibility of a shorter process of metal recovery from scrap SSCCLs without pulverization. The results will be useful for the pretreatment of recovery of the WPCBs.

A Comprehensive Study on The Accelerated Weathering Properties of Polypropylene-Wood Composites with Non-Metallic Materials of Waste-Printed Circuit Board Powders

In this study, non-metallic materials of waste-printed circuit board powders (WPCBP) were successfully used as reinforcing filler to produce polypropylene (PP)–wood composites, and their effect on the weathering properties of PP composites were fully evaluated via oxidation induction time (OIT), attenuated total reflectance Fourier-transform infrared spectroscopy (ATR-FTIR), differential scanning calorimetry, vicat softening point (VST), scanning electron microscopy, and mechanical properties analysis. The OIT analysis confirmed that the anti-thermal oxidative aging properties of PP–wood composites were decreased with the loading of WPCBP. Apart from that, the PP composite, reinforced with 30 wt.% of WPCBP, exhibited the highest value of active energy, which suggests that it is more sensitive to temperature and oxygen when compared with other PP composites. The mechanical properties analysis revealed that neat PP exhibited the poorest weathering properties after being subjected to UV exposure, and its retention rate of tensile strength and notched impact strength were only 70.6% and 59.6%, respectively, while WPCBP and wood flour (WF) could efficiently improve the retention rates of the mechanical properties of the PP composites when subjected to UV exposure. The visual appearance of the PP composites after being subjected to UV exposure showed more and smaller cracks with the loading of WPCBP and WF. The ATR-FTIR results revealed that the carbonyl index increased for all the weathered samples, and the more WPCBP was added into the PP composites led to a higher carbonyl index value, which might be due to the multivalent transition metals in WPCBP, which accelerate the photo-oxidation of the PP composites. The VST results show that both WPCBP and WF can effectively enhance the heat deformation resistance of the PP composites that have been subjected to UV exposure.

Antimicrobial copper nanoparticles synthesized from waste printed circuit boards using advanced chemical technology

Waste Printed Circuit Boards (WPCBs) were classified as one of the most important resources for urban mining containing high purity Copper (Cu) and other valuable materials. Recently, a dissolution recycling approach enhanced by ultrasonic treatment succeeded in the liberation of Cu foils from WPCBs as received. This research aims to synthesize Copper Nanoparticles (Cu-NPs) from the recovered Cu by using an advanced chemistry approach to obtain nano-product with high added value taking into consideration environmental risks. The experiments were carried out on the Cu foils recovered from the three types of WPCBs with different purity of Cu (Motherboard, Video Card, and Random Access Memory (RAM)). The synthesis process was performed in two stages: (a) preparation of Copper (II) Sulfate aqueous solutions from the recovered Cu and (b) chemical reduction of solutions for synthesis of Cu-NPs by using Native Cyclodextrins (NCDs), particularly ß-NCD as stabilizers. The efficiency of the developed approach for raw material of different purity was assessed and the final yield and the estimated recovery cost of synthesized Cu-NPs were calculated with high accuracy as well as the properties of the synthesized Cu-NPs. The obtained Cu-NPs were examined using SEM-EDS, TEM, XRD, Raman Spectroscopy, and TGA. To maximize the potential biomedical application benefits, the antibacterial activity of Cu-NPs was investigated by the standard microdilution method for E. coli, P. aeruginosa, and S. aureus bacterial cultures. The results showed that the produced Cu-NPs had an average size of 7 nm and yield 90%, while the preparation costs were 6 times lower in comparison to the commercial counterparts. In addition, the results indicated that the synthesized Cu-NPs from RAM sample had a good antimicrobial action.