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For: Huang J, Deng Y, Han Y, Shu J, Wang R, Huang S, Ogunseitan OA, Yu K, Shang M, Liu Y, Li S, Han Y, Cheng Z, Chen M. Toxic footprint and materials profile of electronic components in printed circuit boards. Waste Manag 2022;141:154-162. [PMID: 35123249 DOI: 10.1016/j.wasman.2022.01.019] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/25/2021] [Revised: 12/28/2021] [Accepted: 01/16/2022] [Indexed: 06/14/2023]
Number Cited by Other Article(s)
1
Salinas-Rodríguez E, Hernández-Ávila J, Cerecedo-Sáenz E, Arenas-Flores A, Veloz-Rodríguez MA, Toro N, Gutiérrez-Amador MDP, Acevedo-Sandoval OA. Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate-Oxygen System: A Kinetic Approach. MATERIALS 2022;15:ma15072354. [PMID: 35407686 PMCID: PMC8999890 DOI: 10.3390/ma15072354] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 01/27/2022] [Revised: 03/11/2022] [Accepted: 03/16/2022] [Indexed: 11/16/2022]
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