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For: Alonso C, Pascual M, Abruña H. Influence of organic adsorbates on the under and overpotential deposition of copper on polycrystalline platinum electrodes. Electrochim Acta 1997. [DOI: 10.1016/s0013-4686(96)00374-x] [Citation(s) in RCA: 21] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/27/2022]
Number Cited by Other Article(s)
1
Nakata M, Yasuda T, Miyamoto M, Kitada A, Okazaki Y, Oda R, Murase K, Fukami K. Production of Noble-Metal Nanohelices Based on Nonlinear Dynamics in Electrodeposition of Binary Copper Alloys. NANO LETTERS 2023;23:462-468. [PMID: 36638061 DOI: 10.1021/acs.nanolett.2c03512] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
2
Liu J, Xu Z, Zhu B, Du X, Yang Y, Yi C, Zhang Z, Cai C, Li J. Effects of anions on the underpotential deposition behavior of Cu on polycrystalline Pt. RSC Adv 2018;8:19103-19115. [PMID: 35539687 PMCID: PMC9080622 DOI: 10.1039/c8ra00921j] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/30/2018] [Accepted: 05/07/2018] [Indexed: 11/24/2022]  Open
3
Electrocatalytic behaviour towards oxygen reduction reaction of carbon-supported Pt x M y Au z (M = Ni, Cu, Co) binary and ternary catalysts. Electrochim Acta 2017. [DOI: 10.1016/j.electacta.2017.05.036] [Citation(s) in RCA: 10] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/18/2022]
4
Mandroyan A, Mourad-Mahmoud M, Doche ML, Hihn JY. Effects of ultrasound and temperature on copper electro reduction in Deep Eutectic Solvents (DES). ULTRASONICS SONOCHEMISTRY 2014;21:2010-2019. [PMID: 24629581 DOI: 10.1016/j.ultsonch.2014.02.019] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/11/2013] [Revised: 02/18/2014] [Accepted: 02/19/2014] [Indexed: 06/03/2023]
5
A comparative electrochemical study of electrosorbed 2- and 4-mercaptopyridines and their application as corrosion inhibitors at C60 steel. J CHEM SCI 2009. [DOI: 10.1007/s12039-009-0083-y] [Citation(s) in RCA: 30] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
6
Tsirlina G, Mishina E, Timofeeva E, Tanimura N, Sherstyuk N, Borzenko M, Nakabayashi S, Petrii O. Co-adsorbtion of Cu and Keggin type polytungstates on polycrystalline Pt: interplay of atomic and molecular UPD. Faraday Discuss 2009;140:245-67; discussion 297-317. [PMID: 19213321 DOI: 10.1039/b802556h] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/14/2023]
7
Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum. Electrochim Acta 2009. [DOI: 10.1016/j.electacta.2008.09.052] [Citation(s) in RCA: 51] [Impact Index Per Article: 3.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/22/2022]
8
Alonso C, Salomón A, Abruna H. Electrodeposition of Copper on Pt(111) Pretreated with Organic Adsorbates. Z PHYS CHEM 2002. [DOI: 10.1524/zpch.2002.216.10.1185] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
9
Reduction of Resistivity of Electroplated Copper by Rapid Thermal Annealing. ACTA ACUST UNITED AC 2002. [DOI: 10.1149/1.1477296] [Citation(s) in RCA: 11] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
10
Wetting effect on gap filling submicron damascene by an electrolyte free of levelers. ACTA ACUST UNITED AC 2002. [DOI: 10.1116/1.1486231] [Citation(s) in RCA: 20] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
11
Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitor. ACTA ACUST UNITED AC 2000. [DOI: 10.1116/1.1322042] [Citation(s) in RCA: 33] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
12
Alonso C, Salomón AB, Abruña HD. Influence of Organic Adsorbates on the Under- and Overpotential Deposition of Copper on Gold Electrodes. Z PHYS CHEM 1999. [DOI: 10.1524/zpch.1999.210.part_1.015] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
13
Alonso C, Pascual M, Salomón A, Abruña H, Gutierrez A, López M, García-Alonso M, Escudero M. Cyclic voltammetry and XPS studies of monolayers deposited on gold and platinum electrodes displaced by mercaptopyridines. J Electroanal Chem (Lausanne) 1997. [DOI: 10.1016/s0022-0728(97)00295-7] [Citation(s) in RCA: 22] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
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