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Nakata M, Yasuda T, Miyamoto M, Kitada A, Okazaki Y, Oda R, Murase K, Fukami K. Production of Noble-Metal Nanohelices Based on Nonlinear Dynamics in Electrodeposition of Binary Copper Alloys. NANO LETTERS 2023; 23:462-468. [PMID: 36638061 DOI: 10.1021/acs.nanolett.2c03512] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
Spatiotemporal pattern formation is dynamic self-organization widely observed in nature and drives various functions. Among these functions, chirality plays a central role. The relationship between dynamic self-organization and chirality has been an open question; therefore, the production of chiral nanomaterials by dynamic self-organization has not been achieved. Here, we show that the confinement of a two-dimensional spatiotemporal micropattern via the electrodeposition of a binary Cu alloy into a nanopore induces mirror symmetry breaking to produce a helical nanostructure of the noble-metal component although it is still not yet possible to control the handedness at this stage. This result suggests that spatiotemporal symmetry breaking functions as a mirror symmetry breaking if cylindrical pores are given as the boundary condition. This study can be a model system of how spatiotemporal symmetry breaking plays a role in mirror symmetry breaking, and it proposes a new approach to producing helical nanomaterials through dynamic self-organization.
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Affiliation(s)
- Masahiro Nakata
- Department of Materials Science and Engineering, Kyoto University, Kyoto 606-8501, Japan
| | - Takumi Yasuda
- Department of Materials Science and Engineering, Kyoto University, Kyoto 606-8501, Japan
| | - Masayuki Miyamoto
- Department of Materials Science and Engineering, Kyoto University, Kyoto 606-8501, Japan
| | - Atsushi Kitada
- Department of Materials Science and Engineering, Kyoto University, Kyoto 606-8501, Japan
| | - Yutaka Okazaki
- Graduate School of Energy Science, Kyoto University, Kyoto 606-8501, Japan
| | - Reiko Oda
- University of Bordeaux, CNRS, Bordeaux INP, CBMN, UMR 5248, F-33600 Pessac, France
- Advanced Institute for Materials Research, Tohoku University, Sendai 980-8577, Japan
| | - Kuniaki Murase
- Department of Materials Science and Engineering, Kyoto University, Kyoto 606-8501, Japan
| | - Kazuhiro Fukami
- Department of Materials Science and Engineering, Kyoto University, Kyoto 606-8501, Japan
- Integrated Research Center for Carbon Negative Science, Institute of Advanced Energy, Kyoto University, Kyoto 611-0011, Japan
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Liu J, Xu Z, Zhu B, Du X, Yang Y, Yi C, Zhang Z, Cai C, Li J. Effects of anions on the underpotential deposition behavior of Cu on polycrystalline Pt. RSC Adv 2018; 8:19103-19115. [PMID: 35539687 PMCID: PMC9080622 DOI: 10.1039/c8ra00921j] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/30/2018] [Accepted: 05/07/2018] [Indexed: 11/24/2022] Open
Abstract
The process of Cu underpotential deposition (UPD) on polycrystalline Pt (pc Pt) has been investigated by cyclic voltammetry, chronoamperometry and electrochemical impedance spectroscopy techniques using (bi)sulfate and perchlorate (with/without the addition of a small amount of NaCl) as supporting electrolytes, respectively. The results showed that the adsorption capacity of the anions influences both the reversibility and charge transfer resistance (Rct) of Cu UPD reactions on pc Pt. With a negative shift of the applied potential, Rct of the (bi)sulfate system decreases monotonously, whereas Rct of the perchlorate system (with/without Cl− ions) decreases at first and then increases. Cu UPD on pc Pt follows Langmuir-type adsorption and two-dimensional nucleation/growth mechanisms. The specific adsorption anions ((bi)sulfate and chloride ions) can not only enhance the Cu UPD process by decreasing Rct, but also favor instantaneous 2D nucleation and subsequent grain growth. Finally, the possible deposition mechanisms of the Cu UPD process in the presence of specific adsorption anions were proposed. Effects of anions on underpotential deposition behavior of Cu at polycrystalline Pt has been investigated by cyclic voltammetry, chronoamperometry and electrochemical impedance spectroscopy techniques.![]()
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Affiliation(s)
- Jiao Liu
- College of Chemistry and Chemical Engineering
- Hunan University
- Changsha 410082
- China
- Department of Chemistry
| | - Zhen Xu
- Department of Chemistry
- Zhejiang University
- Hangzhou 310027
- China
| | - Benfeng Zhu
- Department of Chemistry
- Zhejiang University
- Hangzhou 310027
- China
| | - Xiaoqing Du
- Department of Chemistry
- Zhejiang University
- Hangzhou 310027
- China
| | - Yumeng Yang
- Department of Chemistry
- Zhejiang University
- Hangzhou 310027
- China
| | - Chenxi Yi
- Department of Chemistry
- Zhejiang University
- Hangzhou 310027
- China
| | - Zhao Zhang
- Department of Chemistry
- Zhejiang University
- Hangzhou 310027
- China
| | - Chao Cai
- College of Chemistry and Chemical Engineering
- Ningxia University
- Yinchuan 750021
- China
| | - Jianmei Li
- College of Chemistry and Chemical Engineering
- Ningxia University
- Yinchuan 750021
- China
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Electrocatalytic behaviour towards oxygen reduction reaction of carbon-supported Pt x M y Au z (M = Ni, Cu, Co) binary and ternary catalysts. Electrochim Acta 2017. [DOI: 10.1016/j.electacta.2017.05.036] [Citation(s) in RCA: 10] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/18/2022]
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Mandroyan A, Mourad-Mahmoud M, Doche ML, Hihn JY. Effects of ultrasound and temperature on copper electro reduction in Deep Eutectic Solvents (DES). ULTRASONICS SONOCHEMISTRY 2014; 21:2010-2019. [PMID: 24629581 DOI: 10.1016/j.ultsonch.2014.02.019] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/11/2013] [Revised: 02/18/2014] [Accepted: 02/19/2014] [Indexed: 06/03/2023]
Abstract
This paper concerns a preliminary study for a new copper recovery process from ionic solvent. The aim of this work is to study the reduction of copper in Deep Eutectic Solvent (choline chloride-ethylene glycol) and to compare the influence of temperature and the ultrasound effects on kinetic parameters. Solutions were prepared by dissolution of chloride copper salt CuCl2 (to obtain Copper in oxidation degree II) or CuCl (to obtain Copper in oxidation degree I) and by leaching metallic copper directly in DES. The spectrophotometry UV-visible analysis of the leached solution showed that the copper soluble form obtained is at oxidation degree I (Copper I). Both cyclic voltammetry and linear voltammetry were performed in the three solutions at three temperatures (25, 50 and 80°C) and under ultrasonic conditions (F=20kHz, PT=5.8W) to calculate the mass transfer diffusion coefficient kD and the standard rate coefficient k°. These parameters are used to determine that copper reduction is carried out via a mixed kinetic-diffusion control process. Temperature and ultrasound have the same effect on mass transfer for reduction of Cu(II)/Cu(I). On the other hand, temperature is more beneficial than ultrasound for mass transfer of Cu(I)/Cu. Standard rate constant improvement due to temperature increase is of the same order as that obtained with ultrasound. But, by combining higher temperature and ultrasound (F=20kHz, PT=5.6W at 50°C), reduction limiting current is increased by a factor of 10 compared to initial conditions (T=25°C, silent), because ultrasonic stirring is more efficient in lower viscosity fluid. These values can be considered as key-parameters in the design of copper recovery in global processes using ultrasound.
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Affiliation(s)
- Audrey Mandroyan
- Équipe Sonochimie et Réactivité des Surfaces, Institut UTINAM, UMR CNRS 6213, Université de Bourgogne Franche Comté (UFC), 25009 Besançon, France
| | - Mahmoud Mourad-Mahmoud
- Équipe Sonochimie et Réactivité des Surfaces, Institut UTINAM, UMR CNRS 6213, Université de Bourgogne Franche Comté (UFC), 25009 Besançon, France
| | - Marie-Laure Doche
- Équipe Sonochimie et Réactivité des Surfaces, Institut UTINAM, UMR CNRS 6213, Université de Bourgogne Franche Comté (UFC), 25009 Besançon, France
| | - Jean-Yves Hihn
- Équipe Sonochimie et Réactivité des Surfaces, Institut UTINAM, UMR CNRS 6213, Université de Bourgogne Franche Comté (UFC), 25009 Besançon, France.
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A comparative electrochemical study of electrosorbed 2- and 4-mercaptopyridines and their application as corrosion inhibitors at C60 steel. J CHEM SCI 2009. [DOI: 10.1007/s12039-009-0083-y] [Citation(s) in RCA: 30] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
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Tsirlina G, Mishina E, Timofeeva E, Tanimura N, Sherstyuk N, Borzenko M, Nakabayashi S, Petrii O. Co-adsorbtion of Cu and Keggin type polytungstates on polycrystalline Pt: interplay of atomic and molecular UPD. Faraday Discuss 2009; 140:245-67; discussion 297-317. [PMID: 19213321 DOI: 10.1039/b802556h] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/14/2023]
Abstract
Second harmonic generation (SHG), electrochemical quartz microbalance (EQCM), and cyclic voltammetry are applied to clarify the structure and properties of Cu adlayers formed in the presence of Keggin polytungstate anions. For 0.02-10 mM CuSO4 solutions, no pronounced suppression of underpotential copper deposition (Cu UPD) by 0.1-10 mM H3PW12O40 (PW12) or H4SiW12O40 (SiW12) is observed in electrochemical experiments. Moreover, coadsorption with polyanions results in an increase of charge in the Cu UPD region. EQCM data demonstrate high surface coverage with polytungstate in the overall potential range and their pronounced co-adsorption with Cu2+ cations under open circuit. The unusual potential dependence of EQCM response of polytungstates is discovered and discussed in terms of anion interactions with adsorbed hydrogen. The SHG response of Cu UPD demonstrates a non-linear dependence on Cu surface coverage, which is interpreted in terms of discontinuous submonolayers consisting of 2D Cu islands. The additives of PW12 or SiW12 decrease copper SHG response at low and high CuSO4 concentrations, with minor effect for a mid range of concentrations. In all mixed solutions, the potential dependence of the SHG response remains typical for Cu UPD, not for polytungstates. SHG transients measured under potential step mode demonstrate that the initial non-steady-state SHG behavior of the adlayer is more close to the behavior of polytungstates, but typical copper features appear at longer wavelength. These facts favor the hypothesis of Cu adatom penetration through anionic adlayers and formation of a metal submonolayer at the vacant areas between large quasi-spherical polyanions, with subsequent transformation into a Pt/Cu/polytungstate layered structure.
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Affiliation(s)
- Galina Tsirlina
- Department of Electrochemistry, Moscow State University, Leninskie Gory 1-str.3, 119992 Moscow, Russia.
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Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum. Electrochim Acta 2009. [DOI: 10.1016/j.electacta.2008.09.052] [Citation(s) in RCA: 51] [Impact Index Per Article: 3.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/22/2022]
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Alonso C, Salomón A, Abruna H. Electrodeposition of Copper on Pt(111) Pretreated with Organic Adsorbates. Z PHYS CHEM 2002. [DOI: 10.1524/zpch.2002.216.10.1185] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
Abstract
The deposition of copper on Pt(111) has been studied in the underpotential (
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Reduction of Resistivity of Electroplated Copper by Rapid Thermal Annealing. ACTA ACUST UNITED AC 2002. [DOI: 10.1149/1.1477296] [Citation(s) in RCA: 11] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
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10
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Wetting effect on gap filling submicron damascene by an electrolyte free of levelers. ACTA ACUST UNITED AC 2002. [DOI: 10.1116/1.1486231] [Citation(s) in RCA: 20] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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11
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Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitor. ACTA ACUST UNITED AC 2000. [DOI: 10.1116/1.1322042] [Citation(s) in RCA: 33] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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Alonso C, Salomón AB, Abruña HD. Influence of Organic Adsorbates on the Under- and Overpotential Deposition of Copper on Gold Electrodes. Z PHYS CHEM 1999. [DOI: 10.1524/zpch.1999.210.part_1.015] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
Affiliation(s)
| | | | - H. D. Abruña
- * Department of Chemistry, Baker Laboratory, Cornell University, Ithaca, New York 14853-1301
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Alonso C, Pascual M, Salomón A, Abruña H, Gutierrez A, López M, García-Alonso M, Escudero M. Cyclic voltammetry and XPS studies of monolayers deposited on gold and platinum electrodes displaced by mercaptopyridines. J Electroanal Chem (Lausanne) 1997. [DOI: 10.1016/s0022-0728(97)00295-7] [Citation(s) in RCA: 22] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
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