Reference Citation Analysis: Find an Article, Find a Category, Find a Journal, Find a Scholar

Citation(s) in RCA

1
(from Reference Citation Analysis)

Indexed Articles

Ranked By

Results Analysis

Results Analysis

Year Published

Show more Refine

Article Statistics

Refine

Publication Titles

Show more Refine

Category

Show more Refine

For:	Kondo K, Tanaka Z, Monden T. Shape evolution of electrodeposited bumps with additive. Electrochim Acta 1999. [DOI: 10.1016/s0013-4686(99)00072-9] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]

Number	Cited by Other Article(s)
1	Cho SK, Kim JJ. A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication. KOREAN CHEMICAL ENGINEERING RESEARCH 2016. [DOI: 10.9713/kcer.2016.54.1.108] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse

Number

Cited by Other Article(s)

Cho SK, Kim JJ. A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication. KOREAN CHEMICAL ENGINEERING RESEARCH 2016. [DOI: 10.9713/kcer.2016.54.1.108] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022]