Tensile strengths and microscopic analysis of nickel-chromium base metal postceramic solder joints

Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint

PURPOSE

The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy.

MATERIALS AND METHODS

Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope.

RESULTS

Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P < .05).

CONCLUSION

There was no significant difference in ultimate tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

A comparison of infrared- and torch-soldering of Au-Pd and Co-Cr metal-ceramic alloys using a high-fusing solder

PURPOSE

The purpose of this study was to compare the bond strengths and fracture modes of soldered joints formed by infrared and gas-oxygen torch heating of a high-fusing, gold-based solder in two metal-ceramic alloys.

MATERIALS AND METHODS

Pairs of half-dumbbell-shaped specimens of either an Au-Pd or a Co-Cr alloy were positioned with a 0.25-mm gap and were joined using a high-fusing, gold-based solder by either gas-oxygen torch heating or infrared heating. The resulting specimens were subjected to a heat treatment that simulated ceramic firing. Each specimen was fractured in tension at a loading rate of 0.5 cm/min, and its bond strength was measured. The halves of the specimen were rejoined using the other heating method and were heat treated, and the specimen's bond strength was again measured. Fractured cross-sections were examined at a magnification of 40x to determine the following: the fracture mode (adhesive, cohesive, or mixed); the percentage of adhesive fracture; the presence or absence of voids, porosities, or flux inclusions; and the percentage of the cross-section that was discolored.

RESULTS

Three-factor analyses of variance showed that neither the heating method, the particular specimen tested, nor the order of testing significantly affected the bond strength (P < .05). For each alloy, significantly fewer infrared-heated joints than torch-heated joints contained voids, porosities, or flux inclusions visible at 40x (chi 2 test, P < .05). All fractures were either entirely cohesive in the solder or mixed cohesive and adhesive. When infrared heating was used, entirely cohesive fractures occurred more frequently in the Au-Pd alloy specimens than in the Co-Cr alloy specimens (chi 2 test, P < .05). The coefficients of variation of the bond strengths for the infrared-heated joints were smaller than those for the torch-heated joints.

CONCLUSIONS

Although the two heating methods produced solder joints that had strengths that were not significantly different, infrared-heated joints showed less scatter in bond strengths. It was suggested that, in the hands of most technicians, fewer infrared-heated joints would contain defects visible at a magnification of 40x. The presence of such defects may increase the probability of in vivo failure caused by cyclic stresses.

Investigation of stiffness and microstructure of joints soldered with gas-oxygen torch and infrared methods

The stiffness of soldered connectors fabricated with the gas-oxygen torch technique was compared with those fabricated with the infrared technique. Untreated solder materials were used as controls. Untreated solder materials of gold-palladium, palladium-silver, and chromium-cobalt alloys exhibited significantly higher stiffness than the soldered specimens fabricated with either method. There was no significant difference between the gas-oxygen torch and the infrared groups of the gold-palladium and palladium-silver alloys. Photomicrographs revealed that the soldered specimens displayed porosities. For the chromium-cobalt alloy, the infrared group demonstrated significantly higher stiffness than the gas-oxygen torch group. Photomicrographs also disclosed that the chromium-cobalt alloy soldered with the gas-oxygen torch technique had a significant heat-affected zone.

Fatigue strength of a Au-Pd alloy/585 solder combination

The S-N diagram (applied stress vs. cycles to failure) for the gold-palladium alloy/585 solder combination was generated. Au-Pd alloy specimens were cast, prepared for soldering, and joined with 585 solder. After milling and polishing of the joint, testing was carried out in a specially designed machine. This device loaded the cantilevered test specimen in a unidirectional mode at a rate of 70 strokes per minute. The applied tensile stress ranged between 294.2 and 686.5 MPa. Three specimens were cycled for each stress level until fracture occurred. The number of fatigue cycles to failure ranged from one cycle (stress level, 686.5 MPa) to 4.83 x 10(6) cycles (stress level, 294.2 MPa). On a logarithmic scale, the relationship between the applied stress and the number of cycles to failure was linear. Under the present (ideal) experimental conditions, the Au-Pd/585 solder combination behaved favorably on the high-cycle end of the diagram. However, no definite endurance limit could be detected within the stress range examined.