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For: Zhang M, Kang E, Neoh K, Cui C, Lim T. Thermal imidization of poly(amic acid) precursors on glycidyl methacrylate (GMA) graft-polymerized aluminium and copper surfaces. POLYMER 2001. [DOI: 10.1016/s0032-3861(00)00382-7] [Citation(s) in RCA: 10] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022]
Number Cited by Other Article(s)
1
Zhang F, Tuck C, Hague R, He Y, Saleh E, Li Y, Sturgess C, Wildman R. Inkjet printing of polyimide insulators for the 3D printing of dielectric materials for microelectronic applications. J Appl Polym Sci 2016. [DOI: 10.1002/app.43361] [Citation(s) in RCA: 43] [Impact Index Per Article: 5.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/10/2022]
2
Surface modification of polyimide films by an ethylenediamine treatment for a flexible copper clad laminate. Macromol Res 2012. [DOI: 10.1007/s13233-012-0025-2] [Citation(s) in RCA: 12] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022]
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