Residual stress build-up in thermoset films cured below their ultimate glass transition temperature

Effect of Manufacturing on the Transverse Response of Polymer Matrix Composites

The effect of residual stress build-up on the transverse properties of thermoset composites is studied through direct and inverse process modeling approaches. Progressive damage analysis is implemented to characterize composite stiffness and strength of cured composites microstructures. A size effect study is proposed to define the appropriate dimensions of Representative Volume Elements (RVEs). A comparison between periodic (PBCs) and flat (FBCs) boundary conditions during curing is performed on converged RVEs to establish computationally efficient methodologies. Transverse properties are analyzed as a function of the fiber packing through the nearest fiber distance statistical descriptor. A reasonable mechanical equivalence is achieved for RVEs consisting of 40 fibers. It has been found that process-induced residual stresses and fiber packing significantly contribute to the scatter in composites transverse strength. Variation of ±5% in average strength and 18% in standard deviation are observed with respect to ideally cured RVEs that neglect residual stresses. It is established that process modeling is needed to optimize the residual stress state and improve composite performance.

Interfacial Interactions during Demolding in Nanoimprint Lithography

Nanoimprint lithography (NIL) is a useful technique for the fabrication of nano/micro-structured materials. This article reviews NIL in the field of demolding processes and is divided into four parts. The first part introduces the NIL technologies for pattern replication with polymer resists (e.g., thermal and UV-NIL). The second part reviews the process simulation during resist filling and demolding. The third and fourth parts discuss in detail the difficulties in demolding, particularly interfacial forces between mold (template) and resist, during NIL which limit its capability for practical commercial applications. The origins of large demolding forces (adhesion and friction forces), such as differences in the thermal expansion coefficients (CTEs) between the template and the imprinted resist, or volumetric shrinkage of the UV-curable polymer during curing, are also illustrated accordingly. The plausible solutions for easing interfacial interactions and optimizing demolding procedures, including exploring new resist materials, employing imprint mold surface modifications (e.g., ALD-assisted conformal layer covering imprint mold), and finetuning NIL process conditions, are presented. These approaches effectively reduce the interfacial demolding forces and thus lead to a lower defect rate of pattern transfer. The objective of this review is to provide insights to alleviate difficulties in demolding and to meet the stringent requirements regarding defect control for industrial manufacturing while at the same time maximizing the throughput of the nanoimprint technique.

Multiscale characterization and representation of composite materials during processing

Given the importance of residual stresses and dimensional changes in composites manufacturing, process simulation has been the focus of many studies in recent years. Consequently, various constitutive models and simulation approaches have been developed and implemented for composites process simulation. In this paper, various constitutive models, ranging from elastic to nonlinear viscoelastic; and simulation approaches ranging from separated flow/solid phases to multiscale integrated phases are presented and their applicability for process simulation is discussed. Attention has been paid to practical aspects of the problem where the complexity of the model coupled with the complexity and size scaling of the structure increases the characterization and simulation costs. Two specific approaches and their application are presented in detail: the pseudo-viscoelastic cure hardening instantaneously linear elastic (CHILE) and linear viscoelastic (VE). It is shown that CHILE can predict the residual stress formation in simple cure cycles such as the one-hold cycle for HEXCEL AS4/8552 where the material does not devitrify during processing. It is also shown that using this simple approach, the cure cycle can be modified to lower the residual stress level and therefore increase the mechanical performance of the composite laminate. For a more complex cure cycle where the material is devitrified during a post-cure, it is shown that a more complex model such as VE is required. This article is part of the themed issue 'Multiscale modelling of the structural integrity of composite materials'.

Photo-polymerizable, low shrinking modular construction kit with high efficiency based on vinylcyclopropanes

Fast photo-polymerizable modular construction kit for making networks with extremely low shrinkage and varied mechanical properties.

Effects of the furan ring in epoxy resin on the thermomechanical properties of highly cross-linked epoxy networks: a molecular simulation study

Higher van der Waals interactions arising from the furan ring leads to improved thermomechanical properties of a cross-linked epoxy network.

Renaissance for low shrinking resins: all-in-one solution by bi-functional vinylcyclopropane-amides

A low volume shrinking vinylcyclopropane (VCP) monomer, showing both a high reactivity and a low viscosity, was obtained by applying a sterically hindered and isomeric spacer element, incorporating intermolecular amide hydrogen bonds. The resulting properties locate this VCP system in a pronounced range that so far no other efficient and radical polymerizable resin could enter.

A simulation study on the effect of cross-linking agent concentration for defect tolerant demolding in UV nanoimprint lithography

The chemistry and composition of UV-sensitive resists are key factors determining the stress in the molded resist structure in UV nanoimprint lithography (UV-NIL) and thus the success of the process. The stress in the molded structure is mainly generated due to shrinkage of the resist in the UV curing step and also adhesion and friction at the stamp/resist interface in the subsequent demolding step. Thus, understanding of the stress generated in these steps is critical to the improvement of the process as well as the development of new UV resists. In this paper the effect of resist composition on the stress generation was studied by numerical simulations of the curing and demolding steps in UV-NIL. Parameters required for the simulation, such as resist shrinkage, Young's modulus, fracture strength, friction coefficient, crack initiation stress, and debonding energy, were determined experimentally for different resist compositions. As the cross-linking agent concentration increases the fracture strength also improves. In addition, as more cross-linking agent is added to the resist composition, both shrinkage stress due to the curing and also adhesion at the stamp/resist interface increase resulting in a larger maximum local stress experienced by the resist on demolding. By normalizing the overall maximum local stress by the fracture stress of the resist, we found that there is an optimum for the cross-linking agent concentration that leads to the most successful imprinting. Our finding is also corroborated by qualitative experimentations performed for UV-NIL with various resist compositions.

Surface and buried interfacial structures of epoxy resins used as underfills studied by sum frequency generation vibrational spectroscopy

Flip chip technology has greatly improved the performance of semiconductor devices, but relies heavily on the performance of epoxy underfill adhesives. Because epoxy underfills are cured in situ in flip chip semiconductor devices, understanding their surface and interfacial structures is critical for understanding their adhesion to various substrates. Here, sum frequency generation (SFG) vibrational spectroscopy was used to study surface and buried interfacial structures of two model epoxy resins used as underfills in flip chip devices, bisphenol A digylcidyl ether (BADGE) and 1,4-butanediol diglycidyl ether (BDDGE). The surface structures of these epoxies were compared before and after cure, and the orientations of their surface functional groups were deduced to understand how surface structural changes during cure may affect adhesion properties. Further, the effect of moisture exposure, a known cause of adhesion failure, on surface structures was studied. It was found that the BADGE surface significantly restructured upon moisture exposure while the BDDGE surface did not, showing that BADGE adhesives may be more prone to moisture-induced delamination. Lastly, although surface structure can give some insight into adhesion, buried interfacial structures more directly correspond to adhesion properties of polymers. SFG was used to study buried interfaces between deuterated polystyrene (d-PS) and the epoxies before and after moisture exposure. It was shown that moisture exposure acted to disorder the buried interfaces, most likely due to swelling. These results correlated with lap shear adhesion testing showing a decrease in adhesion strength after moisture exposure. The presented work showed that surface and interfacial structures can be correlated to adhesive strength and may be helpful in understanding and designing optimized epoxy underfill adhesives.