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Wang Y, Collinson DW, Kwon H, Miller RD, Lionti K, Goodson KE, Dauskardt RH. Linking Interfacial Bonding and Thermal Conductivity in Molecularly-Confined Polymer-Glass Nanocomposites with Ultra-High Interfacial Density. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2023:e2301383. [PMID: 36971287 DOI: 10.1002/smll.202301383] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/24/2023] [Indexed: 06/18/2023]
Abstract
Thermal transport in polymer nanocomposites becomes dependent on the interfacial thermal conductance due to the ultra-high density of the internal interfaces when the polymer and filler domains are intimately mixed at the nanoscale. However, there is a lack of experimental measurements that can link the thermal conductance across the interfaces to the chemistry and bonding between the polymer molecules and the glass surface. Characterizing the thermal properties of amorphous composites are a particular challenge as their low intrinsic thermal conductivity leads to poor measurement sensitivity of the interfacial thermal conductance. To address this issue here, polymers are confined in porous organosilicates with high interfacial densities, stable composite structure, and varying surface chemistries. The thermal conductivities and fracture energies of the composites are measured with frequency dependent time-domain thermoreflectance (TDTR) and thin-film fracture testing, respectively. Effective medium theory (EMT) along with finite element analysis (FEA) is then used to uniquely extract the thermal boundary conductance (TBC) from the measured thermal conductivity of the composites. Changes in TBC are then linked to the hydrogen bonding between the polymer and organosilicate as quantified by Fourier-transform infrared (FTIR) and X-ray photoelectron (XPS) spectroscopy. This platform for analysis is a new paradigm in the experimental investigation of heat flow across constituent domains.
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Affiliation(s)
- Yang Wang
- Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA
| | - David W Collinson
- Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA
| | - Heungdong Kwon
- Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
| | - Robert D Miller
- Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA
| | - Krystelle Lionti
- Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA
- Hybrid Polymeric Materials, IBM Almaden Research Center, San Jose, CA, USA
| | - Kenneth E Goodson
- Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA
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Mineral Composition Impact on the Thermal Conductivity of Granites Based on Geothermal Field Experiments in the Songliao and Gonghe Basins, China. MINERALS 2022. [DOI: 10.3390/min12020247] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/25/2023]
Abstract
Accurate estimation of thermal conductivity of rocks is of paramount importance for projects such as the development of hot dry rock and the geological storage of nuclear waste. In this paper, 30 granite samples from the Songliao and Gonghe Basins in China were tested by X-ray diffraction, polarizing microscope, and Thermal Conductivity Scanning (TCS) measurements. Different mineral contents determine the thermal conductivity of the rock as a whole. The geometric average model and the harmonic average model have great limitations. Combined with the above two models, a new model is proposed for estimating the thermal conductivity, and results are less different from the measured values and have universal applicability. The relative estimation error on the thermal conductivity calculated by mineral composition is significantly reduced. The accuracy of thermal conductivity calculation can be improved by mineral composition.
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Zhang C, Palko JW, Rong G, Pringle KS, Barako MT, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring Permeability of Microporous Copper Structures through Template Sintering. ACS APPLIED MATERIALS & INTERFACES 2018; 10:30487-30494. [PMID: 30096232 DOI: 10.1021/acsami.8b03774] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/08/2023]
Abstract
Microporous metals are used extensively for applications that combine convective and conductive transport and benefit from low resistance to both modes of transport. Conventional fabrication methods, such as direct sintering of metallic particles, however, often produce structures with limited fluid transport properties due to the lack of control over pore morphologies such as the pore size and porosity. Here, we demonstrate control and improvement of hydraulic permeability of microporous copper structures fabricated using template-assisted electrodeposition. Template sintering is shown to modify the fluid transport network in a manner that increases permeability by nearly an order of magnitude with a less significant decrease (∼38%) in thermal conductivity. The measured permeabilities range from 4.8 × 10-14 to 1.3 × 10-12 m2 with 5 μm pores, with the peak value being roughly 5 times larger than the published values for sintered copper particles of comparable feature sizes. Analysis indicates that the enhancement of permeability is limited by constrictions, i.e., bottlenecks between connecting pores, whose dimensions are highly sensitive to the sintering conditions. We further show contrasting trends in permeability versus conductivity of the electrodeposited microporous copper and conventional sintered copper particles and suggest these differing trends to be the result of their inverse structural relationship.
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Affiliation(s)
- Chi Zhang
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
| | - James W Palko
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
- Department of Mechanical Engineering , University of California-Merced , Merced , California 95340 , United States
| | - Guoguang Rong
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
| | - Kenneth S Pringle
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
| | - Michael T Barako
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
- NG Next Basic Research Laboratory , Northrop Grumman Corporation , Redondo Beach , California 90278 , United States
| | - Thomas J Dusseault
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
| | - Mehdi Asheghi
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
| | - Juan G Santiago
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
| | - Kenneth E Goodson
- Department of Mechanical Engineering , Stanford University , Stanford , California 94305 , United States
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Barako MT, Isaacson SG, Lian F, Pop E, Dauskardt RH, Goodson KE, Tice J. Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials. ACS APPLIED MATERIALS & INTERFACES 2017; 9:42067-42074. [PMID: 29119783 DOI: 10.1021/acsami.7b12313] [Citation(s) in RCA: 20] [Impact Index Per Article: 2.9] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/28/2023]
Abstract
Thermal interface materials (TIMs) are essential for managing heat in modern electronics, and nanocomposite TIMs can offer critical improvements. Here, we demonstrate thermally conductive, mechanically compliant TIMs based on dense, vertically aligned copper nanowires (CuNWs) embedded into polymer matrices. We evaluate the thermal and mechanical characteristics of 20-25% dense CuNW arrays with and without polydimethylsiloxane infiltration. The thermal resistance achieved is below 5 mm2 K W-1, over an order of magnitude lower than commercial heat sink compounds. Nanoindentation reveals that the nonlinear deformation mechanics of this TIM are influenced by both the CuNW morphology and the polymer matrix. We also implement a flip-chip bonding protocol to directly attach CuNW composites to copper surfaces, as required in many thermal architectures. Thus, we demonstrate a rational design strategy for nanocomposite TIMs that simultaneously retain the high thermal conductivity of aligned CuNWs and the mechanical compliance of a polymer.
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Affiliation(s)
- Michael T Barako
- NG Next, Northrop Grumman Corporation , One Space Park, Redondo Beach, California 90278, United States
- Stanford University , Stanford, California 94305, United States
| | | | - Feifei Lian
- NG Next, Northrop Grumman Corporation , One Space Park, Redondo Beach, California 90278, United States
- Stanford University , Stanford, California 94305, United States
| | - Eric Pop
- Stanford University , Stanford, California 94305, United States
| | | | | | - Jesse Tice
- NG Next, Northrop Grumman Corporation , One Space Park, Redondo Beach, California 90278, United States
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Barako MT, Sood A, Zhang C, Wang J, Kodama T, Asheghi M, Zheng X, Braun PV, Goodson KE. Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. NANO LETTERS 2016; 16:2754-2761. [PMID: 26986050 DOI: 10.1021/acs.nanolett.6b00468] [Citation(s) in RCA: 32] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/05/2023]
Abstract
Porous metals are used in interfacial transport applications that leverage the combination of electrical and/or thermal conductivity and the large available surface area. As nanomaterials push toward smaller pore sizes to increase the total surface area and reduce diffusion length scales, electron conduction within the metal scaffold becomes suppressed due to increased surface scattering. Here we observe the transition from diffusive to quasi-ballistic thermal conduction using metal inverse opals (IOs), which are metal films that contain a periodic arrangement of interconnected spherical pores. As the material dimensions are reduced from ∼230 nm to ∼23 nm, the thermal conductivity of copper IOs is reduced by more than 57% due to the increase in surface scattering. In contrast, nickel IOs exhibit diffusive-like conduction and have a constant thermal conductivity over this size regime. The quasi-ballistic nature of electron transport at these length scales is modeled considering the inverse opal geometry, surface scattering, and grain boundaries. Understanding the characteristics of electron conduction at the nanoscale is essential to minimizing the total resistance of porous metals for interfacial transport applications, such as the total electrical resistance of battery electrodes and the total thermal resistance of microscale heat exchangers.
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Affiliation(s)
| | | | | | - Junjie Wang
- Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign , Urbana, Illinois 61801, United States
| | | | | | | | - Paul V Braun
- Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign , Urbana, Illinois 61801, United States
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Multi-sphere Unit Cell model to calculate the effective thermal conductivity in packed pebble beds of mono-sized spheres. NUCLEAR ENGINEERING AND DESIGN 2012. [DOI: 10.1016/j.nucengdes.2012.03.012] [Citation(s) in RCA: 74] [Impact Index Per Article: 6.2] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/20/2022]
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Zamel N, Li X, Shen J, Becker J, Wiegmann A. Estimating effective thermal conductivity in carbon paper diffusion media. Chem Eng Sci 2010. [DOI: 10.1016/j.ces.2010.03.047] [Citation(s) in RCA: 78] [Impact Index Per Article: 5.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
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van Antwerpen W, du Toit C, Rousseau P. A review of correlations to model the packing structure and effective thermal conductivity in packed beds of mono-sized spherical particles. NUCLEAR ENGINEERING AND DESIGN 2010. [DOI: 10.1016/j.nucengdes.2010.03.009] [Citation(s) in RCA: 262] [Impact Index Per Article: 18.7] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
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